SG10201405260YA - Processing agent composition for semiconductor surface and method for processing semiconductor surface using same - Google Patents

Processing agent composition for semiconductor surface and method for processing semiconductor surface using same

Info

Publication number
SG10201405260YA
SG10201405260YA SG10201405260YA SG10201405260YA SG10201405260YA SG 10201405260Y A SG10201405260Y A SG 10201405260YA SG 10201405260Y A SG10201405260Y A SG 10201405260YA SG 10201405260Y A SG10201405260Y A SG 10201405260YA SG 10201405260Y A SG10201405260Y A SG 10201405260YA
Authority
SG
Singapore
Prior art keywords
semiconductor surface
processing
same
agent composition
processing agent
Prior art date
Application number
SG10201405260YA
Inventor
Hironori Mizuta
Takuhiro Kimura
Original Assignee
Wako Pure Chem Ind Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wako Pure Chem Ind Ltd filed Critical Wako Pure Chem Ind Ltd
Publication of SG10201405260YA publication Critical patent/SG10201405260YA/en

Links

Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26Processing photosensitive materials; Apparatus therefor
    • G03F7/42Stripping or agents therefor
    • G03F7/422Stripping or agents therefor using liquids only
    • G03F7/425Stripping or agents therefor using liquids only containing mineral alkaline compounds; containing organic basic compounds, e.g. quaternary ammonium compounds; containing heterocyclic basic compounds containing nitrogen
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26Processing photosensitive materials; Apparatus therefor
    • G03F7/42Stripping or agents therefor
    • G03F7/422Stripping or agents therefor using liquids only
    • G03F7/423Stripping or agents therefor using liquids only containing mineral acids or salts thereof, containing mineral oxidizing substances, e.g. peroxy compounds
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26Processing photosensitive materials; Apparatus therefor
    • G03F7/42Stripping or agents therefor
    • G03F7/422Stripping or agents therefor using liquids only
    • G03F7/426Stripping or agents therefor using liquids only containing organic halogen compounds; containing organic sulfonic acids or salts thereof; containing sulfoxides
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3105After-treatment
    • H01L21/311Etching the insulating layers by chemical or physical means
    • H01L21/31127Etching organic layers
    • H01L21/31133Etching organic layers by chemical means
    • CCHEMISTRY; METALLURGY
    • C11ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11DDETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D2111/00Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
    • C11D2111/10Objects to be cleaned
    • C11D2111/14Hard surfaces
    • C11D2111/22Electronic devices, e.g. PCBs or semiconductors

Landscapes

  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Materials For Photolithography (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Detergent Compositions (AREA)
SG10201405260YA 2009-09-02 2010-09-01 Processing agent composition for semiconductor surface and method for processing semiconductor surface using same SG10201405260YA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009202260 2009-09-02

Publications (1)

Publication Number Publication Date
SG10201405260YA true SG10201405260YA (en) 2014-10-30

Family

ID=43649307

Family Applications (2)

Application Number Title Priority Date Filing Date
SG10201405260YA SG10201405260YA (en) 2009-09-02 2010-09-01 Processing agent composition for semiconductor surface and method for processing semiconductor surface using same
SG2012014940A SG178611A1 (en) 2009-09-02 2010-09-01 Processing agent composition for semiconductor surface and method for processing semiconductor surface using same

Family Applications After (1)

Application Number Title Priority Date Filing Date
SG2012014940A SG178611A1 (en) 2009-09-02 2010-09-01 Processing agent composition for semiconductor surface and method for processing semiconductor surface using same

Country Status (9)

