SG10201504423QA - Metal and dielectric compatible sacrificial anti-reflective coating cleaning and removal composition - Google Patents

Metal and dielectric compatible sacrificial anti-reflective coating cleaning and removal composition

Info

Publication number
SG10201504423QA
SG10201504423QA SG10201504423QA SG10201504423QA SG10201504423QA SG 10201504423Q A SG10201504423Q A SG 10201504423QA SG 10201504423Q A SG10201504423Q A SG 10201504423QA SG 10201504423Q A SG10201504423Q A SG 10201504423QA SG 10201504423Q A SG10201504423Q A SG 10201504423QA
Authority
SG
Singapore
Prior art keywords
metal
reflective coating
removal composition
coating cleaning
sacrificial anti
Prior art date
Application number
SG10201504423QA
Inventor
Melissa K Rath
David D Bernhard
David W Minsek
Thomas H Baum
Original Assignee
Entegris Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Entegris Inc filed Critical Entegris Inc
Publication of SG10201504423QA publication Critical patent/SG10201504423QA/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/50—Solvents
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/42—Stripping or agents therefor
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K13/00—Etching, surface-brightening or pickling compositions
    • C09K13/04—Etching, surface-brightening or pickling compositions containing an inorganic acid
    • C09K13/08—Etching, surface-brightening or pickling compositions containing an inorganic acid containing a fluorine compound
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/02—Inorganic compounds
    • C11D7/04—Water-soluble compounds
    • C11D7/08—Acids
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/02—Inorganic compounds
    • C11D7/04—Water-soluble compounds
    • C11D7/10—Salts
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/26—Organic compounds containing oxygen
    • C11D7/261—Alcohols; Phenols
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/26—Organic compounds containing oxygen
    • C11D7/263—Ethers
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/26—Organic compounds containing oxygen
    • C11D7/265—Carboxylic acids or salts thereof
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/28—Organic compounds containing halogen
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/34—Organic compounds containing sulfur
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/42—Stripping or agents therefor
    • G03F7/422—Stripping or agents therefor using liquids only
    • G03F7/423—Stripping or agents therefor using liquids only containing mineral acids or salts thereof, containing mineral oxidizing substances, e.g. peroxy compounds
    • C11D2111/22—

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Wood Science & Technology (AREA)
  • Health & Medical Sciences (AREA)
  • Emergency Medicine (AREA)
  • Inorganic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Detergent Compositions (AREA)
  • Weting (AREA)
SG10201504423QA 2005-06-07 2006-06-07 Metal and dielectric compatible sacrificial anti-reflective coating cleaning and removal composition SG10201504423QA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US68820405P 2005-06-07 2005-06-07

Publications (1)

Publication Number Publication Date
SG10201504423QA true SG10201504423QA (en) 2015-07-30

Family

ID=37498777

Family Applications (2)

Application Number Title Priority Date Filing Date
SG10201504423QA SG10201504423QA (en) 2005-06-07 2006-06-07 Metal and dielectric compatible sacrificial anti-reflective coating cleaning and removal composition
SG201003959-2A SG162757A1 (en) 2005-06-07 2006-06-07 Metal and dielectric compatible sacrificial anti-reflective coating cleaning and removal composition

Family Applications After (1)

Application Number Title Priority Date Filing Date
SG201003959-2A SG162757A1 (en) 2005-06-07 2006-06-07 Metal and dielectric compatible sacrificial anti-reflective coating cleaning and removal composition

Country Status (9)

Country Link
US (2) US8951948B2 (en)
EP (2) EP2759881A1 (en)
JP (1) JP2008546036A (en)
KR (3) KR101431406B1 (en)
CN (2) CN102981377B (en)
IL (1) IL187956A0 (en)
SG (2) SG10201504423QA (en)
TW (3) TWI622639B (en)
WO (1) WO2006133253A1 (en)

