SG10201913153XA - Leak tolerant liquid cooling system employing improved air purging mechanism - Google Patents

Leak tolerant liquid cooling system employing improved air purging mechanism

Info

Publication number
SG10201913153XA
SG10201913153XA SG10201913153XA SG10201913153XA SG10201913153XA SG 10201913153X A SG10201913153X A SG 10201913153XA SG 10201913153X A SG10201913153X A SG 10201913153XA SG 10201913153X A SG10201913153X A SG 10201913153XA SG 10201913153X A SG10201913153X A SG 10201913153XA
Authority
SG
Singapore
Prior art keywords
cooling system
liquid cooling
system employing
improved air
air purging
Prior art date
Application number
SG10201913153XA
Inventor
Jerry Ihor Tustaniwskyj
Original Assignee
Delta Design Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Delta Design Inc filed Critical Delta Design Inc
Publication of SG10201913153XA publication Critical patent/SG10201913153XA/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67109—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/02—Details
    • H05K5/0209—Thermal insulation, e.g. for fire protection or for fire containment or for high temperature environments
    • H05K5/0211—Thermal buffers, e.g. latent heat absorbers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20272—Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)
SG10201913153XA 2015-06-26 2016-06-24 Leak tolerant liquid cooling system employing improved air purging mechanism SG10201913153XA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US201562185250P 2015-06-26 2015-06-26

Publications (1)

Publication Number Publication Date
SG10201913153XA true SG10201913153XA (en) 2020-03-30

Family

ID=56409688

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201913153XA SG10201913153XA (en) 2015-06-26 2016-06-24 Leak tolerant liquid cooling system employing improved air purging mechanism

Country Status (9)

Country Link
US (1) US10770317B2 (en)
EP (1) EP3314993A1 (en)
JP (1) JP6756824B2 (en)
KR (1) KR102512829B1 (en)
CN (1) CN107852841B (en)
MY (1) MY190945A (en)
SG (1) SG10201913153XA (en)
TW (1) TWI687639B (en)
WO (1) WO2016210222A1 (en)

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JP6461361B2 (en) * 2015-09-14 2019-01-30 三菱電機株式会社 Cooler, power conversion device, and cooling system
US20160205810A1 (en) * 2016-03-21 2016-07-14 Sam A Marshall Inherently leak free liquid cooling of equipment
CN109757060B (en) * 2017-11-03 2020-11-24 阿里巴巴集团控股有限公司 Cooling device
WO2019094604A1 (en) * 2017-11-08 2019-05-16 Delta Design, Inc. System and method for liquid nitrogen recycling
TWI694240B (en) * 2017-12-15 2020-05-21 雙鴻科技股份有限公司 Coolant distribution unit
TWI688326B (en) * 2018-01-17 2020-03-11 緯創資通股份有限公司 Coolant replenishment assembly, cooling cycle system, and electronic device
US10694640B2 (en) * 2018-01-30 2020-06-23 Quanta Computer Inc. Server water cooling modules prevent water leakage device
US11378340B2 (en) * 2018-06-21 2022-07-05 The Boeing Company Heat transfer devices and methods of cooling heat sources
KR102135513B1 (en) * 2018-11-28 2020-07-17 주식회사 우진산전 Fan control apparatus for power conversion device of a railway vehicle
US11284535B2 (en) * 2019-08-30 2022-03-22 Hewlett Packard Enterprise Development Lp Leak mitigation in a cooling system for computing devices
US11642933B2 (en) * 2020-06-24 2023-05-09 Honda Motor Co., Ltd. Heat transfer system for a vehicle
US11991858B2 (en) * 2021-02-17 2024-05-21 Microsoft Technology Licensing, Llc Two phase coolant management
CN115031560A (en) * 2022-04-28 2022-09-09 哈尔滨工业大学 Sweeping type gas-heat common storage device and heat exchange system
TWI816465B (en) * 2022-07-08 2023-09-21 緯穎科技服務股份有限公司 Immersion cooling system

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US3620297A (en) * 1969-12-12 1971-11-16 Orville Adkins Cooling system
US4698728A (en) * 1986-10-14 1987-10-06 Unisys Corporation Leak tolerant liquid cooling system
US4967832A (en) * 1989-12-27 1990-11-06 Nrc Corporation Cooling method and apparatus for integrated circuit chips
US5048599A (en) * 1990-10-11 1991-09-17 Unisys Corporation Leak tolerant liquid cooling system employing an improved air purging mechanism
US5821505A (en) 1997-04-04 1998-10-13 Unisys Corporation Temperature control system for an electronic device which achieves a quick response by interposing a heater between the device and a heat sink
KR100465088B1 (en) * 2002-02-08 2005-01-06 쿨랜스코리아 주식회사 The water cooling system for electronic device
US9236639B2 (en) * 2003-12-18 2016-01-12 GM Global Technology Operations LLC Thermoelectric methods to control temperature of batteries
US7401644B2 (en) * 2004-03-26 2008-07-22 Hewlett-Packard Development Company, L.P. Computer systems and related methods for cooling such systems
US20070193721A1 (en) * 2006-02-21 2007-08-23 Tilton Donald E Automated Venting and Refilling of Multiple Liquid Cooling Systems
US7508665B1 (en) * 2006-10-18 2009-03-24 Isothermal Systems Research, Inc. Server farm liquid thermal management system
US9043035B2 (en) * 2011-11-29 2015-05-26 International Business Machines Corporation Dynamically limiting energy consumed by cooling apparatus
US9167721B2 (en) * 2011-11-29 2015-10-20 International Business Machines Corporation Direct facility coolant cooling of a rack-mounted heat exchanger
US9546348B2 (en) * 2012-11-28 2017-01-17 Demon Brewing Company, Inc. Conical brewing device with nesting supporting member
CN103157345B (en) 2013-03-07 2015-04-29 西安交通大学 Oil circulation gas purification apparatus based on molecule intermiscibility and purification method
CN103594136B (en) 2013-11-26 2016-01-20 清华大学 A kind of high temperature gas cooled reactor coolant cleanup system and purification method
US9385644B2 (en) * 2014-08-29 2016-07-05 Atieva, Inc. Sensorless DC fan speed controller
CN104703444B (en) * 2015-03-19 2018-08-28 合肥天鹅制冷科技有限公司 Level pressure, fluid infusion and the exhaust apparatus of enclosed liquid cooling system

Also Published As

Publication number Publication date
KR20180021381A (en) 2018-03-02
JP2018522427A (en) 2018-08-09
TW201708782A (en) 2017-03-01
CN107852841B (en) 2020-02-21
US20160379852A1 (en) 2016-12-29
US10770317B2 (en) 2020-09-08
WO2016210222A1 (en) 2016-12-29
JP6756824B2 (en) 2020-09-16
TWI687639B (en) 2020-03-11
CN107852841A (en) 2018-03-27
EP3314993A1 (en) 2018-05-02
KR102512829B1 (en) 2023-03-23
MY190945A (en) 2022-05-23

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