SG10201404158RA - Air cooled faraday shield and methods for using the same - Google Patents

Air cooled faraday shield and methods for using the same

Info

Publication number
SG10201404158RA
SG10201404158RA SG10201404158RA SG10201404158RA SG10201404158RA SG 10201404158R A SG10201404158R A SG 10201404158RA SG 10201404158R A SG10201404158R A SG 10201404158RA SG 10201404158R A SG10201404158R A SG 10201404158RA SG 10201404158R A SG10201404158R A SG 10201404158RA
Authority
SG
Singapore
Prior art keywords
methods
same
air cooled
faraday shield
cooled faraday
Prior art date
Application number
SG10201404158RA
Inventor
Saravanapriyan Sriraman
John Drewery
John Mcchesney
Alex Paterson
Original Assignee
Lam Res Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lam Res Corp filed Critical Lam Res Corp
Publication of SG10201404158RA publication Critical patent/SG10201404158RA/en

Links

Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24HEATING; RANGES; VENTILATING
    • F24FAIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
    • F24F13/00Details common to, or for air-conditioning, air-humidification, ventilation or use of air currents for screening
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/32009Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32082Radio frequency generated discharge
    • H01J37/321Radio frequency generated discharge the radio frequency energy being inductively coupled to the plasma
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/32431Constructional details of the reactor
    • H01J37/32458Vessel
    • H01J37/32522Temperature
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/32431Constructional details of the reactor
    • H01J37/32623Mechanical discharge control means
    • H01J37/32651Shields, e.g. dark space shields, Faraday shields
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/32917Plasma diagnostics
    • H01J37/32935Monitoring and controlling tubes by information coming from the object and/or discharge
    • H01J37/32963End-point detection

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Combustion & Propulsion (AREA)
  • Plasma Technology (AREA)
  • Health & Medical Sciences (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
SG10201404158RA 2013-07-17 2014-07-17 Air cooled faraday shield and methods for using the same SG10201404158RA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201361847407P 2013-07-17 2013-07-17
US13/974,324 US9885493B2 (en) 2013-07-17 2013-08-23 Air cooled faraday shield and methods for using the same

Publications (1)

Publication Number Publication Date
SG10201404158RA true SG10201404158RA (en) 2015-02-27

Family

ID=52342614

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201404158RA SG10201404158RA (en) 2013-07-17 2014-07-17 Air cooled faraday shield and methods for using the same

Country Status (4)

Country Link
US (3) US9885493B2 (en)
KR (1) KR102306397B1 (en)
SG (1) SG10201404158RA (en)
TW (1) TWI640728B (en)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10249475B2 (en) 2014-04-01 2019-04-02 Applied Materials, Inc. Cooling mechanism utlized in a plasma reactor with enhanced temperature regulation
CN108024436A (en) * 2016-11-01 2018-05-11 中微半导体设备(上海)有限公司 A kind of plasma processing apparatus
KR102204118B1 (en) * 2017-02-20 2021-01-19 베이징 이타운 세미컨덕터 테크놀로지 컴퍼니 리미티드 Temperature control using a temperature control element coupled to the Faraday shield
US10410836B2 (en) * 2017-02-22 2019-09-10 Lam Research Corporation Systems and methods for tuning to reduce reflected power in multiple states
US11670490B2 (en) * 2017-09-29 2023-06-06 Taiwan Semiconductor Manufacturing Co., Ltd. Integrated circuit fabrication system with adjustable gas injector
US11521828B2 (en) 2017-10-09 2022-12-06 Applied Materials, Inc. Inductively coupled plasma source
US11538666B2 (en) * 2017-11-15 2022-12-27 Lam Research Corporation Multi-zone cooling of plasma heated window
KR102273084B1 (en) * 2018-06-29 2021-07-06 주식회사 엘지화학 Method for plasma etching process using faraday box
CN110660707B (en) * 2018-06-29 2022-06-14 台湾积体电路制造股份有限公司 Plasma generation system and temperature adjustment method
KR20220134680A (en) * 2020-01-31 2022-10-05 램 리써치 코포레이션 Plenum Assemblies for Cooling Transformer Coupled Plasma Windows
KR102540773B1 (en) * 2021-01-19 2023-06-12 피에스케이 주식회사 Faraday shield and apparatus for treating substrate
WO2022173695A1 (en) * 2021-02-10 2022-08-18 Lam Research Corporation Hybrid liquid/air cooling system for tcp windows

