SE515180C2 - Device for electromagnetic compatibility (EMC) protection of hybrid components - Google Patents

Device for electromagnetic compatibility (EMC) protection of hybrid components

Info

Publication number
SE515180C2
SE515180C2 SE9304148A SE9304148A SE515180C2 SE 515180 C2 SE515180 C2 SE 515180C2 SE 9304148 A SE9304148 A SE 9304148A SE 9304148 A SE9304148 A SE 9304148A SE 515180 C2 SE515180 C2 SE 515180C2
Authority
SE
Sweden
Prior art keywords
connection
hybrid
metallic
hybrid component
pressure plane
Prior art date
Application number
SE9304148A
Other languages
Swedish (sv)
Other versions
SE9304148L (en
SE9304148D0 (en
Inventor
Andreas Thomae
Original Assignee
Bosch Gmbh Robert
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bosch Gmbh Robert filed Critical Bosch Gmbh Robert
Publication of SE9304148D0 publication Critical patent/SE9304148D0/en
Publication of SE9304148L publication Critical patent/SE9304148L/en
Publication of SE515180C2 publication Critical patent/SE515180C2/en

Links

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B15/00—Suppression or limitation of noise or interference
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/642—Capacitive arrangements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
    • H05K1/0231—Capacitors or dielectric substances
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0183—Dielectric layers
    • H05K2201/0187—Dielectric layers with regions of different dielectrics in the same layer, e.g. in a printed capacitor for locally changing the dielectric properties
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/0707—Shielding
    • H05K2201/0715—Shielding provided by an outer layer of PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Computer Hardware Design (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Signal Processing (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Road Signs Or Road Markings (AREA)
  • Chemically Coating (AREA)
  • Paints Or Removers (AREA)
  • Details Of Connecting Devices For Male And Female Coupling (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)

Abstract

The ceramic carrier (10) has a chip capacitor (14) mounted on it with one terminal linked to a signal line (16) which forms the connection from a plug to the hybrid component. The other terminal is connected to a metallic coating (18) on the upper surface of the carrier, linked to a counterpart (22) on its underside (20) by a plated through hole (24). The entire structure is bonded (26) adhesively to a housing (28). A multilayer structure may be developed with a layer of glass in which the via hole is filled with conductive paste. ADVANTAGE - High frequency coupling to circuit is achieved without metallic housing.

Description

515 180 2 kopplas med en liten jordanslutning på lockets översida till en liten spänningsforsörjning. I lockets inre är anordnat ett jordplan med stor yta, vilket är förbundet med jordanslutningen genom genomkopplingar, och ett spänningsförsörjningsplan, vilket är förbundet med spänningsförsörjningsanslutningen genom genomkopplingar. På grund av jordanslutningens mycket ringa yta på kondensatorytan, är dock jordanslutningens kapacitiva inkoppling till kondensatorytan mycket dålig och ineffektiv. Ett effektivt avstörningsskydd kan på detta sätt inte uppnås. 515 180 2 is connected with a small earth connection on the top of the cover to a small power supply. Arranged in the interior of the cover is a ground plane with a large surface, which is connected to the earth connection through bushings, and a voltage supply plane, which is connected to the voltage supply connection through bushings. However, due to the very small area of the earth connection on the capacitor surface, the capacitive connection of the earth connection to the capacitor surface is very poor and inefficient. Effective interference protection can not be achieved in this way.

Till grund för uppfinningen ligger uppgiften att åstadkomma en anordning för EMK- skydd av det inledningsvis nämnda slaget, som för kopplingen leder till högfrekvent inkoppling av kopplingen utan metallhus.The object of the invention is to provide a device for ECHR protection of the type mentioned in the introduction, which for the coupling leads to a high-frequency connection of the coupling without a metal housing.

Enligt uppfinningen löses uppgiften genom de kärmetecknande särdragen i det självständiga patentkravet l och i det självständiga patentkravet 2.According to the invention, the object is solved by the core features of the independent claim 1 and of the independent claim 2.

Det har visat sig att skyddet mot den direkta instrålningen och de genom kabelstammen tillförda störningarna kan åstadkommas genom chipkondensatorfilter, vilka befmner sig på keramikbäiplattan och vars lågohmiga och låginduktiva jordförbindelse är utförd medelst ett med en metallisk elektriskt ledande pasta utfört fyllnadstryck i urtag i isolerglasskiktet mellan tryckplanen eller genom keramikgenomkoppling till ett metalliskt tryckplan med stor yta, som befinner sig på hybridkomponenten vid flerskiktsteknik respektive på hybridbaksidan.It has been found that the protection against the direct radiation and the disturbances supplied by the cable trunk can be provided by chip capacitor terlter, which are located on the ceramic base plate and whose low-ohmic and low-inductive ground connection is made by means of an insulating glass. or by ceramic connection to a metallic pressure plane with a large surface, which is located on the hybrid component in multilayer technology and on the hybrid backing, respectively.

