EP3429762A4 - Method for depositing a functional material on a substrate - Google Patents

Method for depositing a functional material on a substrate Download PDF

Info

Publication number
EP3429762A4
EP3429762A4 EP16894747.1A EP16894747A EP3429762A4 EP 3429762 A4 EP3429762 A4 EP 3429762A4 EP 16894747 A EP16894747 A EP 16894747A EP 3429762 A4 EP3429762 A4 EP 3429762A4
Authority
EP
European Patent Office
Prior art keywords
depositing
substrate
functional material
functional
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
EP16894747.1A
Other languages
German (de)
French (fr)
Other versions
EP3429762A1 (en
Inventor
Rob Jacob HENDRIKS
Kurt A. SCRODER
Charles C. MUNSON
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NCC Nano LLC
Original Assignee
NCC Nano LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NCC Nano LLC filed Critical NCC Nano LLC
Publication of EP3429762A1 publication Critical patent/EP3429762A1/en
Publication of EP3429762A4 publication Critical patent/EP3429762A4/en
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/048—Coating on selected surface areas, e.g. using masks using irradiation by energy or particles
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/28—Vacuum evaporation by wave energy or particle radiation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/207—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using a prefabricated paste pattern, ink pattern or powder pattern
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/28—Processes for applying liquids or other fluent materials performed by transfer from the surfaces of elements carrying the liquid or other fluent material, e.g. brushes, pads, rollers
    • B05D1/286—Processes for applying liquids or other fluent materials performed by transfer from the surfaces of elements carrying the liquid or other fluent material, e.g. brushes, pads, rollers using a temporary backing to which the coating has been applied
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B05D3/06—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to radiation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1275—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by other printing techniques, e.g. letterpress printing, intaglio printing, lithographic printing, offset printing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/162—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using laser ablation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/18—Deposition of organic active material using non-liquid printing techniques, e.g. thermal transfer printing from a donor sheet

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
  • Electroluminescent Light Sources (AREA)
EP16894747.1A 2016-03-16 2016-03-16 Method for depositing a functional material on a substrate Pending EP3429762A4 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/US2016/022701 WO2017160288A1 (en) 2016-03-16 2016-03-16 Method for depositing a functional material on a substrate

Publications (2)

Publication Number Publication Date
EP3429762A1 EP3429762A1 (en) 2019-01-23
EP3429762A4 true EP3429762A4 (en) 2020-05-06

Family

ID=59852315

Family Applications (1)

Application Number Title Priority Date Filing Date
EP16894747.1A Pending EP3429762A4 (en) 2016-03-16 2016-03-16 Method for depositing a functional material on a substrate

Country Status (5)

Country Link
EP (1) EP3429762A4 (en)
KR (1) KR102270021B1 (en)
CN (1) CN109153037B (en)
CA (1) CA3019902C (en)
WO (1) WO2017160288A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20220004975A (en) * 2019-05-01 2022-01-12 아이오 테크 그룹 엘티디. How to use 3D printing to electrically connect a chip to a top connector
EP3928966A1 (en) 2020-06-26 2021-12-29 Carl Zeiss Vision International GmbH Method for manufacturing a coated lens

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009153792A2 (en) * 2008-06-19 2009-12-23 Utilight Ltd. Light induced patterning
EP2660352A1 (en) * 2012-05-02 2013-11-06 Nederlandse Organisatie voor toegepast -natuurwetenschappelijk onderzoek TNO Donor sheet and method for light induced forward transfer manufacturing

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3815993A (en) * 1972-02-15 1974-06-11 M Tarabocchia Light projection apparatus and method for photoprinting
DE19640594B4 (en) * 1996-10-01 2016-08-04 Osram Gmbh module
US6160824A (en) * 1998-11-02 2000-12-12 Maxios Laser Corporation Laser-pumped compound waveguide lasers and amplifiers
WO2000044960A1 (en) * 1999-01-27 2000-08-03 The United States Of America, As Represented By The Secretary Of The Navy Matrix assisted pulsed laser evaporation direct write
US7463154B2 (en) * 2001-04-30 2008-12-09 Neology, Inc. Selective metal removal process for metallized retro-reflective and holographic films and radio frequency devices made therewith
JP4344270B2 (en) * 2003-05-30 2009-10-14 セイコーエプソン株式会社 Manufacturing method of liquid crystal display device
US8114504B2 (en) * 2005-11-08 2012-02-14 Toray Industires, Inc. Polyester laminated film and transfer foil
KR101689519B1 (en) * 2007-12-26 2016-12-26 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Evaporation donor substrate, method for manufacturing the same, and method for manufacturing light-emitting device
WO2009094176A2 (en) * 2008-01-25 2009-07-30 Nanogram Corporation Layer transfer for large area inorganic foils
KR100945035B1 (en) * 2008-01-29 2010-03-05 재단법인서울대학교산학협력재단 Tungstates based visible-light induced oxides photocatalysts and synthesis methods thereof
JP5292263B2 (en) * 2008-12-05 2013-09-18 株式会社半導体エネルギー研究所 Film forming method and light emitting element manufacturing method
EP2412007B1 (en) * 2009-03-27 2020-07-22 Ishihara Chemical Co., Ltd. Buffer layer to enhance photo and/or laser sintering
US8382270B2 (en) * 2010-06-14 2013-02-26 Xerox Corporation Contact leveling using low surface tension aqueous solutions
CN103238374B (en) * 2010-12-27 2015-06-24 夏普株式会社 Vapor deposition apparatus, vapor deposition method, and organic electroluminescence (EL) display apparatus
KR20140140188A (en) * 2013-05-28 2014-12-09 삼성디스플레이 주식회사 Donor substrate, method for fabricating the same and method for forming transfer pattern using the same

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009153792A2 (en) * 2008-06-19 2009-12-23 Utilight Ltd. Light induced patterning
EP2660352A1 (en) * 2012-05-02 2013-11-06 Nederlandse Organisatie voor toegepast -natuurwetenschappelijk onderzoek TNO Donor sheet and method for light induced forward transfer manufacturing

Also Published As

Publication number Publication date
KR102270021B1 (en) 2021-06-28
WO2017160288A1 (en) 2017-09-21
CA3019902C (en) 2022-06-21
CA3019902A1 (en) 2017-09-21
CN109153037B (en) 2022-09-30
EP3429762A1 (en) 2019-01-23
CN109153037A (en) 2019-01-04
KR20180134902A (en) 2018-12-19

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