SG10201705881WA - Determining apparatus for determining object stored in cassette - Google Patents

Determining apparatus for determining object stored in cassette

Info

Publication number
SG10201705881WA
SG10201705881WA SG10201705881WA SG10201705881WA SG10201705881WA SG 10201705881W A SG10201705881W A SG 10201705881WA SG 10201705881W A SG10201705881W A SG 10201705881WA SG 10201705881W A SG10201705881W A SG 10201705881WA SG 10201705881W A SG10201705881W A SG 10201705881WA
Authority
SG
Singapore
Prior art keywords
determining
cassette
object stored
determining apparatus
determining object
Prior art date
Application number
SG10201705881WA
Inventor
Togashi Ken
Tsukamoto Masahiro
Original Assignee
Disco Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Disco Corp filed Critical Disco Corp
Publication of SG10201705881WA publication Critical patent/SG10201705881WA/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01V—GEOPHYSICS; GRAVITATIONAL MEASUREMENTS; DETECTING MASSES OR OBJECTS; TAGS
    • G01V8/00—Prospecting or detecting by optical means
    • G01V8/10—Detecting, e.g. by using light barriers
    • G01V8/20—Detecting, e.g. by using light barriers using multiple transmitters or receivers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67271—Sorting devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01V—GEOPHYSICS; GRAVITATIONAL MEASUREMENTS; DETECTING MASSES OR OBJECTS; TAGS
    • G01V8/00—Prospecting or detecting by optical means
    • G01V8/10—Detecting, e.g. by using light barriers
    • G01V8/12—Detecting, e.g. by using light barriers using one transmitter and one receiver
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67346—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders characterized by being specially adapted for supporting a single substrate or by comprising a stack of such individual supports
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading

Landscapes

  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • General Life Sciences & Earth Sciences (AREA)
  • Geophysics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Warehouses Or Storage Devices (AREA)
SG10201705881WA 2016-08-12 2017-07-18 Determining apparatus for determining object stored in cassette SG10201705881WA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2016158408A JP6689539B2 (en) 2016-08-12 2016-08-12 Judgment device

Publications (1)

Publication Number Publication Date
SG10201705881WA true SG10201705881WA (en) 2018-03-28

Family

ID=61018558

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201705881WA SG10201705881WA (en) 2016-08-12 2017-07-18 Determining apparatus for determining object stored in cassette

Country Status (8)

Country Link
US (1) US10094951B2 (en)
JP (1) JP6689539B2 (en)
KR (1) KR102190336B1 (en)
CN (1) CN107731708B (en)
DE (1) DE102017213963B4 (en)
MY (1) MY183731A (en)
SG (1) SG10201705881WA (en)
TW (1) TWI724194B (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7126809B2 (en) * 2017-04-13 2022-08-29 浜松ホトニクス株式会社 Image acquisition device and image acquisition method
US10533852B1 (en) * 2018-09-27 2020-01-14 Taiwan Semiconductor Manufacturing Company, Ltd. Leveling sensor, load port including the same, and method of leveling a load port
JP7336877B2 (en) * 2019-05-21 2023-09-01 東京エレクトロン株式会社 SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
CN110797276B (en) * 2019-11-22 2021-12-07 衡阳开拓光电科技有限公司 Small-size board carries chip processing and connects feeder equipment
JP2023076058A (en) 2021-11-22 2023-06-01 株式会社ディスコ Processing device

