SE7608894L - Bly- och kadmiumfritt mjuklod - Google Patents

Bly- och kadmiumfritt mjuklod

Info

Publication number
SE7608894L
SE7608894L SE7608894A SE7608894A SE7608894L SE 7608894 L SE7608894 L SE 7608894L SE 7608894 A SE7608894 A SE 7608894A SE 7608894 A SE7608894 A SE 7608894A SE 7608894 L SE7608894 L SE 7608894L
Authority
SE
Sweden
Prior art keywords
cadmium
lead
free soft
plot
soft plot
Prior art date
Application number
SE7608894A
Other languages
English (en)
Inventor
W Cernoch
Original Assignee
Degussa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Degussa filed Critical Degussa
Publication of SE7608894L publication Critical patent/SE7608894L/sv

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Powder Metallurgy (AREA)
SE7608894A 1975-08-09 1976-08-09 Bly- och kadmiumfritt mjuklod SE7608894L (sv)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2535616A DE2535616C2 (de) 1975-08-09 1975-08-09 Blei- und kadmiumfreies Schmierlot

Publications (1)

Publication Number Publication Date
SE7608894L true SE7608894L (sv) 1977-02-10

Family

ID=5953647

Family Applications (1)

Application Number Title Priority Date Filing Date
SE7608894A SE7608894L (sv) 1975-08-09 1976-08-09 Bly- och kadmiumfritt mjuklod

Country Status (4)

Country Link
DE (1) DE2535616C2 (sv)
FR (1) FR2320807A1 (sv)
NL (1) NL7605293A (sv)
SE (1) SE7608894L (sv)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4758407A (en) * 1987-06-29 1988-07-19 J.W. Harris Company Pb-free, tin base solder composition
US6179935B1 (en) * 1997-04-16 2001-01-30 Fuji Electric Co., Ltd. Solder alloys
IT1306731B1 (it) * 1999-10-25 2001-10-02 Paolo Agostinelli Lega metallica per collegamenti elettrici a tensione di contatto nulla
CN102922163B (zh) * 2012-11-01 2015-01-14 青岛英太克锡业科技有限公司 一种无铅铝焊锡丝及其制备方法

Also Published As

Publication number Publication date
NL7605293A (nl) 1977-02-11
DE2535616C2 (de) 1979-03-15
DE2535616B1 (de) 1976-07-22
FR2320807A1 (fr) 1977-03-11

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