SG10201604606RA - Methods To Improve Laser Mark Contrast On Die Backside Film In Embedded Die Packages - Google Patents
Methods To Improve Laser Mark Contrast On Die Backside Film In Embedded Die PackagesInfo
- Publication number
- SG10201604606RA SG10201604606RA SG10201604606RA SG10201604606RA SG10201604606RA SG 10201604606R A SG10201604606R A SG 10201604606RA SG 10201604606R A SG10201604606R A SG 10201604606RA SG 10201604606R A SG10201604606R A SG 10201604606RA SG 10201604606R A SG10201604606R A SG 10201604606RA
- Authority
- SG
- Singapore
- Prior art keywords
- die
- methods
- laser mark
- backside film
- improve laser
- Prior art date
Links
Classifications
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- H—ELECTRICITY
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- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
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- H01L21/486—Via connections through the substrate with or without pins
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- H01L23/5389—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates the chips being integrally enclosed by the interconnect and support structures
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Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Ceramic Engineering (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Laser Beam Processing (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US13/725,539 US20140175657A1 (en) | 2012-12-21 | 2012-12-21 | Methods to improve laser mark contrast on die backside film in embedded die packages |
Publications (1)
Publication Number | Publication Date |
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SG10201604606RA true SG10201604606RA (en) | 2016-07-28 |
Family
ID=50956106
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG2013090667A SG2013090667A (en) | 2012-12-21 | 2013-12-06 | Methods to improve laser mark contrast on die backside film in embedded die packages |
SG10201604606RA SG10201604606RA (en) | 2012-12-21 | 2013-12-06 | Methods To Improve Laser Mark Contrast On Die Backside Film In Embedded Die Packages |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG2013090667A SG2013090667A (en) | 2012-12-21 | 2013-12-06 | Methods to improve laser mark contrast on die backside film in embedded die packages |
Country Status (5)
Country | Link |
---|---|
US (1) | US20140175657A1 (en) |
KR (3) | KR20140081692A (en) |
CN (1) | CN103887281B (en) |
SG (2) | SG2013090667A (en) |
TW (1) | TWI556378B (en) |
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US8836136B2 (en) | 2011-10-17 | 2014-09-16 | Invensas Corporation | Package-on-package assembly with wire bond vias |
US8946757B2 (en) | 2012-02-17 | 2015-02-03 | Invensas Corporation | Heat spreading substrate with embedded interconnects |
US8835228B2 (en) | 2012-05-22 | 2014-09-16 | Invensas Corporation | Substrate-less stackable package with wire-bond interconnect |
US9502390B2 (en) | 2012-08-03 | 2016-11-22 | Invensas Corporation | BVA interposer |
US9167710B2 (en) | 2013-08-07 | 2015-10-20 | Invensas Corporation | Embedded packaging with preformed vias |
US20150076714A1 (en) | 2013-09-16 | 2015-03-19 | Invensas Corporation | Microelectronic element with bond elements to encapsulation surface |
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US9583411B2 (en) | 2014-01-17 | 2017-02-28 | Invensas Corporation | Fine pitch BVA using reconstituted wafer with area array accessible for testing |
US9589900B2 (en) * | 2014-02-27 | 2017-03-07 | Taiwan Semiconductor Manufacturing Company, Ltd. | Metal pad for laser marking |
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CN104779220A (en) * | 2015-03-27 | 2015-07-15 | 矽力杰半导体技术(杭州)有限公司 | Chip packaging structure and manufacture method thereof |
US9502372B1 (en) | 2015-04-30 | 2016-11-22 | Invensas Corporation | Wafer-level packaging using wire bond wires in place of a redistribution layer |
US9761554B2 (en) | 2015-05-07 | 2017-09-12 | Invensas Corporation | Ball bonding metal wire bond wires to metal pads |
