SG10201405644QA - Unit control panel, substrate transfer test method, and substrate processing apparatus - Google Patents

Unit control panel, substrate transfer test method, and substrate processing apparatus

Info

Publication number
SG10201405644QA
SG10201405644QA SG10201405644QA SG10201405644QA SG10201405644QA SG 10201405644Q A SG10201405644Q A SG 10201405644QA SG 10201405644Q A SG10201405644Q A SG 10201405644QA SG 10201405644Q A SG10201405644Q A SG 10201405644QA SG 10201405644Q A SG10201405644Q A SG 10201405644QA
Authority
SG
Singapore
Prior art keywords
processing apparatus
control panel
test method
unit control
transfer test
Prior art date
Application number
SG10201405644QA
Inventor
Shunsuke Matsuzawa
Masafumi Inoue
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Publication of SG10201405644QA publication Critical patent/SG10201405644QA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
SG10201405644QA 2013-09-11 2014-09-11 Unit control panel, substrate transfer test method, and substrate processing apparatus SG10201405644QA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013188073A JP6216193B2 (en) 2013-09-11 2013-09-11 Unit control panel, substrate transfer test method, and substrate processing apparatus

Publications (1)

Publication Number Publication Date
SG10201405644QA true SG10201405644QA (en) 2015-04-29

Family

ID=52625792

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201405644QA SG10201405644QA (en) 2013-09-11 2014-09-11 Unit control panel, substrate transfer test method, and substrate processing apparatus

Country Status (3)

Country Link
US (1) US9849488B2 (en)
JP (1) JP6216193B2 (en)
SG (1) SG10201405644QA (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015201598A (en) * 2014-04-10 2015-11-12 株式会社荏原製作所 Substrate processor
JP7176823B2 (en) * 2018-10-09 2022-11-22 株式会社スギノマシン CLEANING DEVICE AND METHOD FOR CLEANING AND DRYING OBJECT
CN112086394A (en) * 2020-07-30 2020-12-15 北京烁科精微电子装备有限公司 Wafer transfer transmission device and wafer transfer transmission method

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5511005A (en) * 1994-02-16 1996-04-23 Ade Corporation Wafer handling and processing system
US6137303A (en) * 1998-12-14 2000-10-24 Sony Corporation Integrated testing method and apparatus for semiconductor test operations processing
JP3369145B2 (en) 2000-03-23 2003-01-20 株式会社東京精密 Unit separation type polishing machine
JP2002231594A (en) * 2001-01-31 2002-08-16 Mitsubishi Electric Corp Production control system of semiconductor device, production control method of semiconductor device and method for manufacturing semiconductor device
JP4884594B2 (en) * 2001-03-22 2012-02-29 東京エレクトロン株式会社 Semiconductor manufacturing apparatus and control method
US6832863B2 (en) * 2002-06-11 2004-12-21 Dainippon Screen Mfg. Co., Ltd. Substrate treating apparatus and method
JP2004103761A (en) * 2002-09-09 2004-04-02 Renesas Technology Corp Semiconductor device manufacturing line
US7138629B2 (en) * 2003-04-22 2006-11-21 Ebara Corporation Testing apparatus using charged particles and device manufacturing method using the testing apparatus
JP5120018B2 (en) * 2007-05-15 2013-01-16 東京エレクトロン株式会社 Probe device
US7741837B2 (en) * 2007-05-15 2010-06-22 Tokyo Electron Limited Probe apparatus
JP5821689B2 (en) * 2011-04-20 2015-11-24 東京エレクトロン株式会社 Substrate processing apparatus, substrate processing method, and storage medium

Also Published As

Publication number Publication date
US20150071742A1 (en) 2015-03-12
US9849488B2 (en) 2017-12-26
JP6216193B2 (en) 2017-10-18
JP2015056468A (en) 2015-03-23

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