Family Cites Families (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2868645B2 (en) * 1991-04-19 1999-03-10 東京エレクトロン株式会社 Wafer transfer device, wafer inclination detecting method, and wafer detecting method
KR100315007B1 (en) * 1995-11-22 2002-02-28 이시다 아키라 Substrate detection and transfer apparatus in cassette and method thereof
JPH1167876A (en) * 1997-08-14 1999-03-09 Hitachi Tokyo Electron Co Ltd Die recognition method and semiconductor manufacture device
JP4253365B2 (en) * 1997-10-17 2009-04-08 オリンパス株式会社 Wafer transfer device
US6188323B1 (en) * 1998-10-15 2001-02-13 Asyst Technologies, Inc. Wafer mapping system
US6545752B1 (en) * 2000-07-07 2003-04-08 Daitron, Inc. Method and apparatus for detecting defects along the edge of electronic media
JP3565810B2 (en) * 2001-09-25 2004-09-15 大日本スクリーン製造株式会社 Apparatus for opening and closing lid of substrate storage container, substrate detection method and apparatus
US7054713B2 (en) * 2002-01-07 2006-05-30 Taiwan Semiconductor Manufacturing Company, Ltd. Calibration cassette pod for robot teaching and method of using
JP4118592B2 (en) * 2002-04-22 2008-07-16 富士通株式会社 Load port and semiconductor manufacturing equipment
JP4091378B2 (en) * 2002-08-28 2008-05-28 大日本スクリーン製造株式会社 Substrate processing equipment
JP2004207507A (en) * 2002-12-25 2004-07-22 Shinko Electric Co Ltd Substrate detecting apparatus
JP2004363085A (en) * 2003-05-09 2004-12-24 Ebara Corp Inspection apparatus by charged particle beam and method for manufacturing device using inspection apparatus
US7015492B2 (en) * 2003-08-15 2006-03-21 Asm International N.V. Method and apparatus for mapping of wafers located inside a closed wafer cassette
TWI367192B (en) * 2003-11-13 2012-07-01 Applied Materials Inc Calibration of high speed loader to substrate transport system
JP4176041B2 (en) * 2004-04-14 2008-11-05 オリンパス株式会社 Classification apparatus and classification method
JP4491446B2 (en) * 2005-11-04 2010-06-30 株式会社オーク製作所 Peripheral exposure apparatus and method
JP4522360B2 (en) * 2005-12-02 2010-08-11 日東電工株式会社 Semiconductor wafer position determination method and apparatus using the same
US7732332B2 (en) * 2006-03-10 2010-06-08 United Microelectronics Corp. Chemical mechanical polishing method with inspection pre and post processing
DE102007010225B4 (en) * 2007-02-28 2018-08-23 Vistec Semiconductor Systems Gmbh Method for taking high-resolution images of defects on the top of the wafer edge
JP5384270B2 (en) * 2009-09-21 2014-01-08 東京エレクトロン株式会社 loader
JP2012146809A (en) * 2011-01-12 2012-08-02 Hitachi Kokusai Electric Inc Substrate processing apparatus and substrate processing method
JP5935676B2 (en) * 2012-12-07 2016-06-15 東京エレクトロン株式会社 Substrate processing apparatus, operation method of substrate apparatus, and storage medium
JP6212292B2 (en) 2013-06-11 2017-10-11 リンテック株式会社 Load port
JP6227334B2 (en) * 2013-09-04 2017-11-08 ローツェ株式会社 Load port for detecting multiple types of semiconductor wafers
JP6248788B2 (en) * 2014-04-28 2017-12-20 シンフォニアテクノロジー株式会社 Wafer mapping apparatus and load port having the same
JP6415220B2 (en) * 2014-09-29 2018-10-31 株式会社Ｓｃｒｅｅｎホールディングス Substrate processing apparatus and substrate processing method

Also Published As

Publication number Publication date
DE102017213963B4 (en) 2022-05-05
CN107731708A (en) 2018-02-23
KR102190336B1 (en) 2020-12-11
MY183731A (en) 2021-03-10
KR20180018362A (en) 2018-02-21
TWI724194B (en) 2021-04-11
US10094951B2 (en) 2018-10-09
TW201816915A (en) 2018-05-01
US20180045851A1 (en) 2018-02-15
CN107731708B (en) 2023-05-30
DE102017213963A1 (en) 2018-02-15
JP6689539B2 (en) 2020-04-28
JP2018026486A (en) 2018-02-15

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