Families Citing this family (61)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008546036A (en) 2005-06-07 2008-12-18 アドバンスド テクノロジー マテリアルズ，インコーポレイテッド Metal and dielectric compatible sacrificial antireflective coating purification and removal composition
TW200709294A (en) * 2005-06-13 2007-03-01 Advanced Tech Materials Compositions and methods for selective removal of metal or metal alloy after metal silicide formation
TWI339780B (en) 2005-07-28 2011-04-01 Rohm & Haas Elect Mat Stripper
CN101496146A (en) * 2005-10-05 2009-07-29 高级技术材料公司 Composition and method for selectively etching gate spacer oxide material
KR101444468B1 (en) 2005-10-05 2014-10-30 어드밴스드 테크놀러지 머티리얼즈, 인코포레이티드 Oxidizing aqueous cleaner for the removal of post-etch residues
WO2007120259A2 (en) * 2005-11-08 2007-10-25 Advanced Technology Materials, Inc. Formulations for removing copper-containing post-etch residue from microelectronic devices
EP1946358A4 (en) 2005-11-09 2009-03-04 Advanced Tech Materials Composition and method for recycling semiconductor wafers having low-k dielectric materials thereon
TWI449784B (en) * 2006-12-21 2014-08-21 Advanced Tech Materials Liquid cleaner for the removal of post-etch residues
TWI516573B (en) * 2007-02-06 2016-01-11 安堤格里斯公司 Composition and process for the selective removal of tisin
US20100112728A1 (en) * 2007-03-31 2010-05-06 Advanced Technology Materials, Inc. Methods for stripping material for wafer reclamation
KR101530321B1 (en) * 2007-08-08 2015-06-19 아라까와 가가꾸 고교 가부시끼가이샤 Cleaner composition for removing lead-free soldering flux, and method for removing lead-free soldering flux
CN102007196B (en) * 2008-03-07 2014-10-29 高级技术材料公司 Non-selective oxide etch wet clean composition and method of use
TWI460557B (en) * 2008-03-07 2014-11-11 Wako Pure Chem Ind Ltd Processing agent composition for semiconductor surfaces and method for processing semiconductor surfaces using the same
WO2010048139A2 (en) * 2008-10-21 2010-04-29 Advanced Technology Materials, Inc. Copper cleaning and protection formulations
JP5498768B2 (en) * 2009-12-02 2014-05-21 東京応化工業株式会社 Lithographic cleaning liquid and wiring forming method
TWI548738B (en) 2010-07-16 2016-09-11 安堤格里斯公司 Aqueous cleaner for the removal of post-etch residues
JP6101421B2 (en) 2010-08-16 2017-03-22 インテグリス・インコーポレーテッド Etching solution for copper or copper alloy
TWI558818B (en) 2010-08-20 2016-11-21 恩特葛瑞斯股份有限公司 Sustainable process for reclaiming precious metals and base metals from e-waste
SG10201508015RA (en) 2010-10-06 2015-10-29 Entegris Inc Composition and process for selectively etching metal nitrides
SG189371A1 (en) * 2010-12-16 2013-05-31 Kyzen Corp Cleaning agent for removal of soldering flux
JP5933950B2 (en) 2011-09-30 2016-06-15 アドバンスド テクノロジー マテリアルズ，インコーポレイテッド Etching solution for copper or copper alloy
US10133180B2 (en) 2011-10-05 2018-11-20 Avantor Performance Materials Microelectronic substrate cleaning compositions having copper/azole polymer inhibition
EP2798669B1 (en) 2011-12-28 2021-03-31 Entegris, Inc. Compositions and methods for selectively etching titanium nitride
KR102105381B1 (en) 2012-02-15 2020-04-29 엔테그리스, 아이엔씨. Post-cmp removal using compositions and method of use
US9678430B2 (en) 2012-05-18 2017-06-13 Entegris, Inc. Composition and process for stripping photoresist from a surface including titanium nitride
US9536730B2 (en) * 2012-10-23 2017-01-03 Air Products And Chemicals, Inc. Cleaning formulations
KR102118964B1 (en) 2012-12-05 2020-06-08 엔테그리스, 아이엔씨. Compositions for cleaning iii-v semiconductor materials and methods of using same
SG11201507014RA (en) 2013-03-04 2015-10-29 Advanced Tech Materials Compositions and methods for selectively etching titanium nitride
US9245751B2 (en) 2013-03-12 2016-01-26 Taiwan Semiconductor Manufacturing Company, Ltd. Anti-reflective layer and method
US9256128B2 (en) 2013-03-12 2016-02-09 Taiwan Semiconductor Manufacturing Company, Ltd. Method for manufacturing semiconductor device
US9502231B2 (en) 2013-03-12 2016-11-22 Taiwan Semiconductor Manufacturing Company, Ltd. Photoresist layer and method
