GB2198734B - Emi shielding composites - Google Patents

Emi shielding composites

Info

Publication number
GB2198734B
GB2198734B GB8528383A GB8528383A GB2198734B GB 2198734 B GB2198734 B GB 2198734B GB 8528383 A GB8528383 A GB 8528383A GB 8528383 A GB8528383 A GB 8528383A GB 2198734 B GB2198734 B GB 2198734B
Authority
GB
United Kingdom
Prior art keywords
emi shielding
shielding composites
composites
emi
shielding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB8528383A
Other versions
GB8528383D0 (en
GB2198734A (en
Inventor
Jeffrey Gamble
Larry D Yats
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dow Chemical Co
Original Assignee
Dow Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to SE8504841A priority Critical patent/SE462099B/en
Priority to NL8503021A priority patent/NL193417C/en
Priority to DE19853539509 priority patent/DE3539509A1/en
Application filed by Dow Chemical Co filed Critical Dow Chemical Co
Priority to GB8528383A priority patent/GB2198734B/en
Priority to FR8517045A priority patent/FR2637839B1/fr
Publication of GB8528383D0 publication Critical patent/GB8528383D0/en
Publication of GB2198734A publication Critical patent/GB2198734A/en
Application granted granted Critical
Publication of GB2198734B publication Critical patent/GB2198734B/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0088—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a plurality of shielding layers; combining different shielding material structure
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/02—Fibres or whiskers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/24—Conductive material dispersed in non-conductive organic material the conductive material comprising carbon-silicon compounds, carbon or silicon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/009—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising electro-conductive fibres, e.g. metal fibres, carbon fibres, metallised textile fibres, electro-conductive mesh, woven, non-woven mat, fleece, cross-linked

Landscapes

  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Electromagnetism (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Dispersion Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Textile Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Reinforced Plastic Materials (AREA)
GB8528383A 1985-11-05 1985-11-15 Emi shielding composites Expired GB2198734B (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
SE8504841A SE462099B (en) 1985-11-15 1985-10-16 EMI SHIELD COMPOSITION MATERIAL
NL8503021A NL193417C (en) 1985-11-05 1985-11-05 EMI shielding layers.
DE19853539509 DE3539509A1 (en) 1985-11-15 1985-11-07 EMI screening compositions
GB8528383A GB2198734B (en) 1985-11-15 1985-11-15 Emi shielding composites
FR8517045A FR2637839B1 (en) 1985-11-15 1985-11-19

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB8528383A GB2198734B (en) 1985-11-15 1985-11-15 Emi shielding composites

Publications (3)

Publication Number Publication Date
GB8528383D0 GB8528383D0 (en) 1988-04-07
GB2198734A GB2198734A (en) 1988-06-22
GB2198734B true GB2198734B (en) 1989-10-04

Family

ID=10588388

Family Applications (1)

Application Number Title Priority Date Filing Date
GB8528383A Expired GB2198734B (en) 1985-11-05 1985-11-15 Emi shielding composites

Country Status (4)

Country Link
DE (1) DE3539509A1 (en)
FR (1) FR2637839B1 (en)
GB (1) GB2198734B (en)
SE (1) SE462099B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110198989A (en) * 2017-04-26 2019-09-03 积水技术成型株式会社 Resin molded body

