SG10201600790YA - Probe head and upper guider plate - Google Patents

Probe head and upper guider plate

Info

Publication number
SG10201600790YA
SG10201600790YA SG10201600790YA SG10201600790YA SG10201600790YA SG 10201600790Y A SG10201600790Y A SG 10201600790YA SG 10201600790Y A SG10201600790Y A SG 10201600790YA SG 10201600790Y A SG10201600790Y A SG 10201600790YA SG 10201600790Y A SG10201600790Y A SG 10201600790YA
Authority
SG
Singapore
Prior art keywords
probe head
upper guider
guider plate
plate
probe
Prior art date
Application number
SG10201600790YA
Other languages
English (en)
Inventor
Chih-Hao Hsu
Sang-Yi Lin
Yung-Hsin Chen
Original Assignee
Mpi Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mpi Corp filed Critical Mpi Corp
Publication of SG10201600790YA publication Critical patent/SG10201600790YA/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07357—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with flexible bodies, e.g. buckling beams
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2889—Interfaces, e.g. between probe and tester

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Leads Or Probes (AREA)
  • Engineering & Computer Science (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
SG10201600790YA 2015-02-04 2016-02-02 Probe head and upper guider plate SG10201600790YA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW104103716A TWI530691B (zh) 2015-02-04 2015-02-04 探針頭及上導板

Publications (1)

Publication Number Publication Date
SG10201600790YA true SG10201600790YA (en) 2016-09-29

Family

ID=56361504

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201600790YA SG10201600790YA (en) 2015-02-04 2016-02-02 Probe head and upper guider plate

Country Status (4)

Country Link
US (1) US20160223590A1 (zh)
CN (1) CN105842605A (zh)
SG (1) SG10201600790YA (zh)
TW (1) TWI530691B (zh)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI576591B (zh) * 2016-02-03 2017-04-01 京元電子股份有限公司 探針卡組裝結構與其組裝方法、以及由該探針卡組裝結構取出斷針的方法
TWI603090B (zh) * 2016-09-06 2017-10-21 Mpi Corp A vertical probe, a method of manufacturing the same, and a probe head and a probe card using the same
IT201600124017A1 (it) * 2016-12-06 2018-06-06 Technoprobe Spa Testa di misura di un’apparecchiatura di test di dispositivi elettronici e relativo metodo di fabbricazione
WO2018118075A1 (en) 2016-12-23 2018-06-28 Intel Corporation Fine pitch probe card methods and systems
US11268983B2 (en) 2017-06-30 2022-03-08 Intel Corporation Chevron interconnect for very fine pitch probing
US10775414B2 (en) 2017-09-29 2020-09-15 Intel Corporation Low-profile gimbal platform for high-resolution in situ co-planarity adjustment
US11061068B2 (en) 2017-12-05 2021-07-13 Intel Corporation Multi-member test probe structure
US11204555B2 (en) 2017-12-28 2021-12-21 Intel Corporation Method and apparatus to develop lithographically defined high aspect ratio interconnects
US10488438B2 (en) 2018-01-05 2019-11-26 Intel Corporation High density and fine pitch interconnect structures in an electric test apparatus
CN110068711B (zh) * 2018-01-24 2022-04-26 台湾中华精测科技股份有限公司 探针卡装置及矩形探针
CN110389241B (zh) * 2018-04-16 2021-07-20 中华精测科技股份有限公司 探针座及其矩形探针
TW202006366A (zh) * 2018-07-04 2020-02-01 旺矽科技股份有限公司 具有線型探針之探針頭
US11543454B2 (en) * 2018-09-25 2023-01-03 Intel Corporation Double-beam test probe
US10935573B2 (en) 2018-09-28 2021-03-02 Intel Corporation Slip-plane MEMS probe for high-density and fine pitch interconnects
KR102329790B1 (ko) * 2019-12-26 2021-11-23 주식회사 에스디에이 가변형 mems 프로브 카드 및 이의 조립방법
TWI722822B (zh) * 2020-03-10 2021-03-21 中華精測科技股份有限公司 垂直式探針頭及其雙臂式探針

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070007974A1 (en) * 2005-07-05 2007-01-11 Jinn-Tong Chiu Method for reducing integral stress of a vertical probe with specific structure
JP4673280B2 (ja) * 2006-11-09 2011-04-20 東京エレクトロン株式会社 固体撮像素子の検査用プローブカード
US7554348B2 (en) * 2007-06-29 2009-06-30 Wentworth Laboratories, Inc. Multi-offset die head
KR101106970B1 (ko) * 2007-07-03 2012-01-20 가부시키가이샤 아드반테스트 프로브, 프로브 카드 및 프로브의 제조방법
US8033012B2 (en) * 2008-03-07 2011-10-11 Taiwan Semiconductor Manufacturing Co., Ltd. Method for fabricating a semiconductor test probe card space transformer
EP2534509B1 (en) * 2010-02-10 2019-07-24 3M Innovative Properties Company Illumination device having viscoelastic layer

Also Published As

Publication number Publication date
TWI530691B (zh) 2016-04-21
CN105842605A (zh) 2016-08-10
TW201629495A (zh) 2016-08-16
US20160223590A1 (en) 2016-08-04

Similar Documents

Publication Publication Date Title
SG10201600790YA (en) Probe head and upper guider plate
IL275307B (en) Syntac polypeptides and their uses
ZA201804197B (en) Sensing apparatus and associated methods
IL249373A0 (en) Polypeptide formulations of related detector and method
GB201404470D0 (en) Therapeutic methods and materials
GB201407735D0 (en) Nail art prining apparatus
HK1250146A1 (zh) 抗前-bcr拮抗劑和方法
ZA201803835B (en) Device for digitizing and evaluating movement
IL259743B (en) Bioreactor apparatus and methods
GB201401969D0 (en) Head support apparatus
PL3215676T3 (pl) Punkt mocujący szyny i płyty podkładowej
GB2533151B (en) Improved probe
SG10201502676TA (en) Unauthorized-communication detecting apparatus and program
ZA201703336B (en) Novel products and methods
GB201410031D0 (en) Polypeptides and uses thereof
GB201517786D0 (en) Methods and materials
HK1246288A1 (zh) S1pr2拮抗劑及其用途
TWI560454B (en) Testing base
PL3347376T3 (pl) Nowy receptor IGFR-podobny i jego zastosowania
GB201603335D0 (en) Head up display apparatus and display surface therefor
GB201405562D0 (en) Head supporting device
GB2534220B (en) Tree-cutting head
ZA201804127B (en) Spinel material
GB2550120B (en) Probe
GB2533587B (en) Adjustable hair fastener