SG10201907284YA - Substrate Rotation Device, Substrate Cleaning Device, Substrate Processing Device, And Control Method For Substrate Rotation Device - Google Patents
Substrate Rotation Device, Substrate Cleaning Device, Substrate Processing Device, And Control Method For Substrate Rotation DeviceInfo
- Publication number
- SG10201907284YA SG10201907284YA SG10201907284YA SG10201907284YA SG10201907284YA SG 10201907284Y A SG10201907284Y A SG 10201907284YA SG 10201907284Y A SG10201907284Y A SG 10201907284YA SG 10201907284Y A SG10201907284Y A SG 10201907284YA SG 10201907284Y A SG10201907284Y A SG 10201907284YA
- Authority
- SG
- Singapore
- Prior art keywords
- substrate
- rotation device
- control method
- substrate rotation
- processing device
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/005—Control means for lapping machines or devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
- B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16C—SHAFTS; FLEXIBLE SHAFTS; ELEMENTS OR CRANKSHAFT MECHANISMS; ROTARY BODIES OTHER THAN GEARING ELEMENTS; BEARINGS
- F16C32/00—Bearings not otherwise provided for
- F16C32/04—Bearings not otherwise provided for using magnetic or electric supporting means
- F16C32/0406—Magnetic bearings
- F16C32/044—Active magnetic bearings
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16C—SHAFTS; FLEXIBLE SHAFTS; ELEMENTS OR CRANKSHAFT MECHANISMS; ROTARY BODIES OTHER THAN GEARING ELEMENTS; BEARINGS
- F16C32/00—Bearings not otherwise provided for
- F16C32/04—Bearings not otherwise provided for using magnetic or electric supporting means
- F16C32/0406—Magnetic bearings
- F16C32/044—Active magnetic bearings
- F16C32/0474—Active magnetic bearings for rotary movement
- F16C32/048—Active magnetic bearings for rotary movement with active support of two degrees of freedom, e.g. radial magnetic bearings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68792—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the construction of the shaft
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16C—SHAFTS; FLEXIBLE SHAFTS; ELEMENTS OR CRANKSHAFT MECHANISMS; ROTARY BODIES OTHER THAN GEARING ELEMENTS; BEARINGS
- F16C2322/00—Apparatus used in shaping articles
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16C—SHAFTS; FLEXIBLE SHAFTS; ELEMENTS OR CRANKSHAFT MECHANISMS; ROTARY BODIES OTHER THAN GEARING ELEMENTS; BEARINGS
- F16C32/00—Bearings not otherwise provided for
- F16C32/04—Bearings not otherwise provided for using magnetic or electric supporting means
- F16C32/0406—Magnetic bearings
- F16C32/044—Active magnetic bearings
- F16C32/0459—Details of the magnetic circuit
- F16C32/0461—Details of the magnetic circuit of stationary parts of the magnetic circuit
- F16C32/0463—Details of the magnetic circuit of stationary parts of the magnetic circuit with electromagnetic bias, e.g. by extra bias windings
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16C—SHAFTS; FLEXIBLE SHAFTS; ELEMENTS OR CRANKSHAFT MECHANISMS; ROTARY BODIES OTHER THAN GEARING ELEMENTS; BEARINGS
- F16C39/00—Relieving load on bearings
- F16C39/02—Relieving load on bearings using mechanical means
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018151378A JP7055720B2 (en) | 2018-08-10 | 2018-08-10 | Control method for board rotating device, board cleaning device, board processing device, and board rotating device |
Publications (1)
Publication Number | Publication Date |
---|---|
SG10201907284YA true SG10201907284YA (en) | 2020-03-30 |
Family
ID=69405456
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG10201907284YA SG10201907284YA (en) | 2018-08-10 | 2019-08-07 | Substrate Rotation Device, Substrate Cleaning Device, Substrate Processing Device, And Control Method For Substrate Rotation Device |
Country Status (6)
Country | Link |
---|---|
US (1) | US11731241B2 (en) |
JP (1) | JP7055720B2 (en) |
KR (1) | KR20200018317A (en) |
CN (1) | CN110828335A (en) |
SG (1) | SG10201907284YA (en) |
TW (1) | TWI830757B (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20230091506A (en) * | 2021-12-16 | 2023-06-23 | 에이피시스템 주식회사 | Magnetic levitation rotating apparatus and aparatus for processing substrate using the same |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2887408B2 (en) * | 1990-08-10 | 1999-04-26 | 株式会社荏原製作所 | Wafer cleaning equipment |
JPH07169732A (en) | 1993-12-13 | 1995-07-04 | Ebara Corp | Wafer cleaning device |
JP2001524259A (en) * | 1995-07-10 | 2001-11-27 | シーヴィシー、プラダクツ、インク | Programmable ultra-clean electromagnetic substrate rotating apparatus and method for microelectronics manufacturing equipment |
JPH0931656A (en) * | 1995-07-24 | 1997-02-04 | Ebara Corp | Thin film vapor growth apparatus |
KR100277522B1 (en) * | 1996-10-08 | 2001-01-15 | 이시다 아키라 | Substrate Processing Equipment |
JP3923696B2 (en) * | 1999-07-19 | 2007-06-06 | 株式会社荏原製作所 | Substrate rotating device |
US6213855B1 (en) * | 1999-07-26 | 2001-04-10 | Speedfam-Ipec Corporation | Self-powered carrier for polishing or planarizing wafers |
