SG10201400311PA - A chemical vapour deposition injector - Google Patents
A chemical vapour deposition injectorInfo
- Publication number
- SG10201400311PA SG10201400311PA SG10201400311PA SG10201400311PA SG10201400311PA SG 10201400311P A SG10201400311P A SG 10201400311PA SG 10201400311P A SG10201400311P A SG 10201400311PA SG 10201400311P A SG10201400311P A SG 10201400311PA SG 10201400311P A SG10201400311P A SG 10201400311PA
- Authority
- SG
- Singapore
- Prior art keywords
- vapour deposition
- chemical vapour
- injector
- deposition injector
- chemical
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45563—Gas nozzles
- C23C16/45565—Shower nozzles
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemical Vapour Deposition (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US13/847,628 US20140284404A1 (en) | 2013-03-20 | 2013-03-20 | Chemical vapour deposition injector |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG10201400311PA true SG10201400311PA (en) | 2014-10-30 |
Family
ID=51568394
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG10201400311PA SG10201400311PA (en) | 2013-03-20 | 2014-02-28 | A chemical vapour deposition injector |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US20140284404A1 (en) |
| SG (1) | SG10201400311PA (en) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9574268B1 (en) | 2011-10-28 | 2017-02-21 | Asm America, Inc. | Pulsed valve manifold for atomic layer deposition |
| TWI473903B (en) * | 2013-02-23 | 2015-02-21 | Hermes Epitek Corp | Gas Injector and Cover Plate Assembly for Semiconductor Equipment |
| KR102215965B1 (en) | 2014-04-11 | 2021-02-18 | 주성엔지니어링(주) | Apparatus for injection gas and apparatus for processing substrate including the same |
| KR102331779B1 (en) * | 2014-04-11 | 2021-12-01 | 주성엔지니어링(주) | Apparatus for injection gas and apparatus for processing substrate including the same |
| US10662527B2 (en) | 2016-06-01 | 2020-05-26 | Asm Ip Holding B.V. | Manifolds for uniform vapor deposition |
| US11694911B2 (en) * | 2016-12-20 | 2023-07-04 | Lam Research Corporation | Systems and methods for metastable activated radical selective strip and etch using dual plenum showerhead |
| TWM597506U (en) * | 2018-04-13 | 2020-06-21 | 美商維高儀器股份有限公司 | Chemical vapor deposition apparatus with multi-zone injector block |
| US11492701B2 (en) | 2019-03-19 | 2022-11-08 | Asm Ip Holding B.V. | Reactor manifolds |
| TWI857147B (en) * | 2019-10-04 | 2024-10-01 | 美商應用材料股份有限公司 | Gas distribution assembly mounting for fragile plates to prevent breakage |
| KR20210048408A (en) | 2019-10-22 | 2021-05-03 | 에이에스엠 아이피 홀딩 비.브이. | Semiconductor deposition reactor manifolds |
| CN114351117B (en) * | 2020-10-13 | 2022-12-20 | 东部超导科技（苏州）有限公司 | Spray plate, MOCVD reaction system with spray plate and use method of MOCVD reaction system |
| CN115341197B (en) * | 2022-09-15 | 2023-08-11 | 东部超导科技（苏州）有限公司 | Spray cooling integrated plate and spray system for metal organic chemical vapor deposition |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3360098B2 (en) * | 1995-04-20 | 2002-12-24 | 東京エレクトロン株式会社 | Shower head structure of processing equipment |
| US6302964B1 (en) * | 1998-06-16 | 2001-10-16 | Applied Materials, Inc. | One-piece dual gas faceplate for a showerhead in a semiconductor wafer processing system |
| US6764658B2 (en) * | 2002-01-08 | 2004-07-20 | Wisconsin Alumni Research Foundation | Plasma generator |
| JP4344949B2 (en) * | 2005-12-27 | 2009-10-14 | セイコーエプソン株式会社 | Shower head, film forming apparatus including shower head, and method for manufacturing ferroelectric film |
| US8100082B2 (en) * | 2007-05-18 | 2012-01-24 | Tokyo Electron Limited | Method and system for introducing process fluid through a chamber component |
-
2013
- 2013-03-20 US US13/847,628 patent/US20140284404A1/en not_active Abandoned
-
2014
- 2014-02-28 SG SG10201400311PA patent/SG10201400311PA/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| US20140284404A1 (en) | 2014-09-25 |
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