US9543147B2 (en) 2013-03-12 2017-01-10 Taiwan Semiconductor Manufacturing Company, Ltd. Photoresist and method of manufacture
CN104102028A (en) * 2013-04-10 2014-10-15 第一毛织株式会社 Organic solution for surface treatment of induim zinc oxide substrate and method of preparing display substrate using the same
TWI651396B (en) 2013-06-06 2019-02-21 美商恩特葛瑞斯股份有限公司 Compositions and methods for selectively etching titanium nitride
EP3027709A4 (en) 2013-07-31 2017-03-29 Entegris, Inc. AQUEOUS FORMULATIONS FOR REMOVING METAL HARD MASK AND POST-ETCH RESIDUE WITH Cu/W COMPATIBILITY
SG10201801575YA (en) 2013-08-30 2018-03-28 Entegris Inc Compositions and methods for selectively etching titanium nitride
TWI654340B (en) 2013-12-16 2019-03-21 美商恩特葛瑞斯股份有限公司 Ni:NiGe:Ge SELECTIVE ETCH FORMULATIONS AND METHOD OF USING SAME
EP3084809A4 (en) 2013-12-20 2017-08-23 Entegris, Inc. Use of non-oxidizing strong acids for the removal of ion-implanted resist
KR20150077076A (en) 2013-12-27 2015-07-07 삼성디스플레이 주식회사 Display panel, display apparatus having the same and method of manufacturing the same
US10475658B2 (en) 2013-12-31 2019-11-12 Entegris, Inc. Formulations to selectively etch silicon and germanium
WO2015116818A1 (en) 2014-01-29 2015-08-06 Advanced Technology Materials, Inc. Post chemical mechanical polishing formulations and method of use
US11127587B2 (en) 2014-02-05 2021-09-21 Entegris, Inc. Non-amine post-CMP compositions and method of use
KR102420338B1 (en) * 2014-06-04 2022-07-13 엔테그리스, 아이엔씨. Anti-reflective coating cleaning and post-etch residue removal composition having metal, dielectric and nitride compatibility
WO2016003729A1 (en) * 2014-06-30 2016-01-07 Entegris, Inc. Aqueous and semi-aqueous cleaners for the removal of post-etch residues with tungsten and cobalt compatibility
SG11201704287TA (en) * 2014-12-22 2017-07-28 Basf Se Use of a chemical mechanical polishing (cmp) composition for polishing of cobalt and / or cobalt alloy comprising substrates
JP6504911B2 (en) * 2015-05-19 2019-04-24 キヤノン株式会社 Method of manufacturing liquid discharge head
TWI819694B (en) 2015-07-14 2023-10-21 美商富士軟片電子材料美國股份有限公司 Cleaning compositions and methods of use therefor
KR102384908B1 (en) * 2015-11-25 2022-04-08 삼성전자주식회사 Copositions for cleaning magnetic patterns, methods of forming magnetic patterns and methods of manufacturing magnetic memory devices
US11319513B2 (en) * 2016-03-24 2022-05-03 Avantor Performance Materials, Llc Non-aqueous tungsten compatible metal nitride selective etchants and cleaners
WO2017194449A1 (en) * 2016-05-10 2017-11-16 Atotech Deutschland Gmbh A non-aqueous stripping composition and a method of stripping an organic coating from a substrate
WO2018061582A1 (en) * 2016-09-29 2018-04-05 富士フイルム株式会社 Treatment fluid and method for treating laminate
CN110234719A (en) * 2017-01-18 2019-09-13 恩特格里斯公司 For the composition and method from surface removal cerium oxide particles
WO2019040394A1 (en) * 2017-08-22 2019-02-28 Fujifilm Electronic Materials U.S.A., Inc. Cleaning compositions
US20190103282A1 (en) * 2017-09-29 2019-04-04 Versum Materials Us, Llc Etching Solution for Simultaneously Removing Silicon and Silicon-Germanium Alloy From a Silicon-Germanium/Silicon Stack During Manufacture of a Semiconductor Device
WO2019151141A1 (en) * 2018-02-05 2019-08-08 富士フイルム株式会社 Treatment liquid and treatment method
CA3039238A1 (en) * 2019-04-05 2020-10-05 Fluid Energy Group Ltd. Novel inhibited hydrofluoric acid composition
CN110714213A (en) * 2019-10-31 2020-01-21 武汉奥邦表面技术有限公司 Cyanide-free alkaline cuprous copper electroplating complexing agent
CN113430065A (en) * 2020-03-23 2021-09-24 上海新阳半导体材料股份有限公司 Anti-reflection coating cleaning and post-etching residue removing composition, preparation method and application
CA3083522A1 (en) * 2020-06-12 2021-12-12 Fluid Energy Group Ltd. Process to manufacture novel inhibited hydrofluoric acid composition
CN112859552B (en) * 2021-02-04 2024-01-05 上海新阳半导体材料股份有限公司 Application of vanadium oxide corrosion inhibition fluorine-containing stripping liquid
CN115466651A (en) * 2022-10-09 2022-12-13 福建省腾达洁环保工程有限公司 Electrified cleaning agent for power electronic equipment and preparation method thereof