Som ytterligare EMK-skyddsvariant kan det metalliska tryckplanet kopplas med kondensatorjorden. Därvid är kopplingen i flerskiktsteknik, på hybridkomponentsidan, mycket effektivare genom de stora kopplingskondensatorvärdena som kan realiseras, eftersom ett tunt isolerglasskikt vid en acceptabel permeabilitet är förhanden. 515 180 3 En ytterligare fördelaktig utformning framgår av de i de osjälvständiga kraven anförda särdragen.As an additional EMK protection variant, the metallic pressure plane can be connected to the capacitor earth. In this case, the coupling in multilayer technology, on the hybrid component side, is much more efficient due to the large coupling capacitor values that can be realized, since a thin insulating glass layer at an acceptable permeability is present. 515 180 3 A further advantageous design is apparent from the features set forth in the dependent claims.

Uppfnningen skall nedan förklaras närmare iutföringsexempel med hjälp av de tillhörande ritningama.The invention will be explained in more detail below with exemplary embodiments with the aid of the accompanying drawings.

Därvid visas i: Fig 1 ett snitt av den uppfinningsenliga anordningen vid ett exempel med en enskiktshybridkomponent, och fig 2 ett exempel av en flerskiktshybridkomponent.In this case: Fig. 1 shows a section of the inventive device in an example with a single-layer hybrid component, and fi g 2 shows an example of a multilayer hybrid component.

Fig 1 visar en av en keramikbärplatta bestående hybridkomponent 10, på vars övre sida en chipkondensator 14 är anordnad.Fig. 1 shows a hybrid component 10 consisting of a ceramic support plate, on the upper side of which a chip capacitor 14 is arranged.

Chipkondensatom 14 är med sin första anslutning förbunden med en signalledning 16, som utgör förbindelsen från stickkontakten till hybridkomponenten 10.The chip capacitor 14 is connected with its first connection to a signal line 16, which forms the connection from the socket to the hybrid component 10.

Hybridkomponenten 10 har vid sin övre sida 12 ett metalliskt tryckplan 18 och vid sin undre sida 20 ett tryckplan 22 med stor yta. Tryckplanen 18 och 22 är via en genomkoppling 24 elektriskt ledande förbundna med varandra.The hybrid component 10 has at its upper side 12 a metallic pressure plane 18 and at its lower side 20 a pressure plane 22 with a large surface. The pressure planes 18 and 22 are electrically conductively connected to each other via a coupling 24.

Chipkondensatom 14 är med sin andra anslutning ansluten till tryckplanet 18. Hela hybridkomponenten 10 är via ett limskikt 26 fast vid en husdel 28.The chip capacitor 14 is connected to the pressure plane 18 with its second connection. The entire hybrid component 10 is attached to a housing part 28 via an adhesive layer 26.

Fig 2 visar en, av en keramikbärplatta bestående hybridkomponent 32, på vars övre sida en chipkondensator 30 är anordnad.Fig. 2 shows a hybrid component 32 consisting of a ceramic support plate, on the upper side of which a chip capacitor 30 is arranged.

Chjpkondensatom 30 är med sin första anslutning förbunden till en signalledning 31, som framställer förbindelsen till en kopplingspunkt som skall skyddas EMK- 515 180 4 mässigt. Hybridkomponenten 32 har på sin övre sida två metalliska tryckplan 33 och 34, som är anordnade isolerat från varandra genom ett glasplan 35. Tryckplanen 33 och 34 är elektriskt ledande förbundna med varandra medelst ett med en metalliskt ledande pasta utfört isolerglasurtagsfyllnadstryck 36. Chípkondensatorn 30 är med sin andra anslutning ansluten till tryckplanet 33. Hela hybridkomponenten 32 är via ett lirnskikt 37 fast vid en husdel 38.The chip capacitor 30 is connected with its first connection to a signal line 31, which produces the connection to a connection point which is to be EMF-protected. The hybrid component 32 has on its upper side two metallic pressure planes 33 and 34, which are arranged insulated from each other by a glass plane 35. The pressure planes 33 and 34 are electrically conductively connected to each other by means of an insulating glass recess filling pressure 36 made with a metallic conductive paste. its second connection is connected to the pressure plane 33. The entire hybrid component 32 is fixed to a housing part 38 via a wire layer 37.

