SE7514390L - Halvledaraggregat - Google Patents

Halvledaraggregat

Info

Publication number
SE7514390L
SE7514390L SE7514390A SE7514390A SE7514390L SE 7514390 L SE7514390 L SE 7514390L SE 7514390 A SE7514390 A SE 7514390A SE 7514390 A SE7514390 A SE 7514390A SE 7514390 L SE7514390 L SE 7514390L
Authority
SE
Sweden
Prior art keywords
semi
leader unit
leader
unit
Prior art date
Application number
SE7514390A
Other languages
English (en)
Swedish (sv)
Inventor
P W Koenig
Original Assignee
Gen Electric
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gen Electric filed Critical Gen Electric
Publication of SE7514390L publication Critical patent/SE7514390L/xx

Links

Classifications

    • H10W72/30—
    • H10W70/02—
    • H10W70/20—
    • H10W70/69—
    • H10W72/60—
    • H10W76/136—
    • H10W76/138—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01019—Potassium [K]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01023—Vanadium [V]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01027—Cobalt [Co]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01042—Molybdenum [Mo]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1301—Thyristor
    • H01L2924/13033—TRIAC - Triode for Alternating Current - A bidirectional switching device containing two thyristor structures with common gate contact
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/30105—Capacitance
    • H10W72/07636—
SE7514390A 1974-12-23 1975-12-18 Halvledaraggregat SE7514390L (sv)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/535,670 US3995310A (en) 1974-12-23 1974-12-23 Semiconductor assembly including mounting plate with recessed periphery

Publications (1)

Publication Number Publication Date
SE7514390L true SE7514390L (sv) 1976-06-24

Family

ID=24135257

Family Applications (1)

Application Number Title Priority Date Filing Date
SE7514390A SE7514390L (sv) 1974-12-23 1975-12-18 Halvledaraggregat

Country Status (5)

Country Link
US (1) US3995310A (enExample)
JP (1) JPS5189385A (enExample)
DE (1) DE2557371A1 (enExample)
GB (1) GB1535195A (enExample)
SE (1) SE7514390L (enExample)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH630490A5 (de) 1978-06-30 1982-06-15 Bbc Brown Boveri & Cie Gehaeuse fuer ein halbleiter-hochleistungsbauelement.
DE3209174A1 (de) * 1982-03-13 1983-09-15 Brown, Boveri & Cie Ag, 6800 Mannheim Sandwich fuer druckkontaktierbare halbleiter-leistungsbauelemente und verfahren zu seiner herstellung
US4939619A (en) * 1987-01-26 1990-07-03 Northern Telecom Limited Packaged solid-state surge protector
EP0400177A1 (de) * 1989-05-31 1990-12-05 Siemens Aktiengesellschaft Verbindung eines Halbleiterbauelements mit einem Metallträger
US5166773A (en) * 1989-07-03 1992-11-24 General Electric Company Hermetic package and packaged semiconductor chip having closely spaced leads extending through the package lid
US5209390A (en) * 1989-07-03 1993-05-11 General Electric Company Hermetic package and packaged semiconductor chip having closely spaced leads extending through the package lid
JPH0671062B2 (ja) * 1989-08-30 1994-09-07 株式会社東芝 樹脂封止型半導体装置
DE10249205B3 (de) * 2002-10-22 2004-08-05 Siemens Ag Leistungsbauelementanordnung zur mechatronischen Integration von Leistungsbauelementen
DE10249206B3 (de) * 2002-10-22 2004-07-01 Siemens Ag Verfahren zum Zusammenbau eines Leistungsbauelements
DE102009032193A1 (de) * 2009-07-07 2011-01-13 Behr Gmbh & Co. Kg Verfahren zum fluiddichten Verbinden von zwei Bauelementen zur Herstellung einer fluiddichten Einheit und Kühlungseinheit zur Kühlung von Energiespeicherzellen

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3200310A (en) * 1959-09-22 1965-08-10 Carman Lab Inc Glass encapsulated semiconductor device
NL269308A (enExample) * 1960-09-16
GB1054422A (enExample) * 1963-03-16 1900-01-01
US3303432A (en) * 1966-04-18 1967-02-07 Gen Electric High power semiconductor laser devices
US3447118A (en) * 1966-08-16 1969-05-27 Westinghouse Electric Corp Stacking module for flat packaged electrical devices
GB1152809A (en) * 1968-05-07 1969-05-21 Standard Telephones Cables Ltd Electric Circuit Assembly
JPS5437474B1 (enExample) * 1968-06-10 1979-11-15
US3551758A (en) * 1969-01-08 1970-12-29 Westinghouse Electric Corp Fluid cooled heat sink assembly for pressure contacted semiconductor devices
US3831067A (en) * 1972-05-15 1974-08-20 Int Rectifier Corp Semiconductor device with pressure connection electrodes and with headers cemented to insulation ring
US3869787A (en) * 1973-01-02 1975-03-11 Honeywell Inf Systems Method for precisely aligning circuit devices coarsely positioned on a substrate
US3708720A (en) * 1973-01-02 1973-01-02 Franklin Electric Co Inc Semiconductor thermal protection

Also Published As

Publication number Publication date
DE2557371A1 (de) 1976-06-24
GB1535195A (en) 1978-12-13
US3995310A (en) 1976-11-30
JPS5189385A (enExample) 1976-08-05

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