SG10201805667XA - System of heated air staging chamber for server cluster of data center - Google Patents

System of heated air staging chamber for server cluster of data center

Info

Publication number
SG10201805667XA
SG10201805667XA SG10201805667XA SG10201805667XA SG10201805667XA SG 10201805667X A SG10201805667X A SG 10201805667XA SG 10201805667X A SG10201805667X A SG 10201805667XA SG 10201805667X A SG10201805667X A SG 10201805667XA SG 10201805667X A SG10201805667X A SG 10201805667XA
Authority
SG
Singapore
Prior art keywords
data center
heated air
server cluster
staging chamber
air staging
Prior art date
Application number
SG10201805667XA
Inventor
Chun Keat Cheong
Kheng Hock Lee
Chong Meng Goh
Sahroon Bin Mohn Amin Azrin
Original Assignee
Ers Gx Holding Pte Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ers Gx Holding Pte Ltd filed Critical Ers Gx Holding Pte Ltd
Priority to SG10201805667XA priority Critical patent/SG10201805667XA/en
Priority to CN201811534462.6A priority patent/CN110662391B/en
Priority to US16/283,193 priority patent/US10925189B2/en
Priority to KR1020207037162A priority patent/KR102530528B1/en
Priority to PCT/IB2019/054982 priority patent/WO2020003044A1/en
Priority to JP2020571680A priority patent/JP7154490B2/en
Priority to EP19827412.8A priority patent/EP3815478A4/en
Priority to AU2019293951A priority patent/AU2019293951B2/en
Publication of SG10201805667XA publication Critical patent/SG10201805667XA/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1485—Servers; Data center rooms, e.g. 19-inch computer racks
    • H05K7/1488—Cabinets therefor, e.g. chassis or racks or mechanical interfaces between blades and support structures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/208—Liquid cooling with phase change
    • H05K7/20827—Liquid cooling with phase change within rooms for removing heat from cabinets, e.g. air conditioning devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20718—Forced ventilation of a gaseous coolant
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136—Forced ventilation, e.g. by fans
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136—Forced ventilation, e.g. by fans
    • H05K7/20172—Fan mounting or fan specifications
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/202—Air circulating in closed loop within enclosure wherein heat is removed through heat-exchangers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20718—Forced ventilation of a gaseous coolant
    • H05K7/20736—Forced ventilation of a gaseous coolant within cabinets for removing heat from server blades
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20718—Forced ventilation of a gaseous coolant
    • H05K7/20745—Forced ventilation of a gaseous coolant within rooms for removing heat from cabinets, e.g. by air conditioning device
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20754—Air circulating in closed loop within cabinets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20763—Liquid cooling without phase change
    • H05K7/2079—Liquid cooling without phase change within rooms for removing heat from cabinets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/208—Liquid cooling with phase change
    • H05K7/20818—Liquid cooling with phase change within cabinets for removing heat from server blades
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20836—Thermal management, e.g. server temperature control
SG10201805667XA 2018-06-29 2018-06-29 System of heated air staging chamber for server cluster of data center SG10201805667XA (en)

Priority Applications (8)

Application Number Priority Date Filing Date Title
SG10201805667XA SG10201805667XA (en) 2018-06-29 2018-06-29 System of heated air staging chamber for server cluster of data center
CN201811534462.6A CN110662391B (en) 2018-06-29 2018-12-14 Hot air classification room system of data center server cluster
US16/283,193 US10925189B2 (en) 2018-06-29 2019-02-22 System of heated air staging chamber for server cluster of data center
KR1020207037162A KR102530528B1 (en) 2018-06-29 2019-06-14 Heated Air Staging Chamber Systems for Server Clusters in Data Centers
PCT/IB2019/054982 WO2020003044A1 (en) 2018-06-29 2019-06-14 System of heated air staging chamber for server cluster
JP2020571680A JP7154490B2 (en) 2018-06-29 2019-06-14 Heated air staging chamber system for data center server cluster
EP19827412.8A EP3815478A4 (en) 2018-06-29 2019-06-14 System of heated air staging chamber for server cluster of data center
AU2019293951A AU2019293951B2 (en) 2018-06-29 2019-06-14 System of Heated Air Staging Chamber for Server Cluster of Data Center

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SG10201805667XA SG10201805667XA (en) 2018-06-29 2018-06-29 System of heated air staging chamber for server cluster of data center

Publications (1)

Publication Number Publication Date
SG10201805667XA true SG10201805667XA (en) 2020-01-30

Family

ID=68986123

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201805667XA SG10201805667XA (en) 2018-06-29 2018-06-29 System of heated air staging chamber for server cluster of data center