De metalliska tryckplanen i båda exemplen realiserar därvid icke endast en referenspotential för filterkondensatorema, utan också en avskärmning av hela kopplingen liksom en reducering av den karaktäristiska impedansen hos kopplingsledningama och därigenom en förhöjning av EMK-störtröskeln. Värdena hos chipkondensatorerna är användningsspecifika.The metallic pressure planes in both examples thereby realize not only a reference potential for the alternating capacitors, but also a shielding of the entire coupling as well as a reduction of the characteristic impedance of the coupling lines and thereby an increase of the EMF noise threshold. The values of the chip capacitors are usage specific.

En galvanisk förbindning av de metalliska tryckplanen till huset erfordras icke längre. Huset måste därmed icke vara metalliskt.A galvanic connection of the metallic pressure planes to the housing is no longer required. The housing does not have to be metallic.

Claims (4)

515 180 5 Patentkrav515 180 5 Patent claims 1. Anordning för elektromagnetiskt kompatibilitets (EMK)-skydd av hybridkomponenter med en på hybridkomponenten anordnad chipkondensator, vars första anslutning är förbunden med kopplingens ingångsanslutning och vars andra anslutning ligger på jord, kännetecknad av att jordanslutrlingen sker lågohrnigt och lågínduktivt och jorden bildas genom ett metalliskt tryckplan (18) på hybridkomponentens (10) översida (12) och ett metalliskt tryckplan (22) med stor yta på hybridkomponentens (10) undersida (20), vilka är förbundna genom en genomkoppling (24), så att det metalliska tryckplanet (20; 34) inkopplas kapacitivt till kondensatorjorden (18).Device for electromagnetic compatibility (EMF) protection of hybrid components with a chip capacitor arranged on the hybrid component, the first connection of which is connected to the input terminal of the coupling and the second connection of which is grounded, characterized in that the ground connection is low-inductive and low-inductive metal pressure plane (18) on the upper side (12) of the hybrid component (10) and a large surface metallic pressure plane (22) on the lower side (20) of the hybrid component (10), which are connected by a coupling (24), so that the metallic pressure plane (20) ; 34) is capacitively connected to the capacitor earth (18). 2. Anordning för elektromagnetiskt kompatibilitets (EMK)-skydd av hybridkomponenter med en på hybridkomponenten anordnad chipkondensator, vars första anslutning är förbunden med kopplingens ingångsanslutning och vars andra anslutning ligger på jord, kännetecknad av att jordanslutningen sker lågohrnigt och låginduktivt och jorden bildas genom ett metalliskt tryckplan (33, 34) i flera skikt med ett övre tryckplan (33) och ett undre tryckplan (34) med stor yta, vilka vid flerskiktshybridkomponenter (32) är anordnade isolerade från varandra och är förbundna medelst ett med en metallisk, elektriskt ledande pasta utfört isolerglasurtagsfylhradstryek (3 6), så att det undre metalliska tryckplanet (34) inkopplas kapacitivt till kondensatorjorden (18).Device for electromagnetic compatibility (EMF) protection of hybrid components with a chip capacitor arranged on the hybrid component, the first connection of which is connected to the input terminal of the coupling and the second connection of which is grounded, characterized in that the ground connection is low and low inductive and the earth is formed by a metal pressure planes (33, 34) in your layers with an upper pressure plane (33) and a lower pressure plane (34) with a large surface, which at multilayer hybrid components (32) are arranged insulated from each other and are connected by means of a metallic, electrically conductive paste made insulating glass recess filling row iron (36), so that the lower metallic pressure plane (34) is capacitively connected to the capacitor earth (18). 3. Anordning enligt krav 2, kännetecknad av att jorden bildas medelst de, mellan hybridskikten anordnade, metalliska tryckplanen med stor yta.Device according to Claim 2, characterized in that the soil is formed by means of the large-area metallic pressure planes arranged between the hybrid layers. 4. Anordning enligt krav 1, kännetecknad av att den kapacitiva inkopplingen sker vid hybridkomponentens ( 10; 32) komponentsida.Device according to Claim 1, characterized in that the capacitive connection takes place at the component side of the hybrid component (10; 32).
SE9304148A 1992-12-14 1993-12-14 Device for electromagnetic compatibility (EMC) protection of hybrid components SE515180C2 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE4242097