SG10201407054WA - Method, Storage Medium and System for Controlling the Processing of Lots of Workpieces - Google Patents

Method, Storage Medium and System for Controlling the Processing of Lots of Workpieces

Info

Publication number
SG10201407054WA
SG10201407054WA SG10201407054WA SG10201407054WA SG10201407054WA SG 10201407054W A SG10201407054W A SG 10201407054WA SG 10201407054W A SG10201407054W A SG 10201407054WA SG 10201407054W A SG10201407054W A SG 10201407054WA SG 10201407054W A SG10201407054W A SG 10201407054WA
Authority
SG
Singapore
Prior art keywords
lots
workpieces
controlling
processing
storage medium
Prior art date
Application number
SG10201407054WA
Inventor
Grau Gero
Kalisch Steffen
Weigang Jörg
John Fosnight William
Oza Chinmay
Pabst Detlef
Original Assignee
Globalfoundries Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Globalfoundries Inc filed Critical Globalfoundries Inc
Publication of SG10201407054WA publication Critical patent/SG10201407054WA/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67727—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations using a general scheme of a conveying path within a factory
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B17/00—Systems involving the use of models or simulators of said systems
    • G05B17/02—Systems involving the use of models or simulators of said systems electric
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/04—Programme control other than numerical control, i.e. in sequence controllers or logic controllers
    • G05B19/042—Programme control other than numerical control, i.e. in sequence controllers or logic controllers using digital processors
    • G05B19/0426—Programming the control sequence
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
    • G05B19/41875—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by quality surveillance of production
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/20—Pc systems
    • G05B2219/23—Pc programming
    • G05B2219/23006—Finite state modeling
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/80—Management or planning

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Automation & Control Theory (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Engineering & Computer Science (AREA)
  • Quality & Reliability (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • General Factory Administration (AREA)
SG10201407054WA 2013-12-09 2014-10-29 Method, Storage Medium and System for Controlling the Processing of Lots of Workpieces SG10201407054WA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US14/100,610 US9748088B2 (en) 2013-12-09 2013-12-09 Method, storage medium and system for controlling the processing of lots of workpieces

Publications (1)

Publication Number Publication Date
SG10201407054WA true SG10201407054WA (en) 2015-07-30

Family

ID=53185531

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201407054WA SG10201407054WA (en) 2013-12-09 2014-10-29 Method, Storage Medium and System for Controlling the Processing of Lots of Workpieces

Country Status (6)

Country Link
US (1) US9748088B2 (en)
KR (1) KR20150067081A (en)
CN (1) CN104700198B (en)
DE (1) DE102014222705B4 (en)
SG (1) SG10201407054WA (en)
TW (1) TWI575561B (en)

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TWI549217B (en) * 2014-01-10 2016-09-11 華亞科技股份有限公司 Carrier rearangement system and method thereof
US10520932B2 (en) 2014-07-03 2019-12-31 Taiwan Semiconductor Manufacturing Co., Ltd Transport system and method
DE102015211941A1 (en) * 2015-06-26 2016-12-29 Zf Friedrichshafen Ag Method and device for reducing the energy requirement of a machine tool and machine tool system
CN105279577A (en) * 2015-10-26 2016-01-27 烟台宝井钢材加工有限公司 Automatic coil stock distribution method
CN105955209B (en) * 2016-04-26 2018-05-08 中南民族大学 One kind is based on data mining manufacturing industry shop equipment layout method
CN106200574B (en) * 2016-07-01 2019-02-22 武汉华星光电技术有限公司 It is a kind of to send method and system with charge free automatically
TWI614699B (en) 2016-12-30 2018-02-11 國立成功大學 Product quality prediction method for mass customization
CN107172201A (en) * 2017-06-28 2017-09-15 武汉华星光电技术有限公司 A kind of automatic delivering system
TWI656416B (en) * 2017-11-03 2019-04-11 迅得機械股份有限公司 Production schedule monitoring method
GB201808065D0 (en) 2018-05-17 2018-07-04 Quorso Uk Ltd Control network, system and method
JP7120914B2 (en) * 2018-12-25 2022-08-17 株式会社日立製作所 Production performance data analyzer
IL289545A (en) 2019-07-05 2022-07-01 Kla Tencor Corp Fab management with dynamic sampling plans, optimized wafer measurement paths and optimized wafer transport, using quantum computing
CN112309887B (en) * 2019-07-29 2023-03-21 华润微电子（重庆）有限公司 Pre-dispatching method for wafer manufacturing, electronic device, computer equipment and system
CN111356988B (en) * 2020-02-21 2021-03-12 长江存储科技有限责任公司 Method and system for scheduling semiconductor processing
TWI815173B (en) * 2021-08-26 2023-09-11 力晶積成電子製造股份有限公司 Production schedule estimation method and production schedule estimation system
TWI814362B (en) * 2022-04-27 2023-09-01 友達光電股份有限公司 Transport scheduling system and method of material

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5980183A (en) 1997-04-14 1999-11-09 Asyst Technologies, Inc. Integrated intrabay buffer, delivery, and stocker system
US7363099B2 (en) * 2002-06-07 2008-04-22 Cadence Design Systems, Inc. Integrated circuit metrology
US6947803B1 (en) * 2002-09-27 2005-09-20 Advanced Micro Devices, Inc. Dispatch and/or disposition of material based upon an expected parameter result
US20080163096A1 (en) * 2003-11-10 2008-07-03 Pannese Patrick D Methods and systems for controlling a semiconductor fabrication process
US6963785B2 (en) * 2003-12-11 2005-11-08 Taiwan Semiconductor Manufacturing Company, Ltd. Method for target queue time calculation in semiconductor manufacturing planning
US7279400B2 (en) * 2004-08-05 2007-10-09 Sharp Laboratories Of America, Inc. Method of fabricating single-layer and multi-layer single crystalline silicon and silicon devices on plastic using sacrificial glass
US7206652B2 (en) * 2004-08-20 2007-04-17 International Business Machines Corporation Method and system for intelligent automated reticle management
US20080275582A1 (en) 2004-11-19 2008-11-06 Nettles Steven C Scheduling AMHS pickup and delivery ahead of schedule
TWI296096B (en) 2005-12-23 2008-04-21 Taiwan Semiconductor Mfg Method and system for automatically wafer dispatching
US8655540B2 (en) * 2007-08-20 2014-02-18 International Electronic Machines Corp. Rail vehicle identification and processing
JP4828503B2 (en) * 2007-10-16 2011-11-30 東京エレクトロン株式会社 Substrate processing apparatus, substrate transfer method, computer program, and storage medium
US20130079913A1 (en) * 2011-09-28 2013-03-28 Globalfoundries Inc. Methods and systems for semiconductor fabrication with local processing management

Also Published As

Publication number Publication date
US9748088B2 (en) 2017-08-29
CN104700198B (en) 2019-04-19
DE102014222705A1 (en) 2015-06-11
DE102014222705B4 (en) 2022-09-01
US20150162180A1 (en) 2015-06-11
TW201532118A (en) 2015-08-16
CN104700198A (en) 2015-06-10
TWI575561B (en) 2017-03-21
KR20150067081A (en) 2015-06-17

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