SE8504841D0 - PROTECTIVE MIXING FOR ELECTROMAGNETIC - Google Patents

PROTECTIVE MIXING FOR ELECTROMAGNETIC

Info

Publication number
SE8504841D0
SE8504841D0 SE8504841A SE8504841A SE8504841D0 SE 8504841 D0 SE8504841 D0 SE 8504841D0 SE 8504841 A SE8504841 A SE 8504841A SE 8504841 A SE8504841 A SE 8504841A SE 8504841 D0 SE8504841 D0 SE 8504841D0
Authority
SE
Sweden
Prior art keywords
electromagnetic
composite film
conducting
protective
mixing
Prior art date
Application number
SE8504841A
Other languages
Swedish (sv)
Other versions
SE8504841L (en
SE462099B (en
Inventor
J Gamble
L D Yats
Original Assignee
Dow Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dow Chemical Co filed Critical Dow Chemical Co
Publication of SE8504841D0 publication Critical patent/SE8504841D0/en
Publication of SE8504841L publication Critical patent/SE8504841L/en
Publication of SE462099B publication Critical patent/SE462099B/en

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073Shielding materials
    • H05K9/0081Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0088Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a plurality of shielding layers; combining different shielding material structure
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00Use of ingredients characterised by shape
    • C08K7/02Fibres or whiskers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20Conductive material dispersed in non-conductive organic material
    • H01B1/22Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20Conductive material dispersed in non-conductive organic material
    • H01B1/24Conductive material dispersed in non-conductive organic material the conductive material comprising carbon-silicon compounds, carbon or silicon
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073Shielding materials
    • H05K9/0081Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/009Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising electro-conductive fibres, e.g. metal fibres, carbon fibres, metallised textile fibres, electro-conductive mesh, woven, non-woven mat, fleece, cross-linked

Landscapes

  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Electromagnetism (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Dispersion Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Medicinal Chemistry (AREA)
  • Textile Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Reinforced Plastic Materials (AREA)

Abstract

A composite film is disclosed which comprises a continuous matrix of a synthetic resin material which contains, randomly distributed therein, conducting fibres and a particulate, conducting or semiconducting filler. In addition to the fact that it has excellent EMI screening properties, the composite film is mouldable and has sufficient strength to be used as a structural component.
SE8504841A 1985-11-15 1985-10-16 EMI SHIELD COMPOSITION MATERIAL SE462099B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB8528383A GB2198734B (en) 1985-11-15 1985-11-15 Emi shielding composites

Publications (3)

Publication Number Publication Date
SE8504841D0 true SE8504841D0 (en) 1985-10-16
SE8504841L SE8504841L (en) 1989-07-12
SE462099B SE462099B (en) 1990-05-07

Family

ID=10588388

Family Applications (1)

Application Number Title Priority Date Filing Date
SE8504841A SE462099B (en) 1985-11-15 1985-10-16 EMI SHIELD COMPOSITION MATERIAL

Country Status (4)

