SG10201508638QA - Method and apparatus for liquid treatment of wafer-shaped articles - Google Patents
Method and apparatus for liquid treatment of wafer-shaped articlesInfo
- Publication number
- SG10201508638QA SG10201508638QA SG10201508638QA SG10201508638QA SG10201508638QA SG 10201508638Q A SG10201508638Q A SG 10201508638QA SG 10201508638Q A SG10201508638Q A SG 10201508638QA SG 10201508638Q A SG10201508638Q A SG 10201508638QA SG 10201508638Q A SG10201508638Q A SG 10201508638QA
- Authority
- SG
- Singapore
- Prior art keywords
- wafer
- liquid treatment
- shaped articles
- articles
- treatment
- Prior art date
Links
- 239000007788 liquid Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
- G05D11/00—Control of flow ratio
- G05D11/02—Controlling ratio of two or more flows of fluid or fluent material
- G05D11/13—Controlling ratio of two or more flows of fluid or fluent material characterised by the use of electric means
- G05D11/135—Controlling ratio of two or more flows of fluid or fluent material characterised by the use of electric means by sensing at least one property of the mixture
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01F—MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
- B01F35/00—Accessories for mixers; Auxiliary operations or auxiliary devices; Parts or details of general application
- B01F35/20—Measuring; Control or regulation
- B01F35/21—Measuring
- B01F35/2132—Concentration, pH, pOH, p(ION) or oxygen-demand
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01F—MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
- B01F35/00—Accessories for mixers; Auxiliary operations or auxiliary devices; Parts or details of general application
- B01F35/80—Forming a predetermined ratio of the substances to be mixed
- B01F35/83—Forming a predetermined ratio of the substances to be mixed by controlling the ratio of two or more flows, e.g. using flow sensing or flow controlling devices
- B01F35/833—Flow control by valves, e.g. opening intermittently
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T137/00—Fluid handling
- Y10T137/8593—Systems
- Y10T137/87917—Flow path with serial valves and/or closures
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Automation & Control Theory (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Accessories For Mixers (AREA)
- Weting (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US13/455,406 US20130284208A1 (en) | 2012-04-25 | 2012-04-25 | Method and apparatus for liquid treatment of wafer-shaped articles |
Publications (1)
Publication Number | Publication Date |
---|---|
SG10201508638QA true SG10201508638QA (en) | 2015-11-27 |
Family
ID=49476267
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG2013031612A SG194324A1 (en) | 2012-04-25 | 2013-04-22 | Method and apparatus for liquid treatment of wafer-shaped articles |
SG10201508638QA SG10201508638QA (en) | 2012-04-25 | 2013-04-22 | Method and apparatus for liquid treatment of wafer-shaped articles |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG2013031612A SG194324A1 (en) | 2012-04-25 | 2013-04-22 | Method and apparatus for liquid treatment of wafer-shaped articles |
Country Status (4)
Country | Link |
---|---|
US (1) | US20130284208A1 (en) |
KR (1) | KR20130120412A (en) |
SG (2) | SG194324A1 (en) |
TW (1) | TWI598154B (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20180166300A1 (en) * | 2016-12-13 | 2018-06-14 | Lam Research Ag | Point-of-use mixing systems and methods for controlling temperatures of liquids dispensed at a substrate |
US11318431B2 (en) | 2019-11-27 | 2022-05-03 | Diversified Fluid Solutions, Llc | On-demand in-line-blending and supply of chemicals |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1602538A (en) * | 2001-11-13 | 2005-03-30 | Fsi国际公司 | Advanced process control for immersion processing |
US8235580B2 (en) * | 2006-10-12 | 2012-08-07 | Air Liquide Electronics U.S. Lp | Reclaim function for semiconductor processing systems |
US7620481B2 (en) * | 2007-01-10 | 2009-11-17 | Halliburton Energy Services, Inc. | Systems for self-balancing control of mixing and pumping |
-
2012
- 2012-04-25 US US13/455,406 patent/US20130284208A1/en not_active Abandoned
-
2013
- 2013-04-12 TW TW102113178A patent/TWI598154B/en active
- 2013-04-22 SG SG2013031612A patent/SG194324A1/en unknown
- 2013-04-22 SG SG10201508638QA patent/SG10201508638QA/en unknown
- 2013-04-24 KR KR1020130045702A patent/KR20130120412A/en not_active Application Discontinuation
Also Published As
Publication number | Publication date |
---|---|
TW201404475A (en) | 2014-02-01 |
TWI598154B (en) | 2017-09-11 |
SG194324A1 (en) | 2013-11-29 |
KR20130120412A (en) | 2013-11-04 |
US20130284208A1 (en) | 2013-10-31 |
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