SE8701579D0 - Anordning for att lasa elektronikkomponenter pa en panel genom att bocka komponenternas ben - Google Patents

Anordning for att lasa elektronikkomponenter pa en panel genom att bocka komponenternas ben

Info

Publication number
SE8701579D0
SE8701579D0 SE8701579A SE8701579A SE8701579D0 SE 8701579 D0 SE8701579 D0 SE 8701579D0 SE 8701579 A SE8701579 A SE 8701579A SE 8701579 A SE8701579 A SE 8701579A SE 8701579 D0 SE8701579 D0 SE 8701579D0
Authority
SE
Sweden
Prior art keywords
components
bone
panel
loading electronic
electronic components
Prior art date
Application number
SE8701579A
Other languages
English (en)
Swedish (sv)
Other versions
SE8701579L (enEXAMPLES
Inventor
K Immonen
Original Assignee
Asea Ab
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asea Ab filed Critical Asea Ab
Priority to SE8701579A priority Critical patent/SE8701579D0/xx
Publication of SE8701579D0 publication Critical patent/SE8701579D0/xx
Publication of SE8701579L publication Critical patent/SE8701579L/sv

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/06—Wiring by machine

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
SE8701579A 1987-04-15 1987-04-15 Anordning for att lasa elektronikkomponenter pa en panel genom att bocka komponenternas ben SE8701579D0 (sv)

Priority Applications (1)

Application Number Priority Date Filing Date Title
SE8701579A SE8701579D0 (sv) 1987-04-15 1987-04-15 Anordning for att lasa elektronikkomponenter pa en panel genom att bocka komponenternas ben

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE8701579A SE8701579D0 (sv) 1987-04-15 1987-04-15 Anordning for att lasa elektronikkomponenter pa en panel genom att bocka komponenternas ben

Publications (2)

Publication Number Publication Date
SE8701579D0 true SE8701579D0 (sv) 1987-04-15
SE8701579L SE8701579L (enEXAMPLES) 1988-02-19

Family

ID=20368214

Family Applications (1)

Application Number Title Priority Date Filing Date
SE8701579A SE8701579D0 (sv) 1987-04-15 1987-04-15 Anordning for att lasa elektronikkomponenter pa en panel genom att bocka komponenternas ben

Country Status (1)

Country Link
SE (1) SE8701579D0 (enEXAMPLES)

Also Published As

Publication number Publication date
SE8701579L (enEXAMPLES) 1988-02-19

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