SE7410531L - - Google Patents

Info

Publication number
SE7410531L
SE7410531L SE7410531A SE7410531A SE7410531L SE 7410531 L SE7410531 L SE 7410531L SE 7410531 A SE7410531 A SE 7410531A SE 7410531 A SE7410531 A SE 7410531A SE 7410531 L SE7410531 L SE 7410531L
Authority
SE
Sweden
Application number
SE7410531A
Other versions
SE413910B (en
Inventor
M H Pollack
Original Assignee
Nasglo International Corp Flus
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nasglo International Corp Flus filed Critical Nasglo International Corp Flus
Publication of SE7410531L publication Critical patent/SE7410531L/xx
Publication of SE413910B publication Critical patent/SE413910B/en

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/56Electroplating: Baths therefor from solutions of alloys
    • C25D3/60Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/24Reinforcing the conductive pattern
    • H05K3/244Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457Solder materials or compositions; Methods of application thereof
    • H05K3/3473Plating of solder

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
SE7410531A 1973-08-20 1974-08-19 SET AND BATH FOR ELECTROLYTIC DEPOSITION OF A ALLOY OF NICKEL AND TIN SE413910B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US38957973A 1973-08-20 1973-08-20
US48227974A 1974-06-24 1974-06-24

Publications (2)

Publication Number Publication Date
SE7410531L true SE7410531L (en) 1975-02-21
SE413910B SE413910B (en) 1980-06-30

Family

ID=27012758

Family Applications (2)

Application Number Title Priority Date Filing Date
SE7410531A SE413910B (en) 1973-08-20 1974-08-19 SET AND BATH FOR ELECTROLYTIC DEPOSITION OF A ALLOY OF NICKEL AND TIN
SE7804535A SE7804535L (en) 1973-08-20 1978-04-20 TENN-NICKEL ALLOY

Family Applications After (1)

Application Number Title Priority Date Filing Date
SE7804535A SE7804535L (en) 1973-08-20 1978-04-20 TENN-NICKEL ALLOY

Country Status (10)

Country Link
JP (1) JPS5072838A (en)
CA (1) CA1045577A (en)
CH (1) CH592167A5 (en)
DE (1) DE2439656C2 (en)
FR (1) FR2241632B1 (en)
GB (1) GB1484575A (en)
IL (1) IL45382A (en)
IT (1) IT1057888B (en)
NL (1) NL7411119A (en)
SE (2) SE413910B (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL189310C (en) * 1984-05-18 1993-03-01 Toyo Kohan Co Ltd COATED STEEL SHEET WITH IMPROVED WELDABILITY AND METHOD FOR MANUFACTURING.
EP2233611A1 (en) * 2009-03-24 2010-09-29 MTV Metallveredlung GmbH & Co. KG Layer system with improved corrosion resistance
EP3235588B1 (en) * 2014-12-15 2019-11-06 Senju Metal Industry Co., Ltd Solder alloy for plating and electronic component

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2141940C2 (en) * 1971-08-21 1977-02-10 Bergische Metallwarenfabrik Dillenberg & Co Kg, 5601 Gruiten GALVANIC BATH FOR DEPOSITING TIN / NICKEL, TIN / COBALT OR TIN / NICKEL / COBALT COATINGS AND THE RELATED GALVANIZING PROCESS

Also Published As

Publication number Publication date
JPS5072838A (en) 1975-06-16
CH592167A5 (en) 1977-10-14
IL45382A0 (en) 1974-11-29
IT1057888B (en) 1982-03-30
IL45382A (en) 1976-09-30
CA1045577A (en) 1979-01-02
GB1484575A (en) 1977-09-01
SE7804535L (en) 1978-04-20
DE2439656A1 (en) 1975-03-06
NL7411119A (en) 1975-02-24
SE413910B (en) 1980-06-30
FR2241632A1 (en) 1975-03-21
FR2241632B1 (en) 1979-08-03
DE2439656C2 (en) 1983-06-16

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