SG10201801569YA - Self-cleaning device and substrate processing apparatus - Google Patents

Self-cleaning device and substrate processing apparatus

Info

Publication number
SG10201801569YA
SG10201801569YA SG10201801569YA SG10201801569YA SG10201801569YA SG 10201801569Y A SG10201801569Y A SG 10201801569YA SG 10201801569Y A SG10201801569Y A SG 10201801569YA SG 10201801569Y A SG10201801569Y A SG 10201801569YA SG 10201801569Y A SG10201801569Y A SG 10201801569YA
Authority
SG
Singapore
Prior art keywords
cleaning
self
processing apparatus
cleaning device
substrate processing
Prior art date
Application number
SG10201801569YA
Inventor
Suemasa Shuichi
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Publication of SG10201801569YA publication Critical patent/SG10201801569YA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00—Cleaning by methods involving the use of tools
    • B08B1/50—Cleaning by methods involving the use of tools involving cleaning of the cleaning members
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00—Cleaning by methods involving the use of tools
    • B08B1/10—Cleaning by methods involving the use of tools characterised by the type of cleaning tool
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00—Cleaning by methods involving the use of tools
    • B08B1/30—Cleaning by methods involving the use of tools by movement of cleaning members over a surface
    • B08B1/32—Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00—Cleaning by methods involving the use of tools
    • B08B1/50—Cleaning by methods involving the use of tools involving cleaning of the cleaning members
    • B08B1/52—Cleaning by methods involving the use of tools involving cleaning of the cleaning members using fluids
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00—Cleaning by methods involving the use of tools
    • B08B1/50—Cleaning by methods involving the use of tools involving cleaning of the cleaning members
    • B08B1/54—Cleaning by methods involving the use of tools involving cleaning of the cleaning members using mechanical tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02—Cleaning by the force of jets or sprays
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/007—Cleaning of grinding wheels
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00—Cleaning by methods involving the use of tools
    • B08B1/10—Cleaning by methods involving the use of tools characterised by the type of cleaning tool
    • B08B1/14—Wipes; Absorbent members, e.g. swabs or sponges

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Cleaning Or Drying Semiconductors (AREA)

Abstract

SELF-CLEANING DEVICE AND SUBSTRATE PROCESSING APPARATUS A self-cleaning device of the present disclosure includes: a cleaning member configured to clean a cleaning tool that cleans a substrate; and an injection unit configured to inject a liquid toward the cleaning member or the cleaning tool. The cleaning member has a cleaning surface that cleans the cleaning tool when the cleaning tool is pressed thereagainst, and the cleaning surface is inclined with respect to a horizontal plane. (Figure 4)
SG10201801569YA 2017-03-06 2018-02-27 Self-cleaning device and substrate processing apparatus SG10201801569YA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017042195A JP6875154B2 (en) 2017-03-06 2017-03-06 Self-cleaning methods for self-cleaning equipment, substrate processing equipment, and cleaning tools

Publications (1)

Publication Number Publication Date
SG10201801569YA true SG10201801569YA (en) 2018-10-30

Family

ID=63357616

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201801569YA SG10201801569YA (en) 2017-03-06 2018-02-27 Self-cleaning device and substrate processing apparatus

Country Status (5)

Country Link
US (1) US10751761B2 (en)
JP (1) JP6875154B2 (en)
KR (1) KR102531903B1 (en)
SG (1) SG10201801569YA (en)
TW (1) TWI754017B (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7353042B2 (en) * 2019-02-25 2023-09-29 株式会社東京精密 brush cleaning device
TWI739201B (en) * 2019-11-08 2021-09-11 辛耘企業股份有限公司 Wet processing device for substrates and substrates claening method
JP7078602B2 (en) * 2019-12-25 2022-05-31 株式会社荏原製作所 Devices and methods for calculating the rotation speed of a substrate in a cleaning device, a polishing device, and a cleaning device.

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US331440A (en) * 1885-12-01 Carbon-baking box
JPS58182234A (en) * 1982-04-17 1983-10-25 Dainippon Screen Mfg Co Ltd Washing apparatus allowing use of plural kinds of brushes
US5685039A (en) * 1995-05-12 1997-11-11 Tokyo Electron Limited Cleaning apparatus
TW353784B (en) * 1996-11-19 1999-03-01 Tokyo Electron Ltd Apparatus and method for washing substrate
US5894622A (en) * 1997-12-31 1999-04-20 International Business Machines Corporation Brush conditioner wing
US6290780B1 (en) * 1999-03-19 2001-09-18 Lam Research Corporation Method and apparatus for processing a wafer
US6438781B1 (en) * 2000-04-21 2002-08-27 Toda Citron Technologies, Inc. Washer for cleaning substrates
DE10121010B4 (en) * 2001-04-28 2007-06-28 Infineon Technologies Ag Holder for semiconductor wafers in a brush cleaning system
US6651284B2 (en) * 2001-10-11 2003-11-25 Silicon Integrated Systems Corp. Scrubbing assembly for wafer-cleaning device
KR20030050796A (en) * 2001-12-19 2003-06-25 삼성전자주식회사 an apparatus for polishing semiconductor wafer
DE10222716A1 (en) * 2002-05-23 2003-12-11 Braun Gmbh Cleaning device for the shaving head of a dry shaver
JP2004022940A (en) * 2002-06-19 2004-01-22 Tokyo Seimitsu Co Ltd Apparatus and method for polishing, and wafer saving program
US20060021642A1 (en) * 2004-07-30 2006-02-02 Sliwa John W Jr Apparatus and method for delivering acoustic energy through a liquid stream to a target object for disruptive surface cleaning or treating effects
US20080173335A1 (en) * 2005-04-11 2008-07-24 Doosan Mecatec Co., Ltd Semiconductor Wafer Cleaning System
KR100615100B1 (en) * 2005-08-16 2006-08-22 삼성전자주식회사 Cleaner of polishing pad and chemical mechanical polishing apparatus having the same
US8127395B2 (en) * 2006-05-05 2012-03-06 Lam Research Corporation Apparatus for isolated bevel edge clean and method for using the same
JP2011165751A (en) * 2010-02-05 2011-08-25 Toshiba Corp Cleaning apparatus and semiconductor-device manufacturing method
JP6054805B2 (en) * 2013-04-25 2016-12-27 株式会社荏原製作所 Substrate cleaning device
JP6224974B2 (en) 2013-09-26 2017-11-01 株式会社荏原製作所 Substrate cleaning machine, substrate cleaning apparatus, manufacturing method of cleaned substrate, and substrate processing apparatus
JP6312534B2 (en) * 2014-06-10 2018-04-18 株式会社荏原製作所 Substrate cleaning device
US9700988B2 (en) * 2014-08-26 2017-07-11 Ebara Corporation Substrate processing apparatus

Also Published As

Publication number Publication date
KR102531903B1 (en) 2023-05-11
JP2018148054A (en) 2018-09-20
TW201834052A (en) 2018-09-16
JP6875154B2 (en) 2021-05-19
US10751761B2 (en) 2020-08-25
US20180250717A1 (en) 2018-09-06
KR20180102022A (en) 2018-09-14
TWI754017B (en) 2022-02-01

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