SE8000247L - PROCEDURE FOR THE PREPARATION OF PRINTED COUPLES AND FOR THE PROCEDURE COATING MATERIAL - Google Patents

PROCEDURE FOR THE PREPARATION OF PRINTED COUPLES AND FOR THE PROCEDURE COATING MATERIAL

Info

Publication number
SE8000247L
SE8000247L SE8000247A SE8000247A SE8000247L SE 8000247 L SE8000247 L SE 8000247L SE 8000247 A SE8000247 A SE 8000247A SE 8000247 A SE8000247 A SE 8000247A SE 8000247 L SE8000247 L SE 8000247L
Authority
SE
Sweden
Prior art keywords
protective coating
procedure
gel
soft
printed
Prior art date
Application number
SE8000247A
Other languages
Swedish (sv)
Other versions
SE450804B (en
Inventor
E J Leech
Original Assignee
Kollmorgen Tech Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US06/103,600 external-priority patent/US4510276A/en
Application filed by Kollmorgen Tech Corp filed Critical Kollmorgen Tech Corp
Publication of SE8000247L publication Critical patent/SE8000247L/en
Publication of SE450804B publication Critical patent/SE450804B/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
    • H05K3/0076—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the composition of the mask
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/224—Anti-weld compositions; Braze stop-off compositions
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C09D5/008—Temporary coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0166—Polymeric layer used for special processing, e.g. resist for etching insulating material or photoresist used as a mask during plasma etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Paints Or Removers (AREA)

Abstract

A resinous protective coating useful in adhering plastics to metallic substrates. The protective coating is particularly useful as a solder mask and in the manufacture of printed circuit boards with circuit patterns having a resolution of at least 0.25 mm lines and spaces thereon. The protective coating comprises resins dissolved in solvents, wherein the coating, upon being subjected to heat, goes from a high viscosity liquid to a gel and then to a solid phase, or from a soft "gel-like" state in to a solid or from a liquid or soft "gel-like" state into a solid phase without bleeding. The protective coating is resistant to copper, nickel and gold electroplating baths, adheres to insulating substrates, adhesive coated base materials as well as metallic substrates and is capable of withstanding the thermal shock of dip soldering.
SE8000247A 1979-01-12 1980-01-11 COATING COMPOSITION FOR THE PREPARATION OF TEMPORATE AND REMOVABLE DECK MASKS FOR THE PRESENTATION OF PRINTED CIRCUITS SE450804B (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US309979A 1979-01-12 1979-01-12
US10334079A 1979-12-13 1979-12-13
US06/103,600 US4510276A (en) 1979-12-13 1979-12-14 Epoxy resin coating compositions for printed circuit boards

Publications (2)

Publication Number Publication Date
SE8000247L true SE8000247L (en) 1980-07-13
SE450804B SE450804B (en) 1987-07-27

Family

ID=27357311

Family Applications (1)

Application Number Title Priority Date Filing Date
SE8000247A SE450804B (en) 1979-01-12 1980-01-11 COATING COMPOSITION FOR THE PREPARATION OF TEMPORATE AND REMOVABLE DECK MASKS FOR THE PRESENTATION OF PRINTED CIRCUITS

Country Status (7)

Country Link
AT (1) AT383001B (en)
CA (1) CA1157181A (en)
CH (1) CH644882A5 (en)
DE (1) DE3000940C2 (en)
DK (1) DK13380A (en)
NL (1) NL187358C (en)
SE (1) SE450804B (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2500714B1 (en) * 1981-02-25 1985-08-23 Illinois Tool Works KEYBOARD WITH CAPACITIVE KEY SWITCHES
DE102010041247A1 (en) 2010-09-23 2012-03-29 Evonik Degussa Gmbh Process for the preparation of storage-stable polyurethane prepregs and molded articles made therefrom of polyurethane composition in solution
DE102011006163A1 (en) * 2011-03-25 2012-09-27 Evonik Degussa Gmbh Storage-stable polyurethane prepregs and molded articles of polyurethane composition made therefrom with liquid resin components

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1827449U (en) * 1960-09-23 1961-03-02 Bbc Brown Boveri & Cie PLUG-IN UNIT FOR ELECTRONIC ASSEMBLIES.
US3669733A (en) * 1969-12-12 1972-06-13 Rca Corp Method of making a thick-film hybrid circuit
US3847767A (en) * 1973-03-13 1974-11-12 Grace W R & Co Method of producing a screen printable photocurable solder resist
DE2535304A1 (en) * 1975-08-07 1977-02-17 Siemens Ag Solder stop paste contg. silicone resin - mixed with hardener and chalk and use in electronic switching network prodn.

Also Published As

Publication number Publication date
NL187358C (en) 1991-09-02
DE3000940A1 (en) 1980-07-24
DK13380A (en) 1980-07-13
NL187358B (en) 1991-04-02
NL8000192A (en) 1980-07-15
CH644882A5 (en) 1984-08-31
SE450804B (en) 1987-07-27
ATA13580A (en) 1986-09-15
CA1157181A (en) 1983-11-15
AT383001B (en) 1987-05-11
DE3000940C2 (en) 1984-02-02

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