SE8504841D0 - PROTECTIVE MIXING FOR ELECTROMAGNETIC - Google Patents
PROTECTIVE MIXING FOR ELECTROMAGNETICInfo
- Publication number
- SE8504841D0 SE8504841D0 SE8504841A SE8504841A SE8504841D0 SE 8504841 D0 SE8504841 D0 SE 8504841D0 SE 8504841 A SE8504841 A SE 8504841A SE 8504841 A SE8504841 A SE 8504841A SE 8504841 D0 SE8504841 D0 SE 8504841D0
- Authority
- SE
- Sweden
- Prior art keywords
- electromagnetic
- composite film
- conducting
- protective
- mixing
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
- H05K9/0088—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a plurality of shielding layers; combining different shielding material structure
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/02—Fibres or whiskers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/24—Conductive material dispersed in non-conductive organic material the conductive material comprising carbon-silicon compounds, carbon or silicon
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
- H05K9/009—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising electro-conductive fibres, e.g. metal fibres, carbon fibres, metallised textile fibres, electro-conductive mesh, woven, non-woven mat, fleece, cross-linked
Landscapes
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Electromagnetism (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Dispersion Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Medicinal Chemistry (AREA)
- Textile Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Reinforced Plastic Materials (AREA)
Abstract
A composite film is disclosed which comprises a continuous matrix of a synthetic resin material which contains, randomly distributed therein, conducting fibres and a particulate, conducting or semiconducting filler. In addition to the fact that it has excellent EMI screening properties, the composite film is mouldable and has sufficient strength to be used as a structural component.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB8528383A GB2198734B (en) | 1985-11-15 | 1985-11-15 | Emi shielding composites |
Publications (3)
Publication Number | Publication Date |
---|---|
SE8504841D0 true SE8504841D0 (en) | 1985-10-16 |
SE8504841L SE8504841L (en) | 1989-07-12 |
SE462099B SE462099B (en) | 1990-05-07 |
Family
ID=10588388
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SE8504841A SE462099B (en) | 1985-11-15 | 1985-10-16 | EMI SHIELD COMPOSITION MATERIAL |
Country Status (4)
Country | Link |
---|---|
DE (1) | DE3539509A1 (en) |
FR (1) | FR2637839B1 (en) |
GB (1) | GB2198734B (en) |
SE (1) | SE462099B (en) |
Families Citing this family (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2234857B (en) * | 1987-10-07 | 1992-05-20 | Courtaulds Plc | Microwave-absorbing materials |
JPH02123178A (en) * | 1988-10-31 | 1990-05-10 | Nippon Petrochem Co Ltd | Electrically conductive coating |
US4952448A (en) * | 1989-05-03 | 1990-08-28 | General Electric Company | Fiber reinforced polymeric structure for EMI shielding and process for making same |
FR2743940B1 (en) * | 1989-07-28 | 1998-08-21 | Nowak Jean Michel | MICROWAVE ELECTROMAGNETIC WAVE ABSORBING COATING AND METHOD FOR APPLYING SUCH COATING ON A SUPPORT |
JP2883128B2 (en) * | 1989-11-13 | 1999-04-19 | 三菱化学株式会社 | Conductive thermoplastic resin composition |
EP0546182B1 (en) * | 1991-05-28 | 1997-07-09 | Osaka Gas Co., Ltd. | Method for absorbing electromagnetic wave |
GB2257305A (en) * | 1991-06-28 | 1993-01-06 | Delco Electronics Corp | Esd-protected cover for electronic components and method of making the same |
DE4410341A1 (en) * | 1994-03-25 | 1995-09-28 | Minnesota Mining & Mfg | Electrical conductor with an insulation made of plastic material |
DE4426906C2 (en) * | 1994-07-29 | 1996-10-24 | Daimler Benz Aerospace Airbus | Electrically conductive fiber composite material made of plastic and manufacturing process |
DE4431221A1 (en) * | 1994-09-02 | 1996-03-07 | Rheydt Kabelwerk Ag | Longitudinal and cross-waterproof energy cable |
DE4447957B4 (en) * | 1994-12-07 | 2006-03-09 | Ticona Gmbh | Hybrid fiber composite material |
JPH098490A (en) * | 1995-06-21 | 1997-01-10 | Nippon Paint Co Ltd | Electronic device case and unnecessary radiation reduction method |
DE19525692A1 (en) * | 1995-07-14 | 1997-01-16 | Abb Research Ltd | Electrically and thermally conductive plastic and the use of this plastic |
US5754643A (en) * | 1995-10-02 | 1998-05-19 | Lucent Technologies Inc. | Weatherable outside electronic device enclosure |
CA2401168A1 (en) | 2000-02-28 | 2001-09-07 | Amesbury Group, Inc. | Methods and apparatus for emi shielding |
EP1266549A2 (en) * | 2000-02-28 | 2002-12-18 | Amesbury Group, Inc. | Methods and apparatus for emi shielding |
JP2001279102A (en) | 2000-03-29 | 2001-10-10 | Yazaki Corp | Electroconductive paste |