Family Cites Families (48)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60169139A (en) 1984-02-13 1985-09-02 Canon Inc Vapor-phase treating apparatus
US4918031A (en) 1988-12-28 1990-04-17 American Telephone And Telegraph Company,At&T Bell Laboratories Processes depending on plasma generation using a helical resonator
US5433812A (en) 1993-01-19 1995-07-18 International Business Machines Corporation Apparatus for enhanced inductive coupling to plasmas with reduced sputter contamination
TW293983B (en) 1993-12-17 1996-12-21 Tokyo Electron Co Ltd
US5540800A (en) 1994-06-23 1996-07-30 Applied Materials, Inc. Inductively coupled high density plasma reactor for plasma assisted materials processing
US5685942A (en) * 1994-12-05 1997-11-11 Tokyo Electron Limited Plasma processing apparatus and method
US6034346A (en) * 1995-05-19 2000-03-07 Hitachi, Ltd. Method and apparatus for plasma processing apparatus
TW327236B (en) 1996-03-12 1998-02-21 Varian Associates Inductively coupled plasma reactor with faraday-sputter shield
US5669975A (en) 1996-03-27 1997-09-23 Sony Corporation Plasma producing method and apparatus including an inductively-coupled plasma source
US6245202B1 (en) * 1996-04-12 2001-06-12 Hitachi, Ltd. Plasma treatment device
US6280563B1 (en) 1997-12-31 2001-08-28 Lam Research Corporation Plasma device including a powered non-magnetic metal member between a plasma AC excitation source and the plasma
US6034345A (en) 1998-01-28 2000-03-07 Hot Tech Inc. Apparatus for repairing high temperature process vessels
DE59908941D1 (en) 1998-05-28 2004-04-29 Siemens Ag FUEL INJECTION VALVE FOR INTERNAL COMBUSTION ENGINES
US6390019B1 (en) * 1998-06-11 2002-05-21 Applied Materials, Inc. Chamber having improved process monitoring window
US6523493B1 (en) 2000-08-01 2003-02-25 Tokyo Electron Limited Ring-shaped high-density plasma source and method
US6474258B2 (en) 1999-03-26 2002-11-05 Tokyo Electron Limited Apparatus and method for improving plasma distribution and performance in an inductively coupled plasma
US6326597B1 (en) * 1999-04-15 2001-12-04 Applied Materials, Inc. Temperature control system for process chamber
US6447637B1 (en) * 1999-07-12 2002-09-10 Applied Materials Inc. Process chamber having a voltage distribution electrode
JP3709552B2 (en) 1999-09-03 2005-10-26 株式会社日立製作所 Plasma processing apparatus and plasma processing method
US6447636B1 (en) 2000-02-16 2002-09-10 Applied Materials, Inc. Plasma reactor with dynamic RF inductive and capacitive coupling control
US6367412B1 (en) 2000-02-17 2002-04-09 Applied Materials, Inc. Porous ceramic liner for a plasma source
US6531030B1 (en) 2000-03-31 2003-03-11 Lam Research Corp. Inductively coupled plasma etching apparatus
US6422173B1 (en) 2000-06-30 2002-07-23 Lam Research Corporation Apparatus and methods for actively controlling RF peak-to-peak voltage in an inductively coupled plasma etching system
US20040194890A1 (en) 2001-09-28 2004-10-07 Tokyo Electron Limited Hybrid plasma processing apparatus
US6868800B2 (en) * 2001-09-28 2005-03-22 Tokyo Electron Limited Branching RF antennas and plasma processing apparatus
US6555745B1 (en) 2001-10-19 2003-04-29 Medtronic, Inc. Electrical interconnect between an articulating display and a PC based planar board
US6666982B2 (en) 2001-10-22 2003-12-23 Tokyo Electron Limited Protection of dielectric window in inductively coupled plasma generation
EP1525602A2 (en) 2002-07-31 2005-04-27 Lam Research Corporation Method for adjusting voltage on a powered faraday shield
US7223321B1 (en) 2002-08-30 2007-05-29 Lam Research Corporation Faraday shield disposed within an inductively coupled plasma etching apparatus
TWI238680B (en) * 2002-09-30 2005-08-21 Tokyo Electron Ltd Plasma processing system and method
JP3935850B2 (en) * 2003-01-31 2007-06-27 株式会社日立ハイテクノロジーズ Plasma processing equipment
US20040163595A1 (en) 2003-02-26 2004-08-26 Manabu Edamura Plasma processing apparatus
US7273533B2 (en) 2003-11-19 2007-09-25 Tokyo Electron Limited Plasma processing system with locally-efficient inductive plasma coupling
US7426900B2 (en) 2003-11-19 2008-09-23 Tokyo Electron Limited Integrated electrostatic inductive coupling for plasma processing
US7771562B2 (en) 2003-11-19 2010-08-10 Tokyo Electron Limited Etch system with integrated inductive coupling
US7179663B2 (en) 2004-04-16 2007-02-20 Taiwan Semiconductor Manufacturing Co., Ltd. CDA controller and method for stabilizing dome temperature
US7959984B2 (en) 2004-12-22 2011-06-14 Lam Research Corporation Methods and arrangement for the reduction of byproduct deposition in a plasma processing system
US7235492B2 (en) 2005-01-31 2007-06-26 Applied Materials, Inc. Low temperature etchant for treatment of silicon-containing surfaces
US7906032B2 (en) 2006-03-31 2011-03-15 Tokyo Electron Limited Method for conditioning a process chamber
US7829469B2 (en) 2006-12-11 2010-11-09 Tokyo Electron Limited Method and system for uniformity control in ballistic electron beam enhanced plasma processing system
KR101119627B1 (en) * 2007-03-29 2012-03-07 도쿄엘렉트론가부시키가이샤 Plasma process apparatus
JP2010176078A (en) 2009-02-02 2010-08-12 Stanley Electric Co Ltd Led backlight structure of lcd module
JP5136574B2 (en) 2009-05-01 2013-02-06 東京エレクトロン株式会社 Plasma processing apparatus and plasma processing method
CN101777391A (en) 2009-12-31 2010-07-14 中国科学院等离子体物理研究所 Faraday shield helium cooling pipe structure
US20110204023A1 (en) 2010-02-22 2011-08-25 No-Hyun Huh Multi inductively coupled plasma reactor and method thereof
JP5656458B2 (en) 2010-06-02 2015-01-21 株式会社日立ハイテクノロジーズ Plasma processing equipment
US9490106B2 (en) 2011-04-28 2016-11-08 Lam Research Corporation Internal Faraday shield having distributed chevron patterns and correlated positioning relative to external inner and outer TCP coil
CN202616187U (en) 2012-05-15 2012-12-19 中微半导体设备(上海)有限公司 Faraday shielding device with cooling function and plasma processing equipment

