SG10201500592RA - Device for arranging conductive balls - Google Patents

Device for arranging conductive balls

Info

Publication number
SG10201500592RA
SG10201500592RA SG10201500592RA SG10201500592RA SG10201500592RA SG 10201500592R A SG10201500592R A SG 10201500592RA SG 10201500592R A SG10201500592R A SG 10201500592RA SG 10201500592R A SG10201500592R A SG 10201500592RA SG 10201500592R A SG10201500592R A SG 10201500592RA
Authority
SG
Singapore
Prior art keywords
conductive balls
arranging conductive
arranging
balls
conductive
Prior art date
Application number
SG10201500592RA
Inventor
Hanabusa、Takayoshi
Original Assignee
Shibuya Kogyo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shibuya Kogyo Co Ltd filed Critical Shibuya Kogyo Co Ltd
Publication of SG10201500592RA publication Critical patent/SG10201500592RA/en

Links

SG10201500592RA 2014-01-30 2015-01-26 Device for arranging conductive balls SG10201500592RA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014015115A JP2015142064A (en) 2014-01-30 2014-01-30 Device for arraying conductive ball

Publications (1)

Publication Number Publication Date
SG10201500592RA true SG10201500592RA (en) 2015-08-28

Family

ID=53772225

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201500592RA SG10201500592RA (en) 2014-01-30 2015-01-26 Device for arranging conductive balls

Country Status (3)

Country Link
JP (1) JP2015142064A (en)
KR (1) KR20150090993A (en)
SG (1) SG10201500592RA (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114724980B (en) * 2022-03-02 2022-12-20 上海微松工业自动化有限公司 Ball paving device based on BGA ball planting technology

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3552610B2 (en) * 1999-10-22 2004-08-11 松下電器産業株式会社 Apparatus and method for transferring conductive balls, and apparatus and method for supplying conductive balls
JP3619410B2 (en) * 1999-11-18 2005-02-09 株式会社ルネサステクノロジ Bump forming method and system
JP5858628B2 (en) * 2011-03-04 2016-02-10 セイコーインスツル株式会社 Ball supply device, ball supply method, bearing assembly device

Also Published As

Publication number Publication date
JP2015142064A (en) 2015-08-03
KR20150090993A (en) 2015-08-07

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