Country Link
US (1) US9034810B2 (en)
EP (1) EP2475000B1 (en)
JP (1) JP5652399B2 (en)
KR (1) KR20120073228A (en)
CN (1) CN102484057B (en)
IL (1) IL218408A0 (en)
SG (2) SG10201405260YA (en)
TW (1) TW201128328A (en)
WO (1) WO2011027772A1 (en)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5077594B2 (en) * 2010-01-26 2012-11-21 信越化学工業株式会社 Positive resist material and pattern forming method
CN102998915A (en) * 2012-07-17 2013-03-27 张峰 Positive photoresist and stripping agent composition
CN103383529B (en) * 2012-07-18 2015-12-02 张峰 Fluid composition removed by positive photo glue
CN103383530B (en) * 2012-07-18 2015-12-02 张峰 Positive photoresist-cleaningagent agent composition
CN103543620B (en) * 2013-11-11 2016-07-06 深圳市星扬化工有限公司 A kind of printed circuit board development film removes liquid
CN105873691B (en) 2013-12-06 2018-04-20 富士胶片电子材料美国有限公司 For removing the cleaning composite of the residue on surface
WO2015152212A1 (en) * 2014-03-31 2015-10-08 富士フイルム株式会社 Remover liquid and removing method
KR102153745B1 (en) 2014-04-16 2020-09-09 삼성전자주식회사 Cleaning solution composition and method of cleaning a semiconductor device using the same
TW201627781A (en) * 2014-10-14 2016-08-01 Az電子材料盧森堡有限公司 Resist pattern-forming composition and pattern forming method using the same
CN106298442B (en) * 2015-05-25 2020-11-27 中芯国际集成电路制造(上海)有限公司 Method for removing residue
CN106919011B (en) * 2015-12-25 2021-12-17 安集微电子科技(上海)股份有限公司 Hydroxylamine stripping cleaning solution rich in water
WO2018043440A1 (en) 2016-08-31 2018-03-08 富士フイルム株式会社 Processing liquid, substrate cleaning method, and method for producing semiconductor devices
JP6965144B2 (en) 2016-12-29 2021-11-10 東京応化工業株式会社 Cleaning liquid and method for manufacturing it
JP6965143B2 (en) 2016-12-29 2021-11-10 東京応化工業株式会社 Cleaning liquids, anticorrosive agents, and methods for manufacturing them
US10597609B2 (en) 2016-12-29 2020-03-24 Tokyo Ohka Kogyo Co., Ltd. Cleaning liquid, anticorrosion agent, and method for manufacturing the same
US10597616B2 (en) 2016-12-29 2020-03-24 Toyota Ohka Kogyo Co., Ltd. Cleaning liquid and method for manufacturing the same
EP3774680A4 (en) * 2018-03-28 2021-05-19 FUJIFILM Electronic Materials U.S.A, Inc. Cleaning compositions
WO2021100353A1 (en) * 2019-11-22 2021-05-27 富士フイルムエレクトロニクスマテリアルズ株式会社 Cleaning solution and cleaning method
KR20220109425A (en) * 2020-01-28 2022-08-04 후지필름 가부시키가이샤 Treatment liquid and treatment method
JP7525338B2 (en) 2020-08-31 2024-07-30 株式会社Screenホールディングス SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS
CN114014776B (en) * 2021-12-09 2024-03-12 西安鸿钧睿泽新材料科技有限公司 Compound with low global warming potential value, preparation method and application thereof
JP2024065657A (en) * 2022-10-31 2024-05-15 東京応化工業株式会社 Cleaning solution and substrate cleaning method