Also Published As

Publication number Publication date
US11692732B2 (en) 2023-07-04
TWI640728B (en) 2018-11-11
KR102306397B1 (en) 2021-09-29
US10690374B2 (en) 2020-06-23
KR20150009941A (en) 2015-01-27
TW201516350A (en) 2015-05-01
US20180156489A1 (en) 2018-06-07
US9885493B2 (en) 2018-02-06
US20150020969A1 (en) 2015-01-22
US20200318852A1 (en) 2020-10-08

Similar Documents

Publication Publication Date Title
SG10201404158RA (en) Air cooled faraday shield and methods for using the same
IL241503A0 (en) Magnetic cooling apparatus
GB201803318D0 (en) Sc-b cells and compositions and methods for generating the same
EP3051240A4 (en) Shielding device and refrigerator comprising same
EP2938284A4 (en) Systems and methods for interventional procedure planning
EP2995068A4 (en) An apparatus and associated methods
GB201304258D0 (en) Apparatus and methods for magnet retention
EP2981935A4 (en) An apparatus and associated methods
GB2528395B (en) Apparatus and methods for geosteering
AP2015008654A0 (en) Re-enterable enclosure and configuration for mounting
EP2974810A4 (en) Casting equipment and casting method using same
GB2511918B (en) Cooling Apparatus and method
GB2524185B (en) MRI cool down apparatus
EP3046475A4 (en) Lock-block shield device
GB201312658D0 (en) An apparatus and associated methods
EP2985541A4 (en) Duct and method for manufacturing same
EP2982843A4 (en) Shield and method for producing shield
GB201321088D0 (en) Cryogenic cooling apparatus and system
EP3051176A4 (en) Vibration-damping material and method for attaching vibration-damping material
GB201310158D0 (en) Medico-surgical assemblies and means
GB2533894B (en) Systems and methods for speed-adjustable model navigation
EP2892342A4 (en) An antibiofilm and methods for making and using the same
EP3001005A4 (en) Heat insulator and fastening structure for same
EP3001881A4 (en) Photovoltaic devices and methods for making the same
GB201320250D0 (en) Mounting methods and assemblies for longitudinally extensive members