Family Cites Families (66)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4343677A (en) * 1981-03-23 1982-08-10 Bell Telephone Laboratories, Incorporated Method for patterning films using reactive ion etching thereof
US5320709A (en) * 1993-02-24 1994-06-14 Advanced Chemical Systems International Incorporated Method for selective removal of organometallic and organosilicon residues and damaged oxides using anhydrous ammonium fluoride solution
JP3074634B2 (en) * 1994-03-28 2000-08-07 三菱瓦斯化学株式会社 Stripping solution for photoresist and method for forming wiring pattern
US5571447A (en) * 1995-03-20 1996-11-05 Ashland Inc. Stripping and cleaning composition
JP3236220B2 (en) * 1995-11-13 2001-12-10 東京応化工業株式会社 Stripper composition for resist
US5855811A (en) * 1996-10-03 1999-01-05 Micron Technology, Inc. Cleaning composition containing tetraalkylammonium salt and use thereof in semiconductor fabrication
US5698503A (en) * 1996-11-08 1997-12-16 Ashland Inc. Stripping and cleaning composition
US6896826B2 (en) * 1997-01-09 2005-05-24 Advanced Technology Materials, Inc. Aqueous cleaning composition containing copper-specific corrosion inhibitor for cleaning inorganic residues on semiconductor substrate
US6224785B1 (en) * 1997-08-29 2001-05-01 Advanced Technology Materials, Inc. Aqueous ammonium fluoride and amine containing compositions for cleaning inorganic residues on semiconductor substrates
US6755989B2 (en) * 1997-01-09 2004-06-29 Advanced Technology Materials, Inc. Aqueous cleaning composition containing copper-specific corrosion inhibitor for cleaning inorganic residues on semiconductor substrate
KR100234541B1 (en) * 1997-03-07 1999-12-15 윤종용 Cleaning solution and cleaning method for semiconductor process
JPH1167632A (en) * 1997-08-18 1999-03-09 Mitsubishi Gas Chem Co Inc Cleaner for semiconductor device
US6280651B1 (en) * 1998-12-16 2001-08-28 Advanced Technology Materials, Inc. Selective silicon oxide etchant formulation including fluoride salt, chelating agent, and glycol solvent
US6211126B1 (en) * 1997-12-23 2001-04-03 Advanced Technology Materials, Inc. Formulations including a 1, 3-dicarbonyl compound chelating agent for stripping residues from semiconductor substrates
JPH11323394A (en) * 1998-05-14 1999-11-26 Texas Instr Japan Ltd Detergent for preparing semiconductor element and preparation of semiconductor element using same
US6306807B1 (en) * 1998-05-18 2001-10-23 Advanced Technology Materials, Inc. Boric acid containing compositions for stripping residues from semiconductor substrates
US7547669B2 (en) * 1998-07-06 2009-06-16 Ekc Technology, Inc. Remover compositions for dual damascene system
US6395194B1 (en) * 1998-12-18 2002-05-28 Intersurface Dynamics Inc. Chemical mechanical polishing compositions, and process for the CMP removal of iridium thin using same
JP4224652B2 (en) * 1999-03-08 2009-02-18 三菱瓦斯化学株式会社 Resist stripping solution and resist stripping method using the same
US6807824B1 (en) * 1999-04-27 2004-10-26 Hiroshi Miwa Glass etching composition and method for frosting using the same
US6248704B1 (en) * 1999-05-03 2001-06-19 Ekc Technology, Inc. Compositions for cleaning organic and plasma etched residues for semiconductors devices
US6268457B1 (en) * 1999-06-10 2001-07-31 Allied Signal, Inc. Spin-on glass anti-reflective coatings for photolithography
