SE9903798D0 - Method relating to anodic bonding - Google Patents

Method relating to anodic bonding

Info

Publication number
SE9903798D0
SE9903798D0 SE9903798A SE9903798A SE9903798D0 SE 9903798 D0 SE9903798 D0 SE 9903798D0 SE 9903798 A SE9903798 A SE 9903798A SE 9903798 A SE9903798 A SE 9903798A SE 9903798 D0 SE9903798 D0 SE 9903798D0
Authority
SE
Sweden
Prior art keywords
anodic bonding
method related
silicon
bonded
independent
Prior art date
Application number
SE9903798A
Other languages
English (en)
Other versions
SE9903798L (sv
SE522141C2 (sv
Inventor
Leif Bergstedt
Gert Andersson
Britta Ottosson
Original Assignee
Imego Ab
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Imego Ab filed Critical Imego Ab
Priority to SE9903798A priority Critical patent/SE522141C2/sv
Publication of SE9903798D0 publication Critical patent/SE9903798D0/sv
Priority to US10/111,138 priority patent/US6951797B1/en
Priority to JP2001531139A priority patent/JP2003512723A/ja
Priority to EP00973305A priority patent/EP1234330A2/en
Priority to AU11831/01A priority patent/AU1183101A/en
Priority to PCT/SE2000/002012 priority patent/WO2001029890A2/en
Publication of SE9903798L publication Critical patent/SE9903798L/xx
Publication of SE522141C2 publication Critical patent/SE522141C2/sv

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/03—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Measurement Of The Respiration, Hearing Ability, Form, And Blood Characteristics Of Living Organisms (AREA)
  • Investigating Or Analyzing Materials By The Use Of Electric Means (AREA)
SE9903798A 1999-10-19 1999-10-19 Method relating to anodic bonding SE522141C2 (sv)

Priority Applications (6)

Application Number Priority Date Filing Date Title
SE9903798A SE522141C2 (sv) 1999-10-19 1999-10-19 Method relating to anodic bonding
US10/111,138 US6951797B1 (en) 1999-10-19 2000-10-17 Method relating to anodic bonding
JP2001531139A JP2003512723A (ja) 1999-10-19 2000-10-17 陽極接合に関する方法
EP00973305A EP1234330A2 (en) 1999-10-19 2000-10-17 Method relating to anodic bonding
AU11831/01A AU1183101A (en) 1999-10-19 2000-10-17 Method relating to anodic bonding
PCT/SE2000/002012 WO2001029890A2 (en) 1999-10-19 2000-10-17 Method relating to anodic bonding

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE9903798A SE522141C2 (sv) 1999-10-19 1999-10-19 Method relating to anodic bonding

Publications (3)

Publication Number Publication Date
SE9903798D0 true SE9903798D0 (sv) 1999-10-19
SE9903798L SE9903798L (sv) 2001-04-20
SE522141C2 SE522141C2 (sv) 2004-01-20

Family

ID=20417437

Family Applications (1)

Application Number Title Priority Date Filing Date
SE9903798A SE522141C2 (sv) 1999-10-19 1999-10-19 Method relating to anodic bonding

Country Status (1)

Country Link
SE (1) SE522141C2 (sv)

Also Published As

Publication number Publication date
SE9903798L (sv) 2001-04-20
SE522141C2 (sv) 2004-01-20

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