SG10201802786SA - Substrate cleaning apparatus and substrate processing apparatus - Google Patents

Substrate cleaning apparatus and substrate processing apparatus

Info

Publication number
SG10201802786SA
SG10201802786SA SG10201802786SA SG10201802786SA SG10201802786SA SG 10201802786S A SG10201802786S A SG 10201802786SA SG 10201802786S A SG10201802786S A SG 10201802786SA SG 10201802786S A SG10201802786S A SG 10201802786SA SG 10201802786S A SG10201802786S A SG 10201802786SA
Authority
SG
Singapore
Prior art keywords
substrate
processing apparatus
substrate processing
cleaning apparatus
cleaning
Prior art date
Application number
SG10201802786SA
Inventor
Imamura Akira
Kunisawa Junji
Miyazaki Mitsuru
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Publication of SG10201802786SA publication Critical patent/SG10201802786SA/en

Links

Classifications

    • A—HUMAN NECESSITIES
    • A47—FURNITURE; DOMESTIC ARTICLES OR APPLIANCES; COFFEE MILLS; SPICE MILLS; SUCTION CLEANERS IN GENERAL
    • A47L—DOMESTIC WASHING OR CLEANING; SUCTION CLEANERS IN GENERAL
    • A47L11/00—Machines for cleaning floors, carpets, furniture, walls, or wall coverings
    • A47L11/02—Floor surfacing or polishing machines
    • A47L11/10—Floor surfacing or polishing machines motor-driven
    • A47L11/14—Floor surfacing or polishing machines motor-driven with rotating tools
    • A47L11/18—Floor surfacing or polishing machines motor-driven with rotating tools the tools being roll brushes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B11/00—Cleaning flexible or delicate articles by methods or apparatus specially adapted thereto
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B11/00—Cleaning flexible or delicate articles by methods or apparatus specially adapted thereto
    • B08B11/02—Devices for holding articles during cleaning
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/0023—Other grinding machines or devices grinding machines with a plurality of working posts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B29/00—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B24B37/345—Feeding, loading or unloading work specially adapted to lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
    • G01C1/00—Measuring angles
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D3/00—Control of position or direction
    • G05D3/12—Control of position or direction using feedback
    • G05D3/20—Control of position or direction using feedback using a digital comparing device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
    • H01L21/67219—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process comprising at least one polishing chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Automation & Control Theory (AREA)
  • Radar, Positioning & Navigation (AREA)
  • Remote Sensing (AREA)
  • Cleaning Or Drying Semiconductors (AREA)

Abstract

OF THE DISCLOSURE SUBSTRATE CLEANING APPARATUS AND SUBSTRATE PROCESSING APPARATUS Various examples of a substrate cleaning apparatus and a substrate processing apparatus are described in the present disclosure. One example of the present invention 5 is a substrate cleaning apparatus including a roll cleaning member cleaning a substrate, an inclination sensor detecting an inclination of the roll cleaning member, and an output device outputting a detection result of the inclination sensor. Fig. 3
SG10201802786SA 2017-04-07 2018-04-03 Substrate cleaning apparatus and substrate processing apparatus SG10201802786SA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017076894A JP6941464B2 (en) 2017-04-07 2017-04-07 Substrate cleaning equipment and substrate processing equipment

Publications (1)

Publication Number Publication Date
SG10201802786SA true SG10201802786SA (en) 2018-11-29

Family

ID=63710523

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201802786SA SG10201802786SA (en) 2017-04-07 2018-04-03 Substrate cleaning apparatus and substrate processing apparatus

Country Status (5)

Country Link
US (1) US10575697B2 (en)
JP (1) JP6941464B2 (en)
KR (1) KR102478483B1 (en)
SG (1) SG10201802786SA (en)
TW (1) TWI749207B (en)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7153616B2 (en) * 2019-07-22 2022-10-14 株式会社荏原製作所 SUBSTRATE CLEANING APPARATUS AND SUBSTRATE CLEANING METHOD
KR102267452B1 (en) * 2019-11-27 2021-06-23 한국생산기술연구원 Horizontal correction device for wafer cleaning brush
KR102267453B1 (en) * 2019-11-27 2021-06-23 한국생산기술연구원 Horizontal correction method for wafer cleaning brush
KR20210144071A (en) 2020-05-21 2021-11-30 삼성전자주식회사 Substrate cleaning apparatus with tiltable roll brush
CN112137507B (en) * 2020-09-11 2021-10-22 苏州裕谦信息科技有限公司 Seam beautifying strip maintenance and floor sweeping robot
KR102584513B1 (en) 2020-12-31 2023-10-06 세메스 주식회사 Substrate type senseor for measuring of horizontal of a substrate support member provided on the atmosphere in which temperature changes are accompanied by and method for measuring horizontal of substrate support member using thereof
CN113327878B (en) * 2021-08-03 2021-10-08 四川明泰微电子有限公司 Wafer loading device and wafer film pasting device
CN113658886B (en) * 2021-08-13 2023-09-26 长鑫存储技术有限公司 Substrate cleaning device and substrate cleaning method thereof
CN113911793B (en) * 2021-11-23 2024-06-07 江苏沃源包装制品有限公司 Carrier roller adjusting device for plastic film processing
CN115256199A (en) * 2022-09-29 2022-11-01 苏州米洛微纳电子科技有限公司 Wafer surface polishing equipment for producing automobile sensing chip
CN116765966B (en) * 2023-08-18 2023-12-19 浙江求是半导体设备有限公司 Wafer surface treatment apparatus

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3540524B2 (en) * 1996-10-28 2004-07-07 大日本スクリーン製造株式会社 Substrate processing apparatus and substrate processing method
JP2000228382A (en) * 1999-02-05 2000-08-15 Sony Corp Wafer cleaner
US20050172430A1 (en) * 2003-10-28 2005-08-11 Joseph Yudovsky Wafer edge cleaning
TWI548483B (en) * 2011-07-19 2016-09-11 荏原製作所股份有限公司 Polishing device and method
US9254510B2 (en) * 2012-02-03 2016-02-09 Stmicroelectronics, Inc. Drying apparatus with exhaust control cap for semiconductor wafers and associated methods
JP5937456B2 (en) * 2012-08-07 2016-06-22 東京エレクトロン株式会社 Substrate cleaning device and substrate cleaning unit
JP5878441B2 (en) 2012-08-20 2016-03-08 株式会社荏原製作所 Substrate cleaning apparatus and substrate processing apparatus
JP6125884B2 (en) * 2013-04-23 2017-05-10 株式会社荏原製作所 Substrate processing apparatus and manufacturing method of processing substrate
JP6279276B2 (en) * 2013-10-03 2018-02-14 株式会社荏原製作所 Substrate cleaning apparatus and substrate processing apparatus

Also Published As

Publication number Publication date
US20180289230A1 (en) 2018-10-11
JP6941464B2 (en) 2021-09-29
TW201839840A (en) 2018-11-01
JP2018181978A (en) 2018-11-15
KR20180113932A (en) 2018-10-17
KR102478483B1 (en) 2022-12-19
TWI749207B (en) 2021-12-11
US10575697B2 (en) 2020-03-03

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