SG10201809587SA - Polishing apparatus and polishing method - Google Patents

Polishing apparatus and polishing method

Info

Publication number
SG10201809587SA
SG10201809587SA SG10201809587SA SG10201809587SA SG10201809587SA SG 10201809587S A SG10201809587S A SG 10201809587SA SG 10201809587S A SG10201809587S A SG 10201809587SA SG 10201809587S A SG10201809587S A SG 10201809587SA SG 10201809587S A SG10201809587S A SG 10201809587SA
Authority
SG
Singapore
Prior art keywords
output
contact pressure
processing section
polishing
data indicating
Prior art date
Application number
SG10201809587SA
Inventor
Suzuki Yuta
Takahashi Taro
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Publication of SG10201809587SA publication Critical patent/SG10201809587SA/en

Links

Classifications

    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]

Landscapes

  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)

Abstract

POLISHING APPARATUS AND POLISHING METHOD A current detection section detects a current value of a swing shaft motor 14 and generates a first output. A first processing section obtains a contact pressure corresponding to the first output from the first output using first data indicating a correspondence relationship between a contact pressure applied to a semiconductor wafer by a top ring and the first output. A second processing section obtains a second output corresponding to a contact pressure obtained by the first processing section using second data indicating a correspondence relationship between the contact pressure obtained by the first processing section and the second output. Representative drawing: Fig. 17
SG10201809587SA 2017-10-31 2018-10-30 Polishing apparatus and polishing method SG10201809587SA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017210318 2017-10-31
JP2018161452A JP7403213B2 (en) 2017-10-31 2018-08-30 Polishing device and polishing method

Publications (1)

Publication Number Publication Date
SG10201809587SA true SG10201809587SA (en) 2019-05-30

Family

ID=66670115

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201809587SA SG10201809587SA (en) 2017-10-31 2018-10-30 Polishing apparatus and polishing method

Country Status (3)

Country Link
JP (1) JP7403213B2 (en)
SG (1) SG10201809587SA (en)
TW (1) TWI826397B (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110238710B (en) * 2019-07-05 2024-08-02 新代科技(苏州)有限公司 Grinding machine with grinding wheel and optimization method of grinding wheel machining map of grinding wheel
TWI722478B (en) * 2019-07-05 2021-03-21 新代科技股份有限公司 Grinding machine and optimization method for grinding map
CN113970370B (en) * 2020-07-24 2024-02-02 泉芯集成电路制造(济南)有限公司 Vibration monitoring system and vibration monitoring method of grinding platform
TWI820399B (en) * 2021-02-26 2023-11-01 國立臺灣科技大學 Wafer processing method and wafer processing system
KR102393576B1 (en) * 2021-11-05 2022-05-04 주식회사 씨엠케미칼 Method for regenerating substrate of cmp pad conditioner
CN118475820A (en) * 2021-12-24 2024-08-09 株式会社日立产机系统 Management device for power transmission mechanism, management method for power transmission mechanism, and management system

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3637977B2 (en) * 1995-01-19 2005-04-13 株式会社荏原製作所 Polishing end point detection method
US6293845B1 (en) * 1999-09-04 2001-09-25 Mitsubishi Materials Corporation System and method for end-point detection in a multi-head CMP tool using real-time monitoring of motor current
JP2001260001A (en) * 2000-03-13 2001-09-25 Hitachi Ltd Method and device for flattening semiconductor device
DE10324429B4 (en) * 2003-05-28 2010-08-19 Advanced Micro Devices, Inc., Sunnyvale Method for operating a chemical-mechanical polishing system by means of a sensor signal of a polishing pad conditioner
US7150673B2 (en) * 2004-07-09 2006-12-19 Ebara Corporation Method for estimating polishing profile or polishing amount, polishing method and polishing apparatus
JP5301931B2 (en) * 2008-09-12 2013-09-25 株式会社荏原製作所 Polishing method and polishing apparatus
JP6005467B2 (en) * 2011-10-26 2016-10-12 株式会社荏原製作所 Polishing method and polishing apparatus
JP5863614B2 (en) * 2012-09-28 2016-02-16 株式会社荏原製作所 Polishing equipment
JP5990074B2 (en) * 2012-09-28 2016-09-07 株式会社荏原製作所 Polishing equipment
JP6727761B2 (en) * 2015-05-15 2020-07-22 株式会社荏原製作所 Polishing apparatus and polishing method

Also Published As

Publication number Publication date
JP2019081243A (en) 2019-05-30
TW201923881A (en) 2019-06-16
TWI826397B (en) 2023-12-21
JP7403213B2 (en) 2023-12-22

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