SG10202001467SA - Polishing device, polishing method, and recording medium for recording program for detemining supply position of polishing liquid - Google Patents

Polishing device, polishing method, and recording medium for recording program for detemining supply position of polishing liquid

Info

Publication number
SG10202001467SA
SG10202001467SA SG10202001467SA SG10202001467SA SG10202001467SA SG 10202001467S A SG10202001467S A SG 10202001467SA SG 10202001467S A SG10202001467S A SG 10202001467SA SG 10202001467S A SG10202001467S A SG 10202001467SA SG 10202001467S A SG10202001467S A SG 10202001467SA
Authority
SG
Singapore
Prior art keywords
polishing
detemining
supply position
recording medium
recording
Prior art date
Application number
SG10202001467SA
Inventor
Itsuki Kobata
Takashi Yamazaki
Ryuichi Kosuge
Tadakazu Sone
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Publication of SG10202001467SA publication Critical patent/SG10202001467SA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
    • B24B55/02—Equipment for cooling the grinding surfaces, e.g. devices for feeding coolant
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D13/00—Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor
    • B24D13/14—Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor acting by the front face
    • B24D13/147—Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor acting by the front face comprising assemblies of felted or spongy material; comprising pads surrounded by a flexible material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D13/00—Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor
    • B24D13/20—Mountings for the wheels

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
SG10202001467SA 2019-02-21 2020-02-19 Polishing device, polishing method, and recording medium for recording program for detemining supply position of polishing liquid SG10202001467SA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2019029543A JP7145098B2 (en) 2019-02-21 2019-02-21 A recording medium recording a polishing apparatus, a polishing method, and a polishing liquid supply position determination program

Publications (1)

Publication Number Publication Date
SG10202001467SA true SG10202001467SA (en) 2020-09-29

Family

ID=72141328

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10202001467SA SG10202001467SA (en) 2019-02-21 2020-02-19 Polishing device, polishing method, and recording medium for recording program for detemining supply position of polishing liquid

Country Status (3)

Country Link
US (1) US11980998B2 (en)
JP (1) JP7145098B2 (en)
SG (1) SG10202001467SA (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2022108789A (en) * 2021-01-14 2022-07-27 株式会社荏原製作所 Polishing device, polishing method, and method for outputting visualized information on film thickness distribution of base plate
CN112959223A (en) * 2021-02-22 2021-06-15 长江存储科技有限责任公司 Chemical mechanical polishing apparatus and chemical mechanical polishing method
CN113977458B (en) * 2021-11-25 2022-12-02 中国计量科学研究院 Polishing solution injection device and polishing system

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1034535A (en) * 1996-07-24 1998-02-10 Sony Corp Method and device for polishing
JP2003001559A (en) 2001-06-21 2003-01-08 Mitsubishi Electric Corp Chemical mechanical polishing method, chemical mechanical polishing apparatus and slurry supplying apparatus
JP4876345B2 (en) * 2001-08-22 2012-02-15 株式会社ニコン Simulation method and apparatus, and polishing method and apparatus using the same
US6821895B2 (en) 2003-02-20 2004-11-23 Taiwan Semiconductor Manufacturing Co., Ltd Dynamically adjustable slurry feed arm for wafer edge profile improvement in CMP
US20060027533A1 (en) * 2004-08-06 2006-02-09 Yaojian Leng System for dynamic slurry delivery in a CMP process
JP2006147773A (en) 2004-11-18 2006-06-08 Ebara Corp Polishing apparatus and polishing method
JP4943800B2 (en) 2006-10-06 2012-05-30 ニッタ・ハース株式会社 Polishing status monitor system
JP2014050955A (en) * 2009-04-01 2014-03-20 Ebara Corp Polishing device and polishing method
US8360817B2 (en) * 2009-04-01 2013-01-29 Ebara Corporation Polishing apparatus and polishing method
JP5236561B2 (en) * 2009-04-14 2013-07-17 株式会社荏原製作所 Polishing apparatus and polishing method

Also Published As

Publication number Publication date
US11980998B2 (en) 2024-05-14
JP2020131381A (en) 2020-08-31
US20200269385A1 (en) 2020-08-27
JP7145098B2 (en) 2022-09-30

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