Country Status (8)

Country Link
US (1) US10925189B2 (en)
EP (1) EP3815478A4 (en)
JP (1) JP7154490B2 (en)
KR (1) KR102530528B1 (en)
CN (1) CN110662391B (en)
AU (1) AU2019293951B2 (en)
SG (1) SG10201805667XA (en)
WO (1) WO2020003044A1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
PL3873183T3 (en) * 2020-02-28 2022-03-28 Ovh Rack arrangement for a data center
US11388832B2 (en) * 2020-05-28 2022-07-12 Baidu Usa Llc Blind-mate connection design for liquid-cooled electronic racks
CN112188801B (en) * 2020-09-25 2022-12-09 深圳广盛浩科技有限公司 5G basic station heat dissipation shell

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DE19832338C2 (en) * 1998-07-17 2002-01-31 Feierbach Wolfgang computer equipment
US6301837B1 (en) * 2000-03-13 2001-10-16 Kewaunee Scientific Corp. Rack assembly for supporting electronic units
US7259963B2 (en) * 2004-12-29 2007-08-21 American Power Conversion Corp. Rack height cooling
JP2010524074A (en) * 2007-04-05 2010-07-15 ジグシンスキー、イェクティエル Integrated cabinet / rack for forced cooling electronic components
US9148980B2 (en) 2007-07-13 2015-09-29 Dell Products L.P. System for a rack design
US20090225514A1 (en) * 2008-03-10 2009-09-10 Adrian Correa Device and methodology for the removal of heat from an equipment rack by means of heat exchangers mounted to a door
KR20110129514A (en) * 2010-05-26 2011-12-02 삼정데이타서비스 주식회사 Air conditioning system of internet data center for green computing environment
US9016352B2 (en) 2012-05-21 2015-04-28 Calvary Applied Technologies, LLC Apparatus and methods for cooling rejected heat from server racks
US20140206271A1 (en) * 2013-01-22 2014-07-24 Roland M. Ignacio Electronics rack cooling duct
US9149753B2 (en) * 2013-03-26 2015-10-06 Hewlett-Packard Development Company, L.P. Filter member
GB2518659A (en) * 2013-09-27 2015-04-01 Alifabs Cabinets & Ancillaries Ltd Fan Controller
US9690337B1 (en) * 2013-12-09 2017-06-27 Amazon Technologies, Inc. Cooling system for data center
CN203708665U (en) * 2014-01-03 2014-07-09 东南大学 Partition air supply machine cabinet
EP3093565B1 (en) * 2014-01-06 2020-03-25 Naver Business Platform Corp. Server room cooling device
JP2015185708A (en) * 2014-03-25 2015-10-22 パナソニックＩｐマネジメント株式会社 Cooling device and data center having the same
KR20160080684A (en) * 2014-12-30 2016-07-08 태효식 Apparatus for cooling server rack
US9894807B2 (en) * 2015-01-27 2018-02-13 International Business Machines Corporation Changeable, airflow venting cover assembly for an electronics rack
JP6455928B2 (en) * 2015-02-16 2019-01-23 株式会社国際電気通信基礎技術研究所 Server rack for wireless communication and server aggregate using the server rack
US10455741B2 (en) * 2015-04-17 2019-10-22 Hewlett Packard Enterprise Development Lp Rack enclosure with perforations for cooling
US9968010B2 (en) * 2015-12-21 2018-05-08 Dell Products, L.P. Information handling system having flexible chassis block radiators
US10433466B2 (en) * 2016-06-16 2019-10-01 Dell Products L.P. Mixing chamber for air handling in an information handling system
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CN206574020U (en) * 2017-02-16 2017-10-20 夏邵怡 A kind of novel computer cooling cabinet
CN107969098A (en) * 2017-12-26 2018-04-27 广东申菱环境系统股份有限公司 A kind of data center module

Also Published As

Publication number Publication date
JP2021530027A (en) 2021-11-04
CN110662391B (en) 2020-10-30
US20200008323A1 (en) 2020-01-02
WO2020003044A8 (en) 2020-12-30
KR102530528B1 (en) 2023-05-08
CN110662391A (en) 2020-01-07
WO2020003044A1 (en) 2020-01-02
JP7154490B2 (en) 2022-10-18
US10925189B2 (en) 2021-02-16
AU2019293951A1 (en) 2021-01-14
KR20210003941A (en) 2021-01-12
AU2019293951B2 (en) 2021-11-25
EP3815478A1 (en) 2021-05-05
EP3815478A4 (en) 2022-03-23

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