US6329118B1 (en) * 1999-06-21 2001-12-11 Intel Corporation Method for patterning dual damascene interconnects using a sacrificial light absorbing material
US6235693B1 (en) * 1999-07-16 2001-05-22 Ekc Technology, Inc. Lactam compositions for cleaning organic and plasma etched residues for semiconductor devices
US6344432B1 (en) * 1999-08-20 2002-02-05 Advanced Technology Materials, Inc. Formulations including a 1,3-dicarbonyl compound chelating agent and copper corrosion inhibiting agents for stripping residues from semiconductor substrates containing copper structures
JP3389166B2 (en) 1999-09-10 2003-03-24 日本電気株式会社 Stripping composition for resist
US6723691B2 (en) * 1999-11-16 2004-04-20 Advanced Technology Materials, Inc. Post chemical-mechanical planarization (CMP) cleaning composition
US6194366B1 (en) * 1999-11-16 2001-02-27 Esc, Inc. Post chemical-mechanical planarization (CMP) cleaning composition
US6492308B1 (en) * 1999-11-16 2002-12-10 Esc, Inc. Post chemical-mechanical planarization (CMP) cleaning composition
WO2001081525A1 (en) * 2000-04-26 2001-11-01 Daikin Industries, Ltd. Detergent composition
KR20010113396A (en) * 2000-06-19 2001-12-28 주식회사 동진쎄미켐 Photoresist remover composition comprising ammonium fluoride
US6566315B2 (en) * 2000-12-08 2003-05-20 Advanced Technology Materials, Inc. Formulations including a 1,3-dicarbonyl compound chelating agent and copper corrosion inhibiting agents for stripping residues from semiconductor substrates containing copper structures
EP1357092A1 (en) * 2000-12-27 2003-10-29 Hiroshi Miwa Method for preparing decorative glass using glass etching composition
US6627587B2 (en) * 2001-04-19 2003-09-30 Esc Inc. Cleaning compositions
US6645867B2 (en) * 2001-05-24 2003-11-11 International Business Machines Corporation Structure and method to preserve STI during etching
US20030022800A1 (en) 2001-06-14 2003-01-30 Peters Darryl W. Aqueous buffered fluoride-containing etch residue removers and cleaners
MY143399A (en) 2001-07-09 2011-05-13 Avantor Performance Mat Inc Microelectronic cleaning compositons containing ammonia-free fluoride salts for selective photoresist stripping and plasma ash residue cleaning
TWI297102B (en) * 2001-08-03 2008-05-21 Nec Electronics Corp Removing composition
US20030171239A1 (en) * 2002-01-28 2003-09-11 Patel Bakul P. Methods and compositions for chemically treating a substrate using foam technology
US6773873B2 (en) * 2002-03-25 2004-08-10 Advanced Technology Materials, Inc. pH buffered compositions useful for cleaning residue from semiconductor substrates
EP1520211A2 (en) * 2002-06-07 2005-04-06 Mallinckrodt Baker, Inc. Microelectronic cleaning compositions containing oxidizers and organic solvents
CN102135735A (en) * 2002-06-07 2011-07-27 安万托特性材料股份有限公司 Microelectronic cleaning and arc remover compositions
JP2004029276A (en) * 2002-06-25 2004-01-29 Mitsubishi Gas Chem Co Inc Fluorine-containing resist stripping solution for cooper wiring board
US20040050406A1 (en) * 2002-07-17 2004-03-18 Akshey Sehgal Compositions and method for removing photoresist and/or resist residue at pressures ranging from ambient to supercritical
US6849200B2 (en) * 2002-07-23 2005-02-01 Advanced Technology Materials, Inc. Composition and process for wet stripping removal of sacrificial anti-reflective material
