SG10201600790YA - Probe head and upper guider plate - Google Patents
Probe head and upper guider plateInfo
- Publication number
- SG10201600790YA SG10201600790YA SG10201600790YA SG10201600790YA SG10201600790YA SG 10201600790Y A SG10201600790Y A SG 10201600790YA SG 10201600790Y A SG10201600790Y A SG 10201600790YA SG 10201600790Y A SG10201600790Y A SG 10201600790YA SG 10201600790Y A SG10201600790Y A SG 10201600790YA
- Authority
- SG
- Singapore
- Prior art keywords
- probe head
- upper guider
- guider plate
- plate
- probe
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07357—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with flexible bodies, e.g. buckling beams
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
- G01R31/2889—Interfaces, e.g. between probe and tester
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Measuring Leads Or Probes (AREA)
- Engineering & Computer Science (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW104103716A TWI530691B (zh) | 2015-02-04 | 2015-02-04 | 探針頭及上導板 |
Publications (1)
Publication Number | Publication Date |
---|---|
SG10201600790YA true SG10201600790YA (en) | 2016-09-29 |
Family
ID=56361504
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG10201600790YA SG10201600790YA (en) | 2015-02-04 | 2016-02-02 | Probe head and upper guider plate |
Country Status (4)
Country | Link |
---|---|
US (1) | US20160223590A1 (zh) |
CN (1) | CN105842605A (zh) |
SG (1) | SG10201600790YA (zh) |
TW (1) | TWI530691B (zh) |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI576591B (zh) * | 2016-02-03 | 2017-04-01 | 京元電子股份有限公司 | 探針卡組裝結構與其組裝方法、以及由該探針卡組裝結構取出斷針的方法 |
TWI603090B (zh) * | 2016-09-06 | 2017-10-21 | Mpi Corp | A vertical probe, a method of manufacturing the same, and a probe head and a probe card using the same |
IT201600124017A1 (it) * | 2016-12-06 | 2018-06-06 | Technoprobe Spa | Testa di misura di un’apparecchiatura di test di dispositivi elettronici e relativo metodo di fabbricazione |
WO2018118075A1 (en) | 2016-12-23 | 2018-06-28 | Intel Corporation | Fine pitch probe card methods and systems |
US11268983B2 (en) | 2017-06-30 | 2022-03-08 | Intel Corporation | Chevron interconnect for very fine pitch probing |
US10775414B2 (en) | 2017-09-29 | 2020-09-15 | Intel Corporation | Low-profile gimbal platform for high-resolution in situ co-planarity adjustment |
US11061068B2 (en) | 2017-12-05 | 2021-07-13 | Intel Corporation | Multi-member test probe structure |
US11204555B2 (en) | 2017-12-28 | 2021-12-21 | Intel Corporation | Method and apparatus to develop lithographically defined high aspect ratio interconnects |
US10488438B2 (en) | 2018-01-05 | 2019-11-26 | Intel Corporation | High density and fine pitch interconnect structures in an electric test apparatus |
CN110068711B (zh) * | 2018-01-24 | 2022-04-26 | 台湾中华精测科技股份有限公司 | 探针卡装置及矩形探针 |
CN110389241B (zh) * | 2018-04-16 | 2021-07-20 | 中华精测科技股份有限公司 | 探针座及其矩形探针 |
TW202006366A (zh) * | 2018-07-04 | 2020-02-01 | 旺矽科技股份有限公司 | 具有線型探針之探針頭 |
US11543454B2 (en) * | 2018-09-25 | 2023-01-03 | Intel Corporation | Double-beam test probe |
US10935573B2 (en) | 2018-09-28 | 2021-03-02 | Intel Corporation | Slip-plane MEMS probe for high-density and fine pitch interconnects |
KR102329790B1 (ko) * | 2019-12-26 | 2021-11-23 | 주식회사 에스디에이 | 가변형 mems 프로브 카드 및 이의 조립방법 |
TWI722822B (zh) * | 2020-03-10 | 2021-03-21 | 中華精測科技股份有限公司 | 垂直式探針頭及其雙臂式探針 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20070007974A1 (en) * | 2005-07-05 | 2007-01-11 | Jinn-Tong Chiu | Method for reducing integral stress of a vertical probe with specific structure |
JP4673280B2 (ja) * | 2006-11-09 | 2011-04-20 | 東京エレクトロン株式会社 | 固体撮像素子の検査用プローブカード |
US7554348B2 (en) * | 2007-06-29 | 2009-06-30 | Wentworth Laboratories, Inc. | Multi-offset die head |
KR101106970B1 (ko) * | 2007-07-03 | 2012-01-20 | 가부시키가이샤 아드반테스트 | 프로브, 프로브 카드 및 프로브의 제조방법 |
US8033012B2 (en) * | 2008-03-07 | 2011-10-11 | Taiwan Semiconductor Manufacturing Co., Ltd. | Method for fabricating a semiconductor test probe card space transformer |
EP2534509B1 (en) * | 2010-02-10 | 2019-07-24 | 3M Innovative Properties Company | Illumination device having viscoelastic layer |
-
2015
- 2015-02-04 TW TW104103716A patent/TWI530691B/zh not_active IP Right Cessation
-
2016
- 2016-01-21 CN CN201610041670.7A patent/CN105842605A/zh active Pending
- 2016-02-01 US US15/012,093 patent/US20160223590A1/en not_active Abandoned
- 2016-02-02 SG SG10201600790YA patent/SG10201600790YA/en unknown
Also Published As
Publication number | Publication date |
---|---|
TWI530691B (zh) | 2016-04-21 |
CN105842605A (zh) | 2016-08-10 |
TW201629495A (zh) | 2016-08-16 |
US20160223590A1 (en) | 2016-08-04 |
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