US9490222B1 (en) | 2015-10-12 | 2016-11-08 | Invensas Corporation | Wire bond wires for interference shielding |
US10490528B2 (en) | 2015-10-12 | 2019-11-26 | Invensas Corporation | Embedded wire bond wires |
US10181457B2 (en) | 2015-10-26 | 2019-01-15 | Invensas Corporation | Microelectronic package for wafer-level chip scale packaging with fan-out |
US10043779B2 (en) | 2015-11-17 | 2018-08-07 | Invensas Corporation | Packaged microelectronic device for a package-on-package device |
US9984992B2 (en) | 2015-12-30 | 2018-05-29 | Invensas Corporation | Embedded wire bond wires for vertical integration with separate surface mount and wire bond mounting surfaces |
KR102503892B1 (en) | 2015-12-31 | 2023-02-28 | 삼성전자주식회사 | Package on package typed semiconducotor packages and methods for fabricating the same |
TWI579984B (en) * | 2016-02-05 | 2017-04-21 | Siliconware Precision Industries Co Ltd | Electronic package and method for fabricating the same |
CN109314064B (en) | 2016-04-11 | 2022-05-17 | 奥特斯奥地利科技与系统技术有限公司 | Mass production of component carriers |
US9935075B2 (en) | 2016-07-29 | 2018-04-03 | Invensas Corporation | Wire bonding method and apparatus for electromagnetic interference shielding |
US10299368B2 (en) | 2016-12-21 | 2019-05-21 | Invensas Corporation | Surface integrated waveguides and circuit structures therefor |
US10535812B2 (en) * | 2017-09-04 | 2020-01-14 | Rohm Co., Ltd. | Semiconductor device |
CN108183096A (en) * | 2017-12-14 | 2018-06-19 | 湖北方晶电子科技有限责任公司 | Encapsulating structure and preparation method thereof |
US11328995B2 (en) * | 2019-03-04 | 2022-05-10 | Kabushiki Kaisha Toshiba | Semiconductor device |
KR20220070877A (en) | 2020-11-23 | 2022-05-31 | 삼성전자주식회사 | Semiconductor package |
CN115312393A (en) * | 2022-07-12 | 2022-11-08 | 天芯互联科技有限公司 | Packaging method and package |
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Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8253230B2 (en) * | 2008-05-15 | 2012-08-28 | Micron Technology, Inc. | Disabling electrical connections using pass-through 3D interconnects and associated systems and methods |
CN102318059A (en) * | 2009-02-12 | 2012-01-11 | 住友电木株式会社 | Semiconductor protection film-forming film with dicing sheet, method for manufacturing semiconductor device using same,and semiconductor device |
CN101924055A (en) * | 2009-06-15 | 2010-12-22 | 日东电工株式会社 | Dicing tape-integrated film for semiconductor back surface |
US8287996B2 (en) * | 2009-12-21 | 2012-10-16 | Intel Corporation | Coating for a microelectronic device, treatment comprising same, and method of managing a thermal profile of a microelectronic die |
US8319318B2 (en) * | 2010-04-06 | 2012-11-27 | Intel Corporation | Forming metal filled die back-side film for electromagnetic interference shielding with coreless packages |
US8754516B2 (en) * | 2010-08-26 | 2014-06-17 | Intel Corporation | Bumpless build-up layer package with pre-stacked microelectronic devices |
-
2012
- 2012-12-21 US US13/725,539 patent/US20140175657A1/en not_active Abandoned
-
2013
- 2013-11-14 TW TW102141485A patent/TWI556378B/en not_active IP Right Cessation
- 2013-12-06 SG SG2013090667A patent/SG2013090667A/en unknown
- 2013-12-06 SG SG10201604606RA patent/SG10201604606RA/en unknown
- 2013-12-17 KR KR1020130157345A patent/KR20140081692A/en not_active Application Discontinuation
- 2013-12-20 CN CN201310713691.5A patent/CN103887281B/en not_active Expired - Fee Related
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2016
- 2016-12-29 KR KR1020160182703A patent/KR20170007229A/en active Application Filing
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2018
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CN103887281B (en) | 2018-02-23 |
US20140175657A1 (en) | 2014-06-26 |
TW201436135A (en) | 2014-09-16 |
TWI556378B (en) | 2016-11-01 |
KR20140081692A (en) | 2014-07-01 |
KR20180028065A (en) | 2018-03-15 |
KR20170007229A (en) | 2017-01-18 |
CN103887281A (en) | 2014-06-25 |
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