KR20050024432A (en) * 2002-07-23 2005-03-10 어드밴스드 테크놀러지 머티리얼즈, 인코포레이티드 Composition and process for wet stripping removal of sacrificial anti-reflective meterial
CN1678961B (en) * 2002-08-22 2010-05-05 大金工业株式会社 Removing solution
US7267727B2 (en) * 2002-09-24 2007-09-11 Air Products And Chemicals, Inc. Processing of semiconductor components with dense processing fluids and ultrasonic energy
US8236485B2 (en) * 2002-12-20 2012-08-07 Advanced Technology Materials, Inc. Photoresist removal
WO2004094581A1 (en) * 2003-04-18 2004-11-04 Ekc Technology, Inc. Aqueous fluoride compositions for cleaning semiconductor devices
US7309448B2 (en) * 2003-08-08 2007-12-18 Applied Materials, Inc. Selective etch process of a sacrificial light absorbing material (SLAM) over a dielectric material
US20050079803A1 (en) * 2003-10-10 2005-04-14 Siddiqui Junaid Ahmed Chemical-mechanical planarization composition having PVNO and associated method for use
US7888301B2 (en) * 2003-12-02 2011-02-15 Advanced Technology Materials, Inc. Resist, barc and gap fill material stripping chemical and method
US8338087B2 (en) * 2004-03-03 2012-12-25 Advanced Technology Materials, Inc Composition and process for post-etch removal of photoresist and/or sacrificial anti-reflective material deposited on a substrate
US7122484B2 (en) * 2004-04-28 2006-10-17 Taiwan Semiconductor Manufacturing Company, Ltd. Process for removing organic materials during formation of a metal interconnect
US7497959B2 (en) * 2004-05-11 2009-03-03 International Business Machines Corporation Methods and structures for protecting one area while processing another area on a chip
US8030263B2 (en) * 2004-07-01 2011-10-04 Air Products And Chemicals, Inc. Composition for stripping and cleaning and use thereof
US20060063687A1 (en) * 2004-09-17 2006-03-23 Minsek David W Composition and process for ashless removal of post-etch photoresist and/or bottom anti-reflective material on a substrate
US20060255315A1 (en) * 2004-11-19 2006-11-16 Yellowaga Deborah L Selective removal chemistries for semiconductor applications, methods of production and uses thereof
CN101163776A (en) * 2004-11-19 2008-04-16 霍尼韦尔国际公司 Selective removal chemistries for semiconductor applications, methods of production and uses thereof
US20060154186A1 (en) * 2005-01-07 2006-07-13 Advanced Technology Materials, Inc. Composition useful for removal of post-etch photoresist and bottom anti-reflection coatings
US7923423B2 (en) * 2005-01-27 2011-04-12 Advanced Technology Materials, Inc. Compositions for processing of semiconductor substrates
US7365045B2 (en) * 2005-03-30 2008-04-29 Advanced Tehnology Materials, Inc. Aqueous cleaner with low metal etch rate comprising alkanolamine and tetraalkylammonium hydroxide
JP2008546036A (en) 2005-06-07 2008-12-18 アドバンスド テクノロジー マテリアルズ，インコーポレイテッド Metal and dielectric compatible sacrificial antireflective coating purification and removal composition
US20070179072A1 (en) * 2006-01-30 2007-08-02 Rao Madhukar B Cleaning formulations
SG175559A1 (en) * 2006-09-25 2011-11-28 Advanced Tech Materials Compositions and methods for the removal of photoresist for a wafer rework application

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TW201336973A (en) 2013-09-16
IL187956A0 (en) 2008-03-20
EP1891482A1 (en) 2008-02-27
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SG162757A1 (en) 2010-07-29
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