SG10201700727YA - Methods and apparatus for delivering process gases to a substrate - Google Patents
Methods and apparatus for delivering process gases to a substrateInfo
- Publication number
- SG10201700727YA SG10201700727YA SG10201700727YA SG10201700727YA SG10201700727YA SG 10201700727Y A SG10201700727Y A SG 10201700727YA SG 10201700727Y A SG10201700727Y A SG 10201700727YA SG 10201700727Y A SG10201700727Y A SG 10201700727YA SG 10201700727Y A SG10201700727Y A SG 10201700727YA
- Authority
- SG
- Singapore
- Prior art keywords
- substrate
- methods
- process gases
- delivering process
- delivering
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/24—Deposition of silicon only
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/001—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work incorporating means for heating or cooling the liquid or other fluent material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45563—Gas nozzles
- C23C16/45578—Elongated nozzles, tubes with holes
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B25/00—Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
- C30B25/02—Epitaxial-layer growth
- C30B25/14—Feed and outlet means for the gases; Modifying the flow of the reactive gases
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201261676403P | 2012-07-27 | 2012-07-27 | |
US13/939,591 US10486183B2 (en) | 2012-07-27 | 2013-07-11 | Methods and apparatus for delivering process gases to a substrate |
Publications (1)
Publication Number | Publication Date |
---|---|
SG10201700727YA true SG10201700727YA (en) | 2017-02-27 |
Family
ID=49995147
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG10201700727YA SG10201700727YA (en) | 2012-07-27 | 2013-07-11 | Methods and apparatus for delivering process gases to a substrate |
SG11201500106QA SG11201500106QA (en) | 2012-07-27 | 2013-07-11 | Methods and apparatus for delivering process gases to a substrate |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201500106QA SG11201500106QA (en) | 2012-07-27 | 2013-07-11 | Methods and apparatus for delivering process gases to a substrate |
Country Status (7)
Country | Link |
---|---|
US (1) | US10486183B2 (en) |
KR (1) | KR20150038406A (en) |
CN (1) | CN104471678B (en) |
DE (1) | DE112013003706T5 (en) |
SG (2) | SG10201700727YA (en) |
TW (1) | TWI600787B (en) |
WO (1) | WO2014018275A1 (en) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9499905B2 (en) * | 2011-07-22 | 2016-11-22 | Applied Materials, Inc. | Methods and apparatus for the deposition of materials on a substrate |
KR101440911B1 (en) * | 2012-06-18 | 2014-09-18 | 주식회사 유진테크 | Apparatus for depositing on substrate |
US10174422B2 (en) | 2012-10-25 | 2019-01-08 | Applied Materials, Inc. | Apparatus for selective gas injection and extraction |
CN105981133B (en) * | 2014-02-14 | 2019-06-28 | 应用材料公司 | Top dome with fill assembly |
KR102462931B1 (en) | 2015-10-30 | 2022-11-04 | 삼성전자주식회사 | Gas Supply Unit and Substrate Treating Apparatus |
US10249525B2 (en) * | 2016-10-03 | 2019-04-02 | Applied Materials, Inc. | Dynamic leveling process heater lift |
US11532459B2 (en) * | 2017-11-09 | 2022-12-20 | Taiwan Semiconductor Manufacturing Co., Ltd. | Chemical vapor deposition apparatus with cleaning gas flow guiding member |
US11834743B2 (en) * | 2018-09-14 | 2023-12-05 | Applied Materials, Inc. | Segmented showerhead for uniform delivery of multiple precursors |
KR20210129598A (en) * | 2020-04-17 | 2021-10-28 | 에이에스엠 아이피 홀딩 비.브이. | Injector configured for arrangement within a reactor of a vertical furnace and vertical furnace |
Family Cites Families (29)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR0170391B1 (en) * | 1989-06-16 | 1999-03-30 | 다카시마 히로시 | Processing apparatus with a gas distributor having back and forth parallel movement relative to a workpiece support |
US5728253A (en) * | 1993-03-04 | 1998-03-17 | Tokyo Electron Limited | Method and devices for detecting the end point of plasma process |
US6527865B1 (en) * | 1997-09-11 | 2003-03-04 | Applied Materials, Inc. | Temperature controlled gas feedthrough |
US6499425B1 (en) * | 1999-01-22 | 2002-12-31 | Micron Technology, Inc. | Quasi-remote plasma processing method and apparatus |
TW200819555A (en) * | 2000-09-08 | 2008-05-01 | Tokyo Electron Ltd | Shower head structure, device and method for film formation, and method for cleaning |
