CH592167A5 - - Google Patents

Info

Publication number
CH592167A5
CH592167A5 CH1117374A CH1117374A CH592167A5 CH 592167 A5 CH592167 A5 CH 592167A5 CH 1117374 A CH1117374 A CH 1117374A CH 1117374 A CH1117374 A CH 1117374A CH 592167 A5 CH592167 A5 CH 592167A5
Authority
CH
Switzerland
Application number
CH1117374A
Original Assignee
Nasglo Int Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nasglo Int Corp filed Critical Nasglo Int Corp
Publication of CH592167A5 publication Critical patent/CH592167A5/xx

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/60—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3473—Plating of solder

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
CH1117374A 1973-08-20 1974-08-15 CH592167A5 (xx)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US38957973A 1973-08-20 1973-08-20
US48227974A 1974-06-24 1974-06-24

Publications (1)

Publication Number Publication Date
CH592167A5 true CH592167A5 (xx) 1977-10-14

Family

ID=27012758

Family Applications (1)

Application Number Title Priority Date Filing Date
CH1117374A CH592167A5 (xx) 1973-08-20 1974-08-15

Country Status (10)

Country Link
JP (1) JPS5072838A (xx)
CA (1) CA1045577A (xx)
CH (1) CH592167A5 (xx)
DE (1) DE2439656C2 (xx)
FR (1) FR2241632B1 (xx)
GB (1) GB1484575A (xx)
IL (1) IL45382A (xx)
IT (1) IT1057888B (xx)
NL (1) NL7411119A (xx)
SE (2) SE413910B (xx)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL189310C (nl) * 1984-05-18 1993-03-01 Toyo Kohan Co Ltd Beklede stalen plaat met verbeterde lasbaarheid en werkwijze voor de vervaardiging.
EP2233611A1 (de) * 2009-03-24 2010-09-29 MTV Metallveredlung GmbH & Co. KG Schichtsystem mti verbesserter Korrosionsbeständigkeit
EP3235588B1 (en) * 2014-12-15 2019-11-06 Senju Metal Industry Co., Ltd Solder alloy for plating and electronic component

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2141940C2 (de) * 1971-08-21 1977-02-10 Bergische Metallwarenfabrik Dillenberg & Co Kg, 5601 Gruiten Galvanisches bad zum abscheiden von zinn/nickel-, zinn/kobalt- oder zinn/nickel/kobalt-schichten und zugehoeriges galvanisierverfahren

Also Published As

Publication number Publication date
JPS5072838A (xx) 1975-06-16
IL45382A0 (en) 1974-11-29
IT1057888B (it) 1982-03-30
IL45382A (en) 1976-09-30
CA1045577A (en) 1979-01-02
GB1484575A (en) 1977-09-01
SE7804535L (sv) 1978-04-20
DE2439656A1 (de) 1975-03-06
NL7411119A (nl) 1975-02-24
SE7410531L (xx) 1975-02-21
SE413910B (sv) 1980-06-30
FR2241632A1 (xx) 1975-03-21
FR2241632B1 (xx) 1979-08-03
DE2439656C2 (de) 1983-06-16

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Legal Events

Date Code Title Description
PL Patent ceased