SG10201807640RA - Substrate processing apparatus and hand shower gun - Google Patents

Substrate processing apparatus and hand shower gun

Info

Publication number
SG10201807640RA
SG10201807640RA SG10201807640RA SG10201807640RA SG10201807640RA SG 10201807640R A SG10201807640R A SG 10201807640RA SG 10201807640R A SG10201807640R A SG 10201807640RA SG 10201807640R A SG10201807640R A SG 10201807640RA SG 10201807640R A SG10201807640R A SG 10201807640RA
Authority
SG
Singapore
Prior art keywords
flow channel
liquid
substrate processing
processing apparatus
valve
Prior art date
Application number
SG10201807640RA
Inventor
Hiroshi Aono
Hideo Aizawa
Tadakazu Sone
Kenji Shinkai
Nobutaka Omata
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2015045278A external-priority patent/JP6505474B2/en
Priority claimed from JP2015049896A external-priority patent/JP6483484B2/en
Application filed by Ebara Corp filed Critical Ebara Corp
Publication of SG10201807640RA publication Critical patent/SG10201807640RA/en

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B08CLEANING
    • B08BCLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B9/00Cleaning hollow articles by methods or apparatus specially adapted thereto 
    • B08B9/08Cleaning containers, e.g. tanks
    • B08B9/093Cleaning containers, e.g. tanks by the force of jets or sprays
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B08CLEANING
    • B08BCLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02Cleaning by the force of jets or sprays
    • B08B3/026Cleaning by making use of hand-held spray guns; Fluid preparations therefor
    • B08B3/028Spray guns
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00Lapping machines or devices; Accessories
    • B24B37/04Lapping machines or devices; Accessories designed for working plane surfaces
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00Lapping machines or devices; Accessories
    • B24B37/34Accessories
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67017Apparatus for fluid treatment
    • H01L21/67028Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Details Of Valves (AREA)
  • Cleaning By Liquid Or Steam (AREA)

Abstract

OF THE DISCLOSURE SUBSTRATE PROCESSING APPARATUS AND HAND SHOWER GUN A substrate processing apparatus includes a substrate processing part 3 and a washing unit 40. The washing unit 40 includes a main body 43 having a liquid supplying port 41 and a liquid jetting port 42, a flow channel 44 formed between the liquid supplying port 41 and the liquid jetting port 42, and a valve 45 provided in the flow channel 44. In the washing unit 40, when the valve 45 is opened, the flow channel 44 is opened, thereby causing the liquid jetting port 42 to jet liquid, and when the valve 45 is closed, the flow channel 44 is closed, thereby causing the liquid jetting port 42 to stop jetting liquid. The flow channel 44 is provided with a water-hammer reducing mechanism 48 that operates to reduce damage to the flow channel 44 caused by a water hammer phenomenon when the valve 45 is closed. Figure 5
SG10201807640RA 2015-03-06 2016-03-03 Substrate processing apparatus and hand shower gun SG10201807640RA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015045278A JP6505474B2 (en) 2015-03-06 2015-03-06 Hand shower gun and water hammer reduction mechanism
JP2015049896A JP6483484B2 (en) 2015-03-12 2015-03-12 Substrate processing equipment

Publications (1)

Publication Number Publication Date
SG10201807640RA true SG10201807640RA (en) 2018-10-30

Family

ID=56850445

Family Applications (2)

Application Number Title Priority Date Filing Date
SG10201601636RA SG10201601636RA (en) 2015-03-06 2016-03-03 Substrate processing apparatus and hand shower gun
SG10201807640RA SG10201807640RA (en) 2015-03-06 2016-03-03 Substrate processing apparatus and hand shower gun

Family Applications Before (1)

Application Number Title Priority Date Filing Date
SG10201601636RA SG10201601636RA (en) 2015-03-06 2016-03-03 Substrate processing apparatus and hand shower gun

Country Status (2)

Country Link
US (2) US20160256900A1 (en)
SG (2) SG10201601636RA (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020528506A (en) 2017-03-22 2020-09-24 バレステロス,ジョナサン Low flow devices for low flow fluid delivery systems and low flow fluid delivery systems

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2424321A1 (en) * 1974-05-18 1975-11-20 Woma Maasberg Co Gmbh W SHUT-OFF VALVE FOR HIGH AND HIGHEST PRESSURES, IN PARTICULAR FOR HIGH PRESSURE GUNS
JPS5411531B2 (en) * 1975-01-25 1979-05-16
US4396156A (en) * 1982-03-08 1983-08-02 Nacom Industries, Inc. Spray gun for cleaning and removing standing particles from wafers and substrates
DK34695A (en) * 1995-03-30 1996-11-20 Kew Ind As High pressure cleaner with bypass valve for the pump
US7464724B2 (en) * 2004-10-08 2008-12-16 Pearl Enterprises, Llc Valve assembly
US10179351B2 (en) * 2005-02-07 2019-01-15 Planar Semiconductor, Inc. Method and apparatus for cleaning flat objects with pulsed liquid jet
DE202006012417U1 (en) * 2006-08-11 2006-12-21 Suttner Gmbh Valve device for high-pressure liquid dispenser has control channel connected upstream of blocking valve to inlet-side branch for fluid
KR101958874B1 (en) * 2008-06-04 2019-03-15 가부시키가이샤 에바라 세이사꾸쇼 Substrate processing apparatus, substrate processing method, substrate holding mechanism, and substrate holding method

Also Published As

Publication number Publication date
SG10201601636RA (en) 2016-10-28
US20160256900A1 (en) 2016-09-08
US20180304320A1 (en) 2018-10-25

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