SG10201406760PA - Wafer entry port with gas concentration attenuators - Google Patents

Wafer entry port with gas concentration attenuators

Info

Publication number
SG10201406760PA
SG10201406760PA SG10201406760PA SG10201406760PA SG10201406760PA SG 10201406760P A SG10201406760P A SG 10201406760PA SG 10201406760P A SG10201406760P A SG 10201406760PA SG 10201406760P A SG10201406760P A SG 10201406760PA SG 10201406760P A SG10201406760P A SG 10201406760PA
Authority
SG
Singapore
Prior art keywords
attenuators
gas concentration
entry port
wafer entry
wafer
Prior art date
Application number
SG10201406760PA
Inventor
jeffrey alan Hawkins
Original Assignee
Lam Res Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lam Res Corp filed Critical Lam Res Corp
Publication of SG10201406760PA publication Critical patent/SG10201406760PA/en

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27—FURNACES; KILNS; OVENS; RETORTS
    • F27B—FURNACES, KILNS, OVENS, OR RETORTS IN GENERAL; OPEN SINTERING OR LIKE APPARATUS
    • F27B17/00—Furnaces of a kind not covered by any preceding group
    • F27B17/0016—Chamber type furnaces
    • F27B17/0025—Especially adapted for treating semiconductor wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/6719—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the processing chambers, e.g. modular processing chambers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Physical Vapour Deposition (AREA)
  • Robotics (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
SG10201406760PA 2013-10-31 2014-10-20 Wafer entry port with gas concentration attenuators SG10201406760PA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US14/069,220 US20150118012A1 (en) 2013-10-31 2013-10-31 Wafer entry port with gas concentration attenuators

Publications (1)

Publication Number Publication Date
SG10201406760PA true SG10201406760PA (en) 2015-05-28

Family

ID=52995675

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201406760PA SG10201406760PA (en) 2013-10-31 2014-10-20 Wafer entry port with gas concentration attenuators

Country Status (6)

Country Link
US (1) US20150118012A1 (en)
JP (1) JP2015092566A (en)
KR (1) KR20150050489A (en)
CN (1) CN104600001A (en)
SG (1) SG10201406760PA (en)
TW (1) TW201533827A (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101970449B1 (en) * 2013-12-26 2019-04-18 카티바, 인크. Apparatus and techniques for thermal treatment of electronic devices
US10090174B2 (en) * 2016-03-01 2018-10-02 Lam Research Corporation Apparatus for purging semiconductor process chamber slit valve opening
KR20200123480A (en) * 2018-03-20 2020-10-29 도쿄엘렉트론가부시키가이샤 Self-recognition and correction heterogeneous platform including integrated semiconductor process module, and method for using the same
US10903050B2 (en) 2018-12-10 2021-01-26 Lam Research Corporation Endpoint sensor based control including adjustment of an edge ring parameter for each substrate processed to maintain etch rate uniformity

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3584847A (en) * 1968-05-31 1971-06-15 Western Electric Co Advancing workpieces through a sputtering chamber
JPS6127485A (en) * 1984-07-17 1986-02-06 中外炉工業株式会社 Continuous type atmosphere heat treatment furnace
US4812101A (en) * 1987-04-27 1989-03-14 American Telephone And Telegraph Company, At&T Bell Laboratories Method and apparatus for continuous throughput in a vacuum environment
JPH0714353Y2 (en) * 1988-07-08 1995-04-05 中外炉工業株式会社 Roller hearth type heat treatment furnace
US5117564A (en) * 1989-05-09 1992-06-02 Mitsubishi Jukogyo Kabushiki Kaisha Continuous vacuum treatment system
JPH0739483Y2 (en) * 1990-11-15 1995-09-13 千住金属工業株式会社 Reflow furnace
JPH081923B2 (en) * 1991-06-24 1996-01-10 ティーディーケイ株式会社 Clean transfer method and device
FR2747111B1 (en) * 1996-04-03 1998-04-30 Commissariat Energie Atomique COUPLING SYSTEM FOR CONFINED TRANSFER OF A FLAT OBJECT FROM A CONTAINMENT BOX TO AN OBJECT PROCESSING UNIT
US6702692B1 (en) * 1996-05-29 2004-03-09 Earl F. Smith Precise fit golf club fitting system and golf shaft selection method and apparatus
US6371711B1 (en) * 1999-03-19 2002-04-16 Integrated Environmental Technologies, Llc Valveless continuous atmospherically isolated container feeding assembly
US6457971B2 (en) * 1999-06-17 2002-10-01 Btu International, Inc. Continuous furnace having traveling gas barrier
US20070269297A1 (en) * 2003-11-10 2007-11-22 Meulen Peter V D Semiconductor wafer handling and transport
JP4817802B2 (en) * 2005-10-31 2011-11-16 東京応化工業株式会社 Transport processing device
JP4985031B2 (en) * 2007-03-29 2012-07-25 東京エレクトロン株式会社 Vacuum processing apparatus, operating method of vacuum processing apparatus, and storage medium
US8408858B2 (en) * 2007-08-30 2013-04-02 Ascentool International Limited Substrate processing system having improved substrate transport system
US7806641B2 (en) * 2007-08-30 2010-10-05 Ascentool, Inc. Substrate processing system having improved substrate transport system
JP4209457B1 (en) * 2008-02-29 2009-01-14 三菱重工業株式会社 Room temperature bonding equipment
US8298339B2 (en) * 2008-08-04 2012-10-30 Xunlight Corporation Roll-to-roll continuous thin film PV manufacturing process and equipment with real time online IV measurement
KR101296659B1 (en) * 2008-11-14 2013-08-14 엘지디스플레이 주식회사 Washing device
NL2007658C2 (en) * 2011-10-26 2013-05-01 Smit Ovens Bv DEVICE FOR HEATING A SUBSTRATE.

Also Published As

Publication number Publication date
KR20150050489A (en) 2015-05-08
CN104600001A (en) 2015-05-06
US20150118012A1 (en) 2015-04-30
JP2015092566A (en) 2015-05-14
TW201533827A (en) 2015-09-01

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