SG10201500592RA - Device for arranging conductive balls - Google Patents
Device for arranging conductive ballsInfo
- Publication number
- SG10201500592RA SG10201500592RA SG10201500592RA SG10201500592RA SG10201500592RA SG 10201500592R A SG10201500592R A SG 10201500592RA SG 10201500592R A SG10201500592R A SG 10201500592RA SG 10201500592R A SG10201500592R A SG 10201500592RA SG 10201500592R A SG10201500592R A SG 10201500592RA
- Authority
- SG
- Singapore
- Prior art keywords
- conductive balls
- arranging conductive
- arranging
- balls
- conductive
- Prior art date
Links
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014015115A JP2015142064A (en) | 2014-01-30 | 2014-01-30 | Device for arraying conductive ball |
Publications (1)
Publication Number | Publication Date |
---|---|
SG10201500592RA true SG10201500592RA (en) | 2015-08-28 |
Family
ID=53772225
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG10201500592RA SG10201500592RA (en) | 2014-01-30 | 2015-01-26 | Device for arranging conductive balls |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP2015142064A (en) |
KR (1) | KR20150090993A (en) |
SG (1) | SG10201500592RA (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114724980B (en) * | 2022-03-02 | 2022-12-20 | 上海微松工业自动化有限公司 | Ball paving device based on BGA ball planting technology |
CN114999945A (en) * | 2022-05-27 | 2022-09-02 | 江苏长电科技股份有限公司 | Welding ball mounting method and corresponding welding ball taking and placing device |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3552610B2 (en) * | 1999-10-22 | 2004-08-11 | 松下電器産業株式会社 | Apparatus and method for transferring conductive balls, and apparatus and method for supplying conductive balls |
JP3619410B2 (en) * | 1999-11-18 | 2005-02-09 | 株式会社ルネサステクノロジ | Bump forming method and system |
JP5858628B2 (en) * | 2011-03-04 | 2016-02-10 | セイコーインスツル株式会社 | Ball supply device, ball supply method, bearing assembly device |
-
2014
- 2014-01-30 JP JP2014015115A patent/JP2015142064A/en active Pending
- 2014-12-25 KR KR1020140189174A patent/KR20150090993A/en not_active Application Discontinuation
-
2015
- 2015-01-26 SG SG10201500592RA patent/SG10201500592RA/en unknown
Also Published As
Publication number | Publication date |
---|---|
JP2015142064A (en) | 2015-08-03 |
KR20150090993A (en) | 2015-08-07 |
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