US20030024900A1 (en) | 2001-07-24 | 2003-02-06 | Tokyo Electron Limited | Variable aspect ratio plasma source |
JP2004111857A (en) | 2002-09-20 | 2004-04-08 | Dainippon Screen Mfg Co Ltd | Wafer treating system |
US20040082251A1 (en) * | 2002-10-29 | 2004-04-29 | Applied Materials, Inc. | Apparatus for adjustable gas distribution for semiconductor substrate processing |
US7699932B2 (en) * | 2004-06-02 | 2010-04-20 | Micron Technology, Inc. | Reactors, systems and methods for depositing thin films onto microfeature workpieces |
US8815014B2 (en) * | 2005-11-18 | 2014-08-26 | Tokyo Electron Limited | Method and system for performing different deposition processes within a single chamber |
KR100849366B1 (en) | 2006-08-24 | 2008-07-31 | 세메스 주식회사 | Apparatus and method for treating substrate |
US20080066738A1 (en) * | 2006-09-19 | 2008-03-20 | Landis Harry M | Double-walled solar heater apparatus and method for use |
JP5090089B2 (en) | 2006-10-19 | 2012-12-05 | 大日本スクリーン製造株式会社 | Substrate processing equipment |
KR100842745B1 (en) * | 2006-11-30 | 2008-07-01 | 주식회사 하이닉스반도체 | Apparatus and methods of plasma processing by using scan injectors |
JP2008182131A (en) | 2007-01-26 | 2008-08-07 | Fujimori Gijutsu Kenkyusho:Kk | Vapor dryer |
US8057601B2 (en) | 2007-05-09 | 2011-11-15 | Applied Materials, Inc. | Apparatus and method for supporting, positioning and rotating a substrate in a processing chamber |
KR20090028223A (en) | 2007-09-14 | 2009-03-18 | 세메스 주식회사 | Apparatus and method for treating substrate, and apparatus for synthesis of carbon-nano-tube |
JP5117365B2 (en) * | 2008-02-15 | 2013-01-16 | 東京エレクトロン株式会社 | Substrate processing apparatus, substrate processing method, and storage medium |
US8111978B2 (en) | 2008-07-11 | 2012-02-07 | Applied Materials, Inc. | Rapid thermal processing chamber with shower head |
TWI437622B (en) | 2008-11-26 | 2014-05-11 | Ind Tech Res Inst | Gas shower module |
CN101748384B (en) * | 2008-12-03 | 2012-07-11 | 财团法人工业技术研究院 | Gas distribution sprinkling module |
US8298372B2 (en) | 2009-04-20 | 2012-10-30 | Applied Materials, Inc. | Quartz window having gas feed and processing equipment incorporating same |
US8967082B2 (en) * | 2009-09-17 | 2015-03-03 | Tokyo Electron Limited | Plasma processing apparatus and gas supply device for plasma processing apparatus |
CN102051595B (en) * | 2009-10-29 | 2013-04-03 | 无锡华润上华半导体有限公司 | Chemical vapor deposition device and spray nozzle thereof |
US8721791B2 (en) * | 2010-07-28 | 2014-05-13 | Applied Materials, Inc. | Showerhead support structure for improved gas flow |
JP2012084648A (en) | 2010-10-08 | 2012-04-26 | Toshiba Corp | Gas piping member, gas piping |
CN102485257B (en) | 2010-12-03 | 2013-10-09 | 天津中新药业集团股份有限公司第六中药厂 | Chinese medicinal composition with lung ventilating, stagnated qi dispersing, heat clearing and phlegm eliminating effects and its preparation method |
CN102485357B (en) * | 2010-12-03 | 2014-11-05 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Method and device for cleaning support plate and substrate film-plating device |
US9499905B2 (en) * | 2011-07-22 | 2016-11-22 | Applied Materials, Inc. | Methods and apparatus for the deposition of materials on a substrate |
-
2013
- 2013-07-11 CN CN201380038184.4A patent/CN104471678B/en not_active Expired - Fee Related
- 2013-07-11 KR KR20157005031A patent/KR20150038406A/en active IP Right Grant
- 2013-07-11 WO PCT/US2013/050092 patent/WO2014018275A1/en active Application Filing
- 2013-07-11 DE DE112013003706.8T patent/DE112013003706T5/en not_active Withdrawn
- 2013-07-11 SG SG10201700727YA patent/SG10201700727YA/en unknown
- 2013-07-11 US US13/939,591 patent/US10486183B2/en active Active
- 2013-07-11 SG SG11201500106QA patent/SG11201500106QA/en unknown
- 2013-07-15 TW TW102125247A patent/TWI600787B/en not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
TWI600787B (en) | 2017-10-01 |
SG11201500106QA (en) | 2015-03-30 |
CN104471678B (en) | 2018-06-29 |
DE112013003706T5 (en) | 2015-04-09 |
US20140030433A1 (en) | 2014-01-30 |
TW201406989A (en) | 2014-02-16 |
US10486183B2 (en) | 2019-11-26 |
KR20150038406A (en) | 2015-04-08 |
WO2014018275A1 (en) | 2014-01-30 |
CN104471678A (en) | 2015-03-25 |
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