JP2001304258A (en) | 2000-04-26 | 2001-10-31 | Ebara Corp | Magnetic bearing and magnetic levitation device |
JP2004342939A (en) * | 2003-05-16 | 2004-12-02 | Shimada Phys & Chem Ind Co Ltd | Substrate processing equipment |
KR101510269B1 (en) * | 2008-07-28 | 2015-04-14 | 주성엔지니어링(주) | Substrate processing equipment and method for forming thin film using the same |
KR101017654B1 (en) * | 2008-11-26 | 2011-02-25 | 세메스 주식회사 | Substrate chucking member, substrate processing apparatus having the same and method of processing substrate using the same |
JP6113960B2 (en) * | 2012-02-21 | 2017-04-12 | 株式会社荏原製作所 | Substrate processing apparatus and substrate processing method |
JP5680699B2 (en) | 2013-04-25 | 2015-03-04 | 株式会社Screenホールディングス | Substrate cleaning method and substrate cleaning apparatus |
JP6143572B2 (en) * | 2013-06-18 | 2017-06-07 | 株式会社Screenホールディングス | Substrate holding and rotating apparatus, substrate processing apparatus including the same, and substrate processing method |
JP6292934B2 (en) * | 2014-03-26 | 2018-03-14 | 株式会社Screenホールディングス | Substrate processing equipment |
JP6503194B2 (en) * | 2015-02-16 | 2019-04-17 | 株式会社Screenホールディングス | Substrate processing equipment |
JP6674679B2 (en) * | 2015-09-29 | 2020-04-01 | 株式会社Screenホールディングス | Substrate holding / rotating apparatus, substrate processing apparatus having the same, and substrate processing method |
JP6660202B2 (en) * | 2016-02-19 | 2020-03-11 | 株式会社Screenホールディングス | Substrate processing apparatus and substrate processing method |
JP6706162B2 (en) | 2016-06-27 | 2020-06-03 | 株式会社荏原製作所 | Substrate cleaning apparatus and substrate cleaning method |
JP6706564B2 (en) * | 2016-09-23 | 2020-06-10 | 株式会社Screenホールディングス | Substrate processing apparatus and substrate processing method |
-
2018
- 2018-08-10 JP JP2018151378A patent/JP7055720B2/en active Active
-
2019
- 2019-07-23 TW TW108126008A patent/TWI830757B/en active
- 2019-08-07 SG SG10201907284YA patent/SG10201907284YA/en unknown
- 2019-08-08 KR KR1020190096698A patent/KR20200018317A/en active IP Right Grant
- 2019-08-08 US US16/535,325 patent/US11731241B2/en active Active
- 2019-08-09 CN CN201910733030.6A patent/CN110828335A/en active Pending
Also Published As
Publication number | Publication date |
---|---|
JP7055720B2 (en) | 2022-04-18 |
US20200047310A1 (en) | 2020-02-13 |
TW202021032A (en) | 2020-06-01 |
US11731241B2 (en) | 2023-08-22 |
KR20200018317A (en) | 2020-02-19 |
JP2020027849A (en) | 2020-02-20 |
TWI830757B (en) | 2024-02-01 |
CN110828335A (en) | 2020-02-21 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
EP3654294A4 (en) | Image processing device, image processing method for image processing device, and program | |
EP3787285A4 (en) | Image processing device, image processing method, and program | |
SG10201601095UA (en) | Substrate cleaning apparatus, substrate cleaning method, and substrate processing apparatus | |
EP3640936A4 (en) | Apparatus control device, method, and apparatus having same | |
EP3437542A4 (en) | Image processing device, operation method for image processing device, and image processing program | |
EP3686864A4 (en) | Information processing device, autonomous moving apparatus, method, and program | |
EP3282475A4 (en) | Substrate holding method, substrate holding device, processing method and processing device | |
SG10201911998QA (en) | Substrate processing method and substrate processing apparatus | |
EP3258763A4 (en) | Mounting processing unit, mounting device, and control method for mounting processing unit | |
EP3675703A4 (en) | Moving apparatus for cleaning and control method thereof | |
EP3883286A4 (en) | Data processing method, controller and forwarding device | |
EP3872840A4 (en) | Substrate processing device and substrate processing method | |
SG10201700932TA (en) | Water discharge system, water discharge method, water discharge control apparatus, water discharge control method, substrate processing apparatus and water discharge control program | |
EP3733575A4 (en) | Substrate processing device and substrate processing method | |
EP3584699A4 (en) | Method and device for controlling fingerprint processing resources | |
EP3859657A4 (en) | Image processing device, image processing method, and program | |
EP3820149A4 (en) | Image processing device, image processing method and program | |
EP3587033A4 (en) | Surface treatment processing method and surface treatment processing device | |
EP3854306A4 (en) | Image processing device, image processing method, and image processing program | |
EP3306474A4 (en) | Clock task processing method, apparatus and device | |
EP3793191A4 (en) | Image processing device, moving machine, and method, and program | |
SG11202000620SA (en) | Substrate treatment apparatus, method for manufacturing semiconductor device, and program | |
EP3642386A4 (en) | Substrate processing apparatus and method | |
SG11202105091PA (en) | Cleaning module, substrate processing apparatus including cleaning module, and cleaning method | |
TWI800660B (en) | Substrate processing device and substrate processing method |