Country Link
DE (1) DE3539509A1 (en)
FR (1) FR2637839B1 (en)
GB (1) GB2198734B (en)
SE (1) SE462099B (en)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2234857B (en) * 1987-10-07 1992-05-20 Courtaulds Plc Microwave-absorbing materials
JPH02123178A (en) * 1988-10-31 1990-05-10 Nippon Petrochem Co Ltd Electrically conductive coating
US4952448A (en) * 1989-05-03 1990-08-28 General Electric Company Fiber reinforced polymeric structure for EMI shielding and process for making same
FR2743940B1 (en) * 1989-07-28 1998-08-21 Nowak Jean Michel MICROWAVE ELECTROMAGNETIC WAVE ABSORBING COATING AND METHOD FOR APPLYING SUCH COATING ON A SUPPORT
JP2883128B2 (en) * 1989-11-13 1999-04-19 三菱化学株式会社 Conductive thermoplastic resin composition
EP0546182B1 (en) * 1991-05-28 1997-07-09 Osaka Gas Co., Ltd. Method for absorbing electromagnetic wave
GB2257305A (en) * 1991-06-28 1993-01-06 Delco Electronics Corp Esd-protected cover for electronic components and method of making the same
DE4410341A1 (en) * 1994-03-25 1995-09-28 Minnesota Mining & Mfg Electrical conductor with an insulation made of plastic material
DE4426906C2 (en) * 1994-07-29 1996-10-24 Daimler Benz Aerospace Airbus Electrically conductive fiber composite material made of plastic and manufacturing process
DE4431221A1 (en) * 1994-09-02 1996-03-07 Rheydt Kabelwerk Ag Longitudinal and cross-waterproof energy cable
DE4447957B4 (en) * 1994-12-07 2006-03-09 Ticona Gmbh Hybrid fiber composite material
JPH098490A (en) * 1995-06-21 1997-01-10 Nippon Paint Co Ltd Electronic device case and unnecessary radiation reduction method
DE19525692A1 (en) * 1995-07-14 1997-01-16 Abb Research Ltd Electrically and thermally conductive plastic and the use of this plastic
US5754643A (en) * 1995-10-02 1998-05-19 Lucent Technologies Inc. Weatherable outside electronic device enclosure
CA2401168A1 (en) 2000-02-28 2001-09-07 Amesbury Group, Inc. Methods and apparatus for emi shielding
EP1266549A2 (en) * 2000-02-28 2002-12-18 Amesbury Group, Inc. Methods and apparatus for emi shielding
JP2001279102A (en) 2000-03-29 2001-10-10 Yazaki Corp Electroconductive paste
US8299159B2 (en) * 2009-08-17 2012-10-30 Laird Technologies, Inc. Highly thermally-conductive moldable thermoplastic composites and compositions
CN110198989B (en) * 2017-04-26 2023-06-16 积水技术成型株式会社 Resin molded body

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4426470A (en) * 1981-07-27 1984-01-17 The Dow Chemical Company Aqueous method of making reinforced composite material from latex, solid polymer and reinforcing material
US4404125A (en) * 1981-10-14 1983-09-13 General Electric Company Polyphenylene ether resin compositions for EMI electromagnetic interference shielding
SE452280C (en) * 1981-12-30 1990-02-02 Bekaert Sa Nv ELECTRIC LEADING PLASTIC ARTICLES AND PROCEDURES AND RESOURCES FOR PRODUCING THEREOF
EP0085438B1 (en) * 1982-02-03 1987-01-07 Showa Denko Kabushiki Kaisha Styrene-based resin composition
US4538151A (en) * 1982-03-31 1985-08-27 Nippon Electric Co., Ltd. Electro-magnetic wave absorbing material
DE103695T1 (en) * 1982-07-16 1984-09-27 Showa Denko K.K., Tokyo VOLCANIZED OLEFIN RUBBER COMPOSITION.
NL8204288A (en) * 1982-11-05 1984-06-01 Gen Electric POLYMER MIX, METHOD FOR PREPARING THE POLYMER MIX, ARTICLES FORMED FROM THE POLYMER MIX.
JPS59152936A (en) * 1983-02-21 1984-08-31 Kuraray Co Ltd Hybrid resin composition having excellent electromagnetic shielding property and rigidity
US4602051A (en) * 1983-09-07 1986-07-22 Denki Kagaku Kogyo Kabushiki Kaisha Resin composition having electromagnetic wave shielding effort

Also Published As

Publication number Publication date
FR2637839B1 (en) 1992-07-17
DE3539509A1 (en) 1989-04-27
GB2198734B (en) 1989-10-04
FR2637839A1 (en) 1990-04-20
GB2198734A (en) 1988-06-22
SE8504841L (en) 1989-07-12
SE462099B (en) 1990-05-07
GB8528383D0 (en) 1988-04-07

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