SG10201807640RA - Substrate processing apparatus and hand shower gun - Google Patents
Substrate processing apparatus and hand shower gunInfo
- Publication number
- SG10201807640RA SG10201807640RA SG10201807640RA SG10201807640RA SG10201807640RA SG 10201807640R A SG10201807640R A SG 10201807640RA SG 10201807640R A SG10201807640R A SG 10201807640RA SG 10201807640R A SG10201807640R A SG 10201807640RA SG 10201807640R A SG10201807640R A SG 10201807640RA
- Authority
- SG
- Singapore
- Prior art keywords
- flow channel
- liquid
- substrate processing
- processing apparatus
- valve
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B9/00—Cleaning hollow articles by methods or apparatus specially adapted thereto
- B08B9/08—Cleaning containers, e.g. tanks
- B08B9/093—Cleaning containers, e.g. tanks by the force of jets or sprays
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/02—Cleaning by the force of jets or sprays
- B08B3/026—Cleaning by making use of hand-held spray guns; Fluid preparations therefor
- B08B3/028—Spray guns
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/34—Accessories
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Details Of Valves (AREA)
- Cleaning By Liquid Or Steam (AREA)
Abstract
OF THE DISCLOSURE SUBSTRATE PROCESSING APPARATUS AND HAND SHOWER GUN A substrate processing apparatus includes a substrate processing part 3 and a washing unit 40. The washing unit 40 includes a main body 43 having a liquid supplying port 41 and a liquid jetting port 42, a flow channel 44 formed between the liquid supplying port 41 and the liquid jetting port 42, and a valve 45 provided in the flow channel 44. In the washing unit 40, when the valve 45 is opened, the flow channel 44 is opened, thereby causing the liquid jetting port 42 to jet liquid, and when the valve 45 is closed, the flow channel 44 is closed, thereby causing the liquid jetting port 42 to stop jetting liquid. The flow channel 44 is provided with a water-hammer reducing mechanism 48 that operates to reduce damage to the flow channel 44 caused by a water hammer phenomenon when the valve 45 is closed. Figure 5
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015045278A JP6505474B2 (en) | 2015-03-06 | 2015-03-06 | Hand shower gun and water hammer reduction mechanism |
JP2015049896A JP6483484B2 (en) | 2015-03-12 | 2015-03-12 | Substrate processing equipment |
Publications (1)
Publication Number | Publication Date |
---|---|
SG10201807640RA true SG10201807640RA (en) | 2018-10-30 |
Family
ID=56850445
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG10201601636RA SG10201601636RA (en) | 2015-03-06 | 2016-03-03 | Substrate processing apparatus and hand shower gun |
SG10201807640RA SG10201807640RA (en) | 2015-03-06 | 2016-03-03 | Substrate processing apparatus and hand shower gun |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG10201601636RA SG10201601636RA (en) | 2015-03-06 | 2016-03-03 | Substrate processing apparatus and hand shower gun |
Country Status (2)
Country | Link |
---|---|
US (2) | US20160256900A1 (en) |
SG (2) | SG10201601636RA (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2020528506A (en) | 2017-03-22 | 2020-09-24 | バレステロス,ジョナサン | Low flow devices for low flow fluid delivery systems and low flow fluid delivery systems |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2424321A1 (en) * | 1974-05-18 | 1975-11-20 | Woma Maasberg Co Gmbh W | SHUT-OFF VALVE FOR HIGH AND HIGHEST PRESSURES, IN PARTICULAR FOR HIGH PRESSURE GUNS |
JPS5411531B2 (en) * | 1975-01-25 | 1979-05-16 | ||
US4396156A (en) * | 1982-03-08 | 1983-08-02 | Nacom Industries, Inc. | Spray gun for cleaning and removing standing particles from wafers and substrates |
DK34695A (en) * | 1995-03-30 | 1996-11-20 | Kew Ind As | High pressure cleaner with bypass valve for the pump |
US7464724B2 (en) * | 2004-10-08 | 2008-12-16 | Pearl Enterprises, Llc | Valve assembly |
US10179351B2 (en) * | 2005-02-07 | 2019-01-15 | Planar Semiconductor, Inc. | Method and apparatus for cleaning flat objects with pulsed liquid jet |
DE202006012417U1 (en) * | 2006-08-11 | 2006-12-21 | Suttner Gmbh | Valve device for high-pressure liquid dispenser has control channel connected upstream of blocking valve to inlet-side branch for fluid |
KR101958874B1 (en) * | 2008-06-04 | 2019-03-15 | 가부시키가이샤 에바라 세이사꾸쇼 | Substrate processing apparatus, substrate processing method, substrate holding mechanism, and substrate holding method |
-
2016
- 2016-03-03 SG SG10201601636RA patent/SG10201601636RA/en unknown
- 2016-03-03 US US15/060,368 patent/US20160256900A1/en not_active Abandoned
- 2016-03-03 SG SG10201807640RA patent/SG10201807640RA/en unknown
-
2018
- 2018-06-27 US US16/019,824 patent/US20180304320A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
SG10201601636RA (en) | 2016-10-28 |
US20160256900A1 (en) | 2016-09-08 |
US20180304320A1 (en) | 2018-10-25 |
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