SG10201705722UA - Molding System for Applying a Uniform Clamping Pressure onto a Substrate - Google Patents
Molding System for Applying a Uniform Clamping Pressure onto a SubstrateInfo
- Publication number
- SG10201705722UA SG10201705722UA SG10201705722UA SG10201705722UA SG10201705722UA SG 10201705722U A SG10201705722U A SG 10201705722UA SG 10201705722U A SG10201705722U A SG 10201705722UA SG 10201705722U A SG10201705722U A SG 10201705722UA SG 10201705722U A SG10201705722U A SG 10201705722UA
- Authority
- SG
- Singapore
- Prior art keywords
- applying
- substrate
- clamping pressure
- molding system
- pressure onto
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14065—Positioning or centering articles in the mould
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/12—Moulds or cores; Details thereof or accessories therefor with incorporated means for positioning inserts, e.g. labels
- B29C33/123—Moulds or cores; Details thereof or accessories therefor with incorporated means for positioning inserts, e.g. labels for centering the inserts
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/03—Injection moulding apparatus
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
- B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14819—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles the inserts being completely encapsulated
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/76—Measuring, controlling or regulating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/76—Measuring, controlling or regulating
- B29C45/7653—Measuring, controlling or regulating mould clamping forces
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C2945/00—Indexing scheme relating to injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould
- B29C2945/76—Measuring, controlling or regulating
- B29C2945/76003—Measured parameter
- B29C2945/76083—Position
- B29C2945/76096—Distance
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C2945/00—Indexing scheme relating to injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould
- B29C2945/76—Measuring, controlling or regulating
- B29C2945/76177—Location of measurement
- B29C2945/76294—Inserts
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C2945/00—Indexing scheme relating to injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould
- B29C2945/76—Measuring, controlling or regulating
- B29C2945/76344—Phase or stage of measurement
- B29C2945/76387—Mould closing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C2945/00—Indexing scheme relating to injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould
- B29C2945/76—Measuring, controlling or regulating
- B29C2945/76494—Controlled parameter
- B29C2945/76568—Position
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
- B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
- B29L2031/3481—Housings or casings incorporating or embedding electric or electronic elements
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US15/213,576 US10960583B2 (en) | 2016-07-19 | 2016-07-19 | Molding system for applying a uniform clamping pressure onto a substrate |
Publications (1)
Publication Number | Publication Date |
---|---|
SG10201705722UA true SG10201705722UA (en) | 2018-02-27 |
Family
ID=60990395
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG10201705722UA SG10201705722UA (en) | 2016-07-19 | 2017-07-12 | Molding System for Applying a Uniform Clamping Pressure onto a Substrate |
Country Status (7)
Country | Link |
---|---|
US (1) | US10960583B2 (en) |
KR (1) | KR101964034B1 (en) |
CN (1) | CN107634016B (en) |
MY (1) | MY192578A (en) |
PH (1) | PH12017000208B1 (en) |
SG (1) | SG10201705722UA (en) |
TW (1) | TWI650838B (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11446851B2 (en) * | 2019-04-29 | 2022-09-20 | Taiwan Semiconductor Manufacturing Company, Ltd. | Molding apparatus, manufacturing method of molded semiconductor device and molded semiconductor device |
US11621181B2 (en) * | 2020-05-05 | 2023-04-04 | Asmpt Singapore Pte. Ltd. | Dual-sided molding for encapsulating electronic devices |
CN113696428A (en) * | 2021-09-03 | 2021-11-26 | 苏州鸿顺自动化设备有限公司 | Injection molding runner die cutting machine |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3909175A (en) | 1973-03-08 | 1975-09-30 | Du Pont Canada | Injection moulding runner and process |
JP3486557B2 (en) * | 1998-07-30 | 2004-01-13 | 宮崎沖電気株式会社 | Transfer molding apparatus and semiconductor device manufacturing method |
US6869556B2 (en) | 2002-07-16 | 2005-03-22 | Asm Technology Singapore Pte Ltd. | Molding system for semiconductor packages |
US6875384B1 (en) | 2002-09-06 | 2005-04-05 | Triformix, Inc. | Precision article molding methods and apparatus |
JP2007242924A (en) | 2006-03-09 | 2007-09-20 | Renesas Technology Corp | Manufacturing method of semiconductor device |
KR101367661B1 (en) * | 2006-08-25 | 2014-02-27 | 엘아이지에이디피 주식회사 | Apparatus for assembling substrates having adjusting unit for parallel chuck and horizontal chuck |
JP5002229B2 (en) | 2006-10-04 | 2012-08-15 | アピックヤマダ株式会社 | Clamping device |
JP5039443B2 (en) * | 2007-06-18 | 2012-10-03 | アピックヤマダ株式会社 | Transfer molding apparatus and semiconductor device manufacturing method |
US7829004B2 (en) * | 2008-07-15 | 2010-11-09 | Asm Technology Singapore Pte Ltd | Transfer molding method and system for electronic devices |
TWI397464B (en) * | 2008-10-15 | 2013-06-01 | Asm Tech Singapore Pte Ltd | Optical device molding system |
JP5707577B2 (en) | 2009-08-03 | 2015-04-30 | ボンドテック株式会社 | Pressurizing device and pressurizing method |
CA2778292C (en) * | 2009-10-20 | 2017-02-14 | Teijin Chemicals Ltd. | Process of manufacturing a curved member having a high-grade design surface and member manufactured by the process |
US8512619B2 (en) * | 2010-12-06 | 2013-08-20 | Nike, Inc. | Methods for manufacturing a golf ball |
JP2015119038A (en) * | 2013-12-18 | 2015-06-25 | ルネサスエレクトロニクス株式会社 | Semiconductor device |
US9427893B2 (en) | 2014-09-18 | 2016-08-30 | Asm Technology Singapore Pte Ltd | Molding press and a platen for a molding press |
CN107000282B (en) | 2014-12-01 | 2019-11-26 | 沙特基础工业全球技术有限公司 | Block mold |
-
2016
- 2016-07-19 US US15/213,576 patent/US10960583B2/en active Active
-
2017
- 2017-07-06 TW TW106122619A patent/TWI650838B/en active
- 2017-07-10 MY MYPI2017001021A patent/MY192578A/en unknown
- 2017-07-12 SG SG10201705722UA patent/SG10201705722UA/en unknown
- 2017-07-17 CN CN201710581588.8A patent/CN107634016B/en active Active
- 2017-07-18 KR KR1020170091043A patent/KR101964034B1/en active IP Right Grant
- 2017-07-19 PH PH12017000208A patent/PH12017000208B1/en unknown
Also Published As
Publication number | Publication date |
---|---|
US20180021993A1 (en) | 2018-01-25 |
CN107634016B (en) | 2021-07-09 |
PH12017000208A1 (en) | 2018-07-23 |
KR101964034B1 (en) | 2019-04-02 |
TWI650838B (en) | 2019-02-11 |
PH12017000208B1 (en) | 2018-07-23 |
KR20180009722A (en) | 2018-01-29 |
CN107634016A (en) | 2018-01-26 |
TW201810558A (en) | 2018-03-16 |
MY192578A (en) | 2022-08-29 |
US10960583B2 (en) | 2021-03-30 |
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