SE7907594L - Sasom motstandsmaterial anvendbar metallfolie - Google Patents
Sasom motstandsmaterial anvendbar metallfolieInfo
- Publication number
- SE7907594L SE7907594L SE7907594A SE7907594A SE7907594L SE 7907594 L SE7907594 L SE 7907594L SE 7907594 A SE7907594 A SE 7907594A SE 7907594 A SE7907594 A SE 7907594A SE 7907594 L SE7907594 L SE 7907594L
- Authority
- SE
- Sweden
- Prior art keywords
- sasom
- metal foil
- resistance material
- material applicable
- applicable metal
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/562—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of iron or nickel or cobalt
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/58—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of copper
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/60—Electroplating characterised by the structure or texture of the layers
- C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/627—Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
- H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0307—Providing micro- or nanometer scale roughness on a metal surface, e.g. by plating of nodules or dendrites
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/0723—Electroplating, e.g. finish plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Laminated Bodies (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
- Non-Adjustable Resistors (AREA)
- Electroplating Methods And Accessories (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB7836698 | 1978-09-13 |
Publications (1)
Publication Number | Publication Date |
---|---|
SE7907594L true SE7907594L (sv) | 1980-03-14 |
Family
ID=10499647
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SE7907594A SE7907594L (sv) | 1978-09-13 | 1979-09-12 | Sasom motstandsmaterial anvendbar metallfolie |
Country Status (9)
Country | Link |
---|---|
JP (1) | JPS5558502A (xx) |
BE (1) | BE878782A (xx) |
DE (1) | DE2936904A1 (xx) |
FI (1) | FI792843A (xx) |
FR (1) | FR2436198A1 (xx) |
IT (1) | IT1123596B (xx) |
LU (1) | LU81680A1 (xx) |
NL (1) | NL7906808A (xx) |
SE (1) | SE7907594L (xx) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9115441B2 (en) | 2011-10-18 | 2015-08-25 | Nan Ya Plastics Corporation | Process to manufacture surface fine grain copper foil with high peeling strength and environmental protection for printed circuit boards |
EP2590487B1 (en) | 2011-11-03 | 2014-05-14 | Nan-Ya Plastics Corporation | Process to manufacture fine grain surface copper foil with high peeling strength and environmental protection for printed circuit boards |
DE102014210914A1 (de) * | 2014-06-06 | 2015-12-17 | Conti Temic Microelectronic Gmbh | Flexible Leiterplattenstruktur und die Verwendung der flexiblen Leiterplattenstruktur in einem Steuergerät für ein Kraftfahrzeug |
-
1979
- 1979-09-12 DE DE19792936904 patent/DE2936904A1/de not_active Withdrawn
- 1979-09-12 SE SE7907594A patent/SE7907594L/xx unknown
- 1979-09-12 NL NL7906808A patent/NL7906808A/nl not_active Application Discontinuation
- 1979-09-12 FR FR7922762A patent/FR2436198A1/fr not_active Withdrawn
- 1979-09-12 LU LU81680A patent/LU81680A1/fr unknown
- 1979-09-12 IT IT25660/79A patent/IT1123596B/it active
- 1979-09-13 BE BE0/197143A patent/BE878782A/xx unknown
- 1979-09-13 FI FI792843A patent/FI792843A/fi not_active Application Discontinuation
- 1979-09-13 JP JP11686079A patent/JPS5558502A/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
NL7906808A (nl) | 1980-03-17 |
FR2436198A1 (fr) | 1980-04-11 |
LU81680A1 (fr) | 1980-01-24 |
JPS5558502A (en) | 1980-05-01 |
DE2936904A1 (de) | 1980-04-03 |
FI792843A (fi) | 1980-03-14 |
IT1123596B (it) | 1986-04-30 |
BE878782A (fr) | 1979-12-31 |
IT7925660A0 (it) | 1979-09-12 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
BR7907110A (pt) | Cordonel metalico | |
SE7800157L (sv) | Metall/polymer-flerskiktsmaterial | |
BR7903986A (pt) | Material laminado | |
FI783902A (fi) | Whitlockit keramiskt material | |
SE7806505L (sv) | Forbandsmaterial | |
FI781830A (fi) | Vaermeenergi lagrande material | |
FI781270A (fi) | Transport- och distributionsanordning foer finfoerdelat material | |
FI781749A (fi) | Beklaedning av material | |
DK161279C (da) | Elektrisk modstand | |
FI782555A (fi) | Materialstaell foer lagring av laongstraeckt material | |
DK323379A (da) | Loddematerialer | |
FI794021A (fi) | Kromogent material | |
FR2344936A1 (fr) | Materiau de resistance | |
NL7807187A (nl) | Schuinmateriaalstrip. | |
GB1545783A (en) | Laminated metal material | |
GB2031869B (en) | Resistance material | |
LU78981A1 (de) | Blechgegenstand mit abgekanteten werkstoffabschnitten | |
DK157940C (da) | Pulvermetalmateriale | |
SE7703939L (sv) | Temperaturkensligt material | |
SE7910525L (sv) | Kromogent material | |
FI783442A (fi) | Stroemmatare foer smaelt material | |
AT368662B (de) | Ptc-widerstand | |
SE7907594L (sv) | Sasom motstandsmaterial anvendbar metallfolie | |
FI793449A (fi) | Fiberfoerstaerkt sammansatt material | |
DD136457A1 (de) | Schmelzklebstoff-auftragsgeraet |