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2234857B (en) * 1987-10-07 1992-05-20 Courtaulds Plc Microwave-absorbing materials
JPH02123178A (en) * 1988-10-31 1990-05-10 Nippon Petrochem Co Ltd Electrically conductive coating
US4952448A (en) * 1989-05-03 1990-08-28 General Electric Company Fiber reinforced polymeric structure for EMI shielding and process for making same
FR2743940B1 (en) * 1989-07-28 1998-08-21 Nowak Jean Michel MICROWAVE ELECTROMAGNETIC WAVE ABSORBING COATING AND METHOD FOR APPLYING SUCH COATING ON A SUPPORT
JP2883128B2 (en) * 1989-11-13 1999-04-19 三菱化学株式会社 Conductive thermoplastic resin composition
WO1992022193A1 (en) * 1991-05-28 1992-12-10 Osaka Gas Company Limited Method for absorbing electromagnetic wave
GB2257305A (en) * 1991-06-28 1993-01-06 Delco Electronics Corp Esd-protected cover for electronic components and method of making the same
DE4410341A1 (en) * 1994-03-25 1995-09-28 Minnesota Mining & Mfg Electrical conductor with an insulation made of plastic material
DE4426906C2 (en) * 1994-07-29 1996-10-24 Daimler Benz Aerospace Airbus Electrically conductive fiber composite material made of plastic and manufacturing process
DE4431221A1 (en) * 1994-09-02 1996-03-07 Rheydt Kabelwerk Ag Longitudinal and cross-waterproof energy cable
DE4447957B4 (en) * 1994-12-07 2006-03-09 Ticona Gmbh Hybrid fiber composite material
JPH098490A (en) * 1995-06-21 1997-01-10 Nippon Paint Co Ltd Electronic device case and unnecessary radiation reduction method
DE19525692A1 (en) * 1995-07-14 1997-01-16 Abb Research Ltd Electrically and thermally conductive plastic and the use of this plastic
US5754643A (en) * 1995-10-02 1998-05-19 Lucent Technologies Inc. Weatherable outside electronic device enclosure
US6652777B2 (en) 2000-02-28 2003-11-25 Amesbury Group, Inc. Method and apparatus for EMI shielding
KR20020086586A (en) * 2000-02-28 2002-11-18 아메스 베리 그룹, 인크 Methods and apparatus for emi shielding
JP2001279102A (en) 2000-03-29 2001-10-10 Yazaki Corp Electroconductive paste
US8299159B2 (en) * 2009-08-17 2012-10-30 Laird Technologies, Inc. Highly thermally-conductive moldable thermoplastic composites and compositions

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0077059A2 (en) * 1981-10-14 1983-04-20 General Electric Company Polyphenylene ether resin compositions for EMI electromagnetic interference shielding
GB2112796A (en) * 1981-12-30 1983-07-27 Bekaert Sa Nv Plastics materials containing electrically conductive fibers
EP0090432A2 (en) * 1982-03-31 1983-10-05 Nec Corporation Electro-magnetic wave absorbing material
EP0103695A1 (en) * 1982-07-16 1984-03-28 Showa Denko Kabushiki Kaisha Vulcanized olefin-based rubber composition
EP0112197A1 (en) * 1982-11-05 1984-06-27 General Electric Company Synergistic effect of metal flake and metal or metal coated fiber on EMI shielding effectiveness of thermoplastics
EP0117700A1 (en) * 1983-02-21 1984-09-05 Kuraray Co., Ltd. Rigid resin composition having electromagnetic shielding properties
EP0137290A2 (en) * 1983-09-07 1985-04-17 Denki Kagaku Kogyo Kabushiki Kaisha Resin composition having electromagnetic wave shielding effect

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4426470A (en) * 1981-07-27 1984-01-17 The Dow Chemical Company Aqueous method of making reinforced composite material from latex, solid polymer and reinforcing material
EP0085438B1 (en) * 1982-02-03 1987-01-07 Showa Denko Kabushiki Kaisha Styrene-based resin composition

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0077059A2 (en) * 1981-10-14 1983-04-20 General Electric Company Polyphenylene ether resin compositions for EMI electromagnetic interference shielding
GB2112796A (en) * 1981-12-30 1983-07-27 Bekaert Sa Nv Plastics materials containing electrically conductive fibers
EP0090432A2 (en) * 1982-03-31 1983-10-05 Nec Corporation Electro-magnetic wave absorbing material
EP0103695A1 (en) * 1982-07-16 1984-03-28 Showa Denko Kabushiki Kaisha Vulcanized olefin-based rubber composition
EP0112197A1 (en) * 1982-11-05 1984-06-27 General Electric Company Synergistic effect of metal flake and metal or metal coated fiber on EMI shielding effectiveness of thermoplastics
EP0117700A1 (en) * 1983-02-21 1984-09-05 Kuraray Co., Ltd. Rigid resin composition having electromagnetic shielding properties
EP0137290A2 (en) * 1983-09-07 1985-04-17 Denki Kagaku Kogyo Kabushiki Kaisha Resin composition having electromagnetic wave shielding effect

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110198989A (en) * 2017-04-26 2019-09-03 积水技术成型株式会社 Resin molded body

Also Published As

Publication number Publication date
SE8504841D0 (en) 1985-10-16
GB8528383D0 (en) 1988-04-07
SE462099B (en) 1990-05-07
DE3539509A1 (en) 1989-04-27
GB2198734A (en) 1988-06-22
FR2637839B1 (en) 1992-07-17
FR2637839A1 (en) 1990-04-20
SE8504841L (en) 1989-07-12

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee