SG10201604606RA - Methods To Improve Laser Mark Contrast On Die Backside Film In Embedded Die Packages - Google Patents

Methods To Improve Laser Mark Contrast On Die Backside Film In Embedded Die Packages

Info

Publication number
SG10201604606RA
SG10201604606RA SG10201604606RA SG10201604606RA SG10201604606RA SG 10201604606R A SG10201604606R A SG 10201604606RA SG 10201604606R A SG10201604606R A SG 10201604606RA SG 10201604606R A SG10201604606R A SG 10201604606RA SG 10201604606R A SG10201604606R A SG 10201604606RA
Authority
SG
Singapore
Prior art keywords
die
methods
laser mark
backside film
improve laser
Prior art date
Application number
SG10201604606RA
Inventor
Mihir A Oka
Rahul N Manepalli
Dingying Xu
Yosuke Kanaoka
Sergei L Voronov
Dong Hai Sun
Original Assignee
Intel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Intel Corp filed Critical Intel Corp
Publication of SG10201604606RA publication Critical patent/SG10201604606RA/en

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    • HELECTRICITY
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    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
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    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814Conductive parts
    • H01L21/4846Leads on or in insulating or insulated substrates, e.g. metallisation
    • H01L21/486Via connections through the substrate with or without pins
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    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
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    • H01L23/498Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
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    • H01L23/5389Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates the chips being integrally enclosed by the interconnect and support structures
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    • H01L2924/11Device type
    • H01L2924/12Passive devices, e.g. 2 terminal devices
    • H01L2924/1204Optical Diode
    • H01L2924/12042LASER
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    • H01L2924/30107Inductance

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Ceramic Engineering (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Laser Beam Processing (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
SG10201604606RA 2012-12-21 2013-12-06 Methods To Improve Laser Mark Contrast On Die Backside Film In Embedded Die Packages SG10201604606RA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US13/725,539 US20140175657A1 (en) 2012-12-21 2012-12-21 Methods to improve laser mark contrast on die backside film in embedded die packages

Publications (1)

Publication Number Publication Date
SG10201604606RA true SG10201604606RA (en) 2016-07-28

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Application Number Title Priority Date Filing Date
SG2013090667A SG2013090667A (en) 2012-12-21 2013-12-06 Methods to improve laser mark contrast on die backside film in embedded die packages
SG10201604606RA SG10201604606RA (en) 2012-12-21 2013-12-06 Methods To Improve Laser Mark Contrast On Die Backside Film In Embedded Die Packages

Family Applications Before (1)

Application Number Title Priority Date Filing Date
SG2013090667A SG2013090667A (en) 2012-12-21 2013-12-06 Methods to improve laser mark contrast on die backside film in embedded die packages

Country Status (5)

Country Link
US (1) US20140175657A1 (en)
KR (3) KR20140081692A (en)
CN (1) CN103887281B (en)
SG (2) SG2013090667A (en)
TW (1) TWI556378B (en)

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CN103887281B (en) 2018-02-23
US20140175657A1 (en) 2014-06-26
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TWI556378B (en) 2016-11-01
KR20140081692A (en) 2014-07-01
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KR20170007229A (en) 2017-01-18
CN103887281A (en) 2014-06-25

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