SG10201607092VA - Defect Inspecting Method, Sorting Method and Producing Method for Photomask Blank - Google Patents

Defect Inspecting Method, Sorting Method and Producing Method for Photomask Blank

Info

Publication number
SG10201607092VA
SG10201607092VA SG10201607092VA SG10201607092VA SG10201607092VA SG 10201607092V A SG10201607092V A SG 10201607092VA SG 10201607092V A SG10201607092V A SG 10201607092VA SG 10201607092V A SG10201607092V A SG 10201607092VA SG 10201607092V A SG10201607092V A SG 10201607092VA
Authority
SG
Singapore
Prior art keywords
photomask blank
sorting
defect inspecting
producing
producing method
Prior art date
Application number
SG10201607092VA
Inventor
Tsuneo Terasawa
Atsushi Yokohata
Daisuke Iwai
Takahiro Kishita
Hiroshi Fukuda
Original Assignee
Shinetsu Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinetsu Chemical Co filed Critical Shinetsu Chemical Co
Publication of SG10201607092VA publication Critical patent/SG10201607092VA/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70616—Monitoring the printed patterns
    • G03F7/7065—Defects, e.g. optical inspection of patterned layer for defects
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
    • G03F1/82—Auxiliary processes, e.g. cleaning or inspecting
    • G03F1/84—Inspecting
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/22—Masks or mask blanks for imaging by radiation of 100nm or shorter wavelength, e.g. X-ray masks, extreme ultraviolet [EUV] masks; Preparation thereof
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/50—Mask blanks not covered by G03F1/20 - G03F1/34; Preparation thereof
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
    • G03F7/2004—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image characterised by the use of a particular light source, e.g. fluorescent lamps or deep UV light
    • G03F7/2006—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image characterised by the use of a particular light source, e.g. fluorescent lamps or deep UV light using coherent light; using polarised light
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70616—Monitoring the printed patterns
    • G03F7/70641—Focus
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N2021/95676—Masks, reticles, shadow masks

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Biochemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Signal Processing (AREA)
  • Engineering & Computer Science (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
SG10201607092VA 2015-09-04 2016-08-25 Defect Inspecting Method, Sorting Method and Producing Method for Photomask Blank SG10201607092VA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2015174684A JP6394544B2 (en) 2015-09-04 2015-09-04 Photomask blank defect inspection method, sorting method, and manufacturing method

Publications (1)

Publication Number Publication Date
SG10201607092VA true SG10201607092VA (en) 2017-04-27

Family

ID=56787381

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201607092VA SG10201607092VA (en) 2015-09-04 2016-08-25 Defect Inspecting Method, Sorting Method and Producing Method for Photomask Blank

Country Status (7)

Country Link
US (1) US9829442B2 (en)
EP (1) EP3139213B1 (en)
JP (1) JP6394544B2 (en)
KR (1) KR101930996B1 (en)
CN (1) CN106502046B (en)
SG (1) SG10201607092VA (en)
TW (1) TWI639052B (en)

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EP3355115B1 (en) 2017-01-26 2022-08-31 Shin-Etsu Chemical Co., Ltd. Methods and system for defect inspection, sorting and manufacturing photomask blanks
JP6791031B2 (en) 2017-06-13 2020-11-25 信越化学工業株式会社 Photomask blank and its manufacturing method
JP6753375B2 (en) * 2017-07-28 2020-09-09 信越化学工業株式会社 Photomask blank, photomask blank manufacturing method and photomask manufacturing method
CN107632495B (en) * 2017-08-16 2020-11-03 上海华力微电子有限公司 Mask plate tiny dust influence assessment method and system
KR102027156B1 (en) * 2017-10-24 2019-10-01 한국기계연구원 Apparatus for Confocal lithography
US11218675B2 (en) * 2018-03-02 2022-01-04 Sony Corporation Information processing apparatus, computation method of information processing apparatus, and program
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JP6675433B2 (en) * 2018-04-25 2020-04-01 信越化学工業株式会社 Defect classification method, photomask blank sorting method, and mask blank manufacturing method
JP7017475B2 (en) * 2018-06-19 2022-02-08 信越化学工業株式会社 Photomask blank-related evaluation method of surface condition of substrate
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JP7320416B2 (en) * 2018-09-28 2023-08-03 Hoya株式会社 Photomask substrate repair method, photomask substrate manufacturing method, photomask substrate processing method, photomask substrate, photomask manufacturing method, and substrate processing apparatus
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CN114450580A (en) * 2019-10-02 2022-05-06 柯尼卡美能达株式会社 Workpiece surface defect detection device and detection method, workpiece surface inspection system, and program

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US6617603B2 (en) 2001-03-06 2003-09-09 Hitachi Electronics Engineering Co., Ltd. Surface defect tester
JP4084580B2 (en) * 2001-03-06 2008-04-30 株式会社日立ハイテクノロジーズ Surface defect inspection equipment
JP2005265736A (en) * 2004-03-22 2005-09-29 Toshiba Corp Mask flaw inspection device
JP4204583B2 (en) 2005-10-24 2009-01-07 信越化学工業株式会社 Photomask blank manufacturing method
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Also Published As

Publication number Publication date
CN106502046A (en) 2017-03-15
TWI639052B (en) 2018-10-21
KR20170028847A (en) 2017-03-14
EP3139213A3 (en) 2017-05-10
EP3139213A2 (en) 2017-03-08
TW201723646A (en) 2017-07-01
US20170068158A1 (en) 2017-03-09
KR101930996B1 (en) 2018-12-19
CN106502046B (en) 2021-08-03
EP3139213B1 (en) 2018-05-09
US9829442B2 (en) 2017-11-28
JP2017049207A (en) 2017-03-09
JP6394544B2 (en) 2018-09-26

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