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3389166B2 (en) * 1999-09-10 2003-03-24 日本電気株式会社 Stripping composition for resist
JP3410403B2 (en) * 1999-09-10 2003-05-26 東京応化工業株式会社 Photoresist stripping solution and photoresist stripping method using the same
JP2001100436A (en) * 1999-09-28 2001-04-13 Mitsubishi Gas Chem Co Inc Resist removing solution composition
US6831048B2 (en) * 2000-04-26 2004-12-14 Daikin Industries, Ltd. Detergent composition
AU2003225178A1 (en) * 2002-04-24 2003-11-10 Ekc Technology, Inc. Oxalic acid as a cleaning product for aluminium, copper and dielectric surfaces
JP4443864B2 (en) * 2002-07-12 2010-03-31 株式会社ルネサステクノロジ Cleaning solution for removing resist or etching residue and method for manufacturing semiconductor device
EP1536291A4 (en) * 2002-08-22 2008-08-06 Daikin Ind Ltd Removing solution
JP2004241414A (en) 2003-02-03 2004-08-26 Sharp Corp Stripper/cleaner
CN1875325B (en) * 2003-10-29 2011-01-26 马林克罗特贝克公司 Alkaline, post plasma etch/ash residue removers and photoresist stripping compositions containing metal-halide corrosion inhibitors
JP2005209953A (en) * 2004-01-23 2005-08-04 Tokyo Ohka Kogyo Co Ltd Stripper/cleaner, method of cleaning semiconductor substrate and method of forming metal wiring using stripper/cleaner
JP4440689B2 (en) * 2004-03-31 2010-03-24 東友ファインケム株式会社 Resist stripper composition
US20060003910A1 (en) * 2004-06-15 2006-01-05 Hsu Jiun Y Composition and method comprising same for removing residue from a substrate
SG118380A1 (en) * 2004-06-15 2006-01-27 Air Prod & Chem Composition and method comprising same for removing residue from a substrate
JP4456424B2 (en) 2004-06-29 2010-04-28 関東化学株式会社 Photoresist residue and polymer residue removal composition
JP2006106616A (en) 2004-10-08 2006-04-20 Tokyo Ohka Kogyo Co Ltd Treating liquid for removing photoresist and substrate treatment method
EP1893355A1 (en) * 2005-06-16 2008-03-05 Advanced Technology Materials, Inc. Dense fluid compositions for removal of hardened photoresist, post-etch residue and/or bottom anti-reflective coating layers
US7700533B2 (en) * 2005-06-23 2010-04-20 Air Products And Chemicals, Inc. Composition for removal of residue comprising cationic salts and methods using same
WO2007058286A1 (en) 2005-11-18 2007-05-24 Mitsubishi Gas Chemical Company, Inc. Method and apparatus for cleaning substrate
US7947637B2 (en) * 2006-06-30 2011-05-24 Fujifilm Electronic Materials, U.S.A., Inc. Cleaning formulation for removing residues on surfaces
JP2009075285A (en) * 2007-09-20 2009-04-09 Fujifilm Corp Stripper for semiconductor device and stripping method
WO2009058278A1 (en) * 2007-10-29 2009-05-07 Ekc Technology, Inc Methods of cleaning semiconductor devices at the back end of line using amidoxime compositions
TWI460557B (en) * 2008-03-07 2014-11-11 Wako Pure Chem Ind Ltd Processing agent composition for semiconductor surfaces and method for processing semiconductor surfaces using the same

Also Published As

Publication number Publication date
CN102484057A (en) 2012-05-30
JPWO2011027772A1 (en) 2013-02-04
SG178611A1 (en) 2012-03-29
JP5652399B2 (en) 2015-01-14
WO2011027772A1 (en) 2011-03-10
EP2475000A4 (en) 2013-03-27
EP2475000A1 (en) 2012-07-11
TW201128328A (en) 2011-08-16
CN102484057B (en) 2015-10-14
KR20120073228A (en) 2012-07-04
EP2475000B1 (en) 2015-07-01
IL218408A0 (en) 2012-04-30
US20120157368A1 (en) 2012-06-21
US9034810B2 (en) 2015-05-19

Similar Documents

Publication Publication Date Title
IL218408A0 (en) Processing agent composition for semiconductor surface and method for processing semiconductor surface using same
EP2229243A4 (en) Method and composition for cleaning wafers
TWI560767B (en) Substrate processing apparatus and substrate processing method
EP2461360A4 (en) Semiconductor device and method for manufacturing same
SG10201608964TA (en) Cleaning agent for semiconductor substrates and method for processing semiconductor substrate surface
EP2472588A4 (en) Semiconductor device and method for manufacturing same
EP2211374A4 (en) Substrate processing method and substrate processed by this method
SG2014009203A (en) Substrate processing apparatus
EP2390932A4 (en) Semiconductor device and method for manufacturing same
EP2341529A4 (en) Method for manufacturing semiconductor device and semiconductor device
EP2305404A4 (en) Work processing apparatus and work processing method
EP2530706A4 (en) Method for reclaiming semiconductor wafer and polishing composition
IL207988A0 (en) Semiconductor surface treating agent composition and method for treating semiconductor surface using the semiconductor surface treating agent composition
EP2296175A4 (en) Semiconductor component fabrication method and semiconductor component
LT2475797T (en) Method and device for hardening work pieces
IL210097A0 (en) Compositions and methods for treating unfluenza
EP2366194A4 (en) Semiconductor wafer and method for producing same
EP2504428A4 (en) Methods and compositions for treating oxalate-related conditions
EP2284876A4 (en) Manufacturing method for semiconductor device and semiconductor device
EP2343598A4 (en) Substrate processing liquid and method for processing resist substrate using same
EP2502957A4 (en) Method for processing rubber surface and sealing member
HRP20130580T1 (en) Method for processing bast-fiber materials
GB0822993D0 (en) Semiconductor device and fabrication method
TWI370513B (en) Substrate processing apparatus and substrate processing method
SG184307A1 (en) Composition and method for polishing bulk silicon