US8299159B2 (en) * | 2009-08-17 | 2012-10-30 | Laird Technologies, Inc. | Highly thermally-conductive moldable thermoplastic composites and compositions |
CN110198989B (en) * | 2017-04-26 | 2023-06-16 | 积水技术成型株式会社 | Resin molded body |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4426470A (en) * | 1981-07-27 | 1984-01-17 | The Dow Chemical Company | Aqueous method of making reinforced composite material from latex, solid polymer and reinforcing material |
US4404125A (en) * | 1981-10-14 | 1983-09-13 | General Electric Company | Polyphenylene ether resin compositions for EMI electromagnetic interference shielding |
SE452280C (en) * | 1981-12-30 | 1990-02-02 | Bekaert Sa Nv | ELECTRIC LEADING PLASTIC ARTICLES AND PROCEDURES AND RESOURCES FOR PRODUCING THEREOF |
EP0085438B1 (en) * | 1982-02-03 | 1987-01-07 | Showa Denko Kabushiki Kaisha | Styrene-based resin composition |
US4538151A (en) * | 1982-03-31 | 1985-08-27 | Nippon Electric Co., Ltd. | Electro-magnetic wave absorbing material |
DE103695T1 (en) * | 1982-07-16 | 1984-09-27 | Showa Denko K.K., Tokyo | VOLCANIZED OLEFIN RUBBER COMPOSITION. |
NL8204288A (en) * | 1982-11-05 | 1984-06-01 | Gen Electric | POLYMER MIX, METHOD FOR PREPARING THE POLYMER MIX, ARTICLES FORMED FROM THE POLYMER MIX. |
JPS59152936A (en) * | 1983-02-21 | 1984-08-31 | Kuraray Co Ltd | Hybrid resin composition having excellent electromagnetic shielding property and rigidity |
US4602051A (en) * | 1983-09-07 | 1986-07-22 | Denki Kagaku Kogyo Kabushiki Kaisha | Resin composition having electromagnetic wave shielding effort |
-
1985
- 1985-10-16 SE SE8504841A patent/SE462099B/en not_active IP Right Cessation
- 1985-11-07 DE DE19853539509 patent/DE3539509A1/en active Granted
- 1985-11-15 GB GB8528383A patent/GB2198734B/en not_active Expired
- 1985-11-19 FR FR8517045A patent/FR2637839B1/fr not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
FR2637839B1 (en) | 1992-07-17 |
DE3539509A1 (en) | 1989-04-27 |
GB2198734B (en) | 1989-10-04 |
FR2637839A1 (en) | 1990-04-20 |
GB2198734A (en) | 1988-06-22 |
SE8504841L (en) | 1989-07-12 |
SE462099B (en) | 1990-05-07 |
GB8528383D0 (en) | 1988-04-07 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
SE8504841D0 (en) | PROTECTIVE MIXING FOR ELECTROMAGNETIC | |
BR8604149A (en) | PROCESS FOR THE PREPARATION OF INORGANIC FILLING AND COMPOSITION OF POLYMERIC RESIN UNDERSTANDING THE SAME | |
BR8904951A (en) | PROCESS OF PREPARATION OF DIETHERS AND COMPOSITES USED IN THE PREPARATION OF CATALYSTS OF THE TYPE ZIEGLER-NATTA | |
BR8803618A (en) | PROCESS TO INCREASE THE BARRIER PROPERTIES OF THERMOPLASTIC SUBSTRATES AND POLYMERIC CONTAINER HAVING PERFECTED BARRIER PROPERTIES | |
DE69030981T2 (en) | Radiation curable resin and composition containing the same | |
DE3069534D1 (en) | Novolak resin composition and products formed therefrom | |
BE882633A (en) | THERMOPLASTIC RESIN COMPOSITIONS AND MOLDED PRODUCTS USING THE SAME | |
DE3361729D1 (en) | Polymer compositions and their use in or as adhesive and other compositions | |
DE3783197T2 (en) | SINGLE-COMPONENT RESIN COMPOSITIONS AND THEIR CURING. | |
ZA83126B (en) | Polymer compositions and their use in or as adhesive and other compositions | |
BR8605040A (en) | THERMOPLASTIC PHENOLIC RESIN AND INK COMPOSITION | |
EP0480363A3 (en) | Curable resin and composition containing the same | |
DE3371988D1 (en) | Curable resin composition and its use | |
AR244744A1 (en) | Thermoset interleafed resin matrix composites with improved compression properties | |
DE3478858D1 (en) | Impact modifier and thermoplastic resin composition using the same | |
DE68920068T2 (en) | Resin composition and fiber reinforced composites made therefrom. | |
EP0326177A3 (en) | Epoxy resin composition and prepreg for composite materials using the same | |
DE69122791D1 (en) | Thermosetting resin composition and article obtained therefrom | |
BR9101397A (en) | COMPOSITION OF THERMOPLASTIC RESIN, PROCESS TO STABILIZE A THERMOPLASTIC RESIN, AND PROCESS TO IMPROVE THE MECHANICAL PROPERTIES OF A MODIFIED POLYOLEFIN RESIN | |
JPS55113561A (en) | Acryl group synthetic resin board whose inside has optical dissusing layer* and its preparation | |
KR910018460A (en) | Thermoplastic resin composition | |
BR8402618A (en) | POLYMERIC COMPOSITIONS, PROCESS FOR THE PREPARATION OF POLYMERIC COMPOSITES AND ARTICLES | |
DE3460043D1 (en) | Resin composition and articles formed therefrom | |
DE69026880T2 (en) | Thermosetting resin composition and articles made therewith | |
BR8701516A (en) | PERFECT THERMAL PROCESS TO MODIFY THE CARBON MATERIAL PROPERTIES THAT OCCUR NATURALLY |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
NAL | Patent in force |
Ref document number: 8504841-1 Format of ref document f/p: F |
|
NUG | Patent has lapsed |