SG10201508638QA - Method and apparatus for liquid treatment of wafer-shaped articles - Google Patents

Method and apparatus for liquid treatment of wafer-shaped articles

Info

Publication number
SG10201508638QA
SG10201508638QA SG10201508638QA SG10201508638QA SG10201508638QA SG 10201508638Q A SG10201508638Q A SG 10201508638QA SG 10201508638Q A SG10201508638Q A SG 10201508638QA SG 10201508638Q A SG10201508638Q A SG 10201508638QA SG 10201508638Q A SG10201508638Q A SG 10201508638QA
Authority
SG
Singapore
Prior art keywords
wafer
liquid treatment
shaped articles
articles
treatment
Prior art date
Application number
SG10201508638QA
Inventor
Zagorz Philipp
Ganster Michael
Goller Alois
Original Assignee
Lam Res Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lam Res Ag filed Critical Lam Res Ag
Publication of SG10201508638QA publication Critical patent/SG10201508638QA/en

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • GPHYSICS
    • G05CONTROLLING; REGULATING
    • G05DSYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D11/00Control of flow ratio
    • G05D11/02Controlling ratio of two or more flows of fluid or fluent material
    • G05D11/13Controlling ratio of two or more flows of fluid or fluent material characterised by the use of electric means
    • G05D11/135Controlling ratio of two or more flows of fluid or fluent material characterised by the use of electric means by sensing at least one property of the mixture
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01FMIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
    • B01F35/00Accessories for mixers; Auxiliary operations or auxiliary devices; Parts or details of general application
    • B01F35/20Measuring; Control or regulation
    • B01F35/21Measuring
    • B01F35/2132Concentration, pH, pOH, p(ION) or oxygen-demand
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01FMIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
    • B01F35/00Accessories for mixers; Auxiliary operations or auxiliary devices; Parts or details of general application
    • B01F35/80Forming a predetermined ratio of the substances to be mixed
    • B01F35/83Forming a predetermined ratio of the substances to be mixed by controlling the ratio of two or more flows, e.g. using flow sensing or flow controlling devices
    • B01F35/833Flow control by valves, e.g. opening intermittently
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306Chemical or electrical treatment, e.g. electrolytic etching
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/6715Apparatus for applying a liquid, a resin, an ink or the like
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T137/00Fluid handling
    • Y10T137/8593Systems
    • Y10T137/87917Flow path with serial valves and/or closures

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Automation & Control Theory (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Accessories For Mixers (AREA)
  • Weting (AREA)
SG10201508638QA 2012-04-25 2013-04-22 Method and apparatus for liquid treatment of wafer-shaped articles SG10201508638QA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US13/455,406 US20130284208A1 (en) 2012-04-25 2012-04-25 Method and apparatus for liquid treatment of wafer-shaped articles

Publications (1)

Publication Number Publication Date
SG10201508638QA true SG10201508638QA (en) 2015-11-27

Family

ID=49476267

Family Applications (2)

Application Number Title Priority Date Filing Date
SG2013031612A SG194324A1 (en) 2012-04-25 2013-04-22 Method and apparatus for liquid treatment of wafer-shaped articles
SG10201508638QA SG10201508638QA (en) 2012-04-25 2013-04-22 Method and apparatus for liquid treatment of wafer-shaped articles

Family Applications Before (1)

Application Number Title Priority Date Filing Date
SG2013031612A SG194324A1 (en) 2012-04-25 2013-04-22 Method and apparatus for liquid treatment of wafer-shaped articles

Country Status (4)

Country Link
US (1) US20130284208A1 (en)
KR (1) KR20130120412A (en)
SG (2) SG194324A1 (en)
TW (1) TWI598154B (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20180166300A1 (en) * 2016-12-13 2018-06-14 Lam Research Ag Point-of-use mixing systems and methods for controlling temperatures of liquids dispensed at a substrate
US11318431B2 (en) 2019-11-27 2022-05-03 Diversified Fluid Solutions, Llc On-demand in-line-blending and supply of chemicals

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1602538A (en) * 2001-11-13 2005-03-30 Fsi国际公司 Advanced process control for immersion processing
US8235580B2 (en) * 2006-10-12 2012-08-07 Air Liquide Electronics U.S. Lp Reclaim function for semiconductor processing systems
US7620481B2 (en) * 2007-01-10 2009-11-17 Halliburton Energy Services, Inc. Systems for self-balancing control of mixing and pumping

Also Published As

Publication number Publication date
TW201404475A (en) 2014-02-01
TWI598154B (en) 2017-09-11
SG194324A1 (en) 2013-11-29
KR20130120412A (en) 2013-11-04
US20130284208A1 (en) 2013-10-31

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