SE9903798L - - Google Patents
Info
- Publication number
- SE9903798L SE9903798L SE9903798A SE9903798A SE9903798L SE 9903798 L SE9903798 L SE 9903798L SE 9903798 A SE9903798 A SE 9903798A SE 9903798 A SE9903798 A SE 9903798A SE 9903798 L SE9903798 L SE 9903798L
- Authority
- SE
- Sweden
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/02—Bonding areas ; Manufacturing methods related thereto
- H01L24/03—Manufacturing methods
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
Priority Applications (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| SE9903798A SE522141C2 (en) | 1999-10-19 | 1999-10-19 | Bonding method for sensor and biological circuit, involves selectively depositing bondable section on a member before bonding the member with silicon member together for anodic bonding |
| EP00973305A EP1234330A2 (en) | 1999-10-19 | 2000-10-17 | Method relating to anodic bonding |
| PCT/SE2000/002012 WO2001029890A2 (en) | 1999-10-19 | 2000-10-17 | Method relating to anodic bonding |
| AU11831/01A AU1183101A (en) | 1999-10-19 | 2000-10-17 | Method relating to anodic bonding |
| JP2001531139A JP2003512723A (en) | 1999-10-19 | 2000-10-17 | Method for anodic bonding |
| US10/111,138 US6951797B1 (en) | 1999-10-19 | 2000-10-17 | Method relating to anodic bonding |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| SE9903798A SE522141C2 (en) | 1999-10-19 | 1999-10-19 | Bonding method for sensor and biological circuit, involves selectively depositing bondable section on a member before bonding the member with silicon member together for anodic bonding |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| SE9903798D0 SE9903798D0 (en) | 1999-10-19 |
| SE9903798L true SE9903798L (en) | 2001-04-20 |
| SE522141C2 SE522141C2 (en) | 2004-01-20 |
Family
ID=20417437
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SE9903798A SE522141C2 (en) | 1999-10-19 | 1999-10-19 | Bonding method for sensor and biological circuit, involves selectively depositing bondable section on a member before bonding the member with silicon member together for anodic bonding |
Country Status (1)
| Country | Link |
|---|---|
| SE (1) | SE522141C2 (en) |
-
1999
- 1999-10-19 SE SE9903798A patent/SE522141C2/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| SE9903798D0 (en) | 1999-10-19 |
| SE522141C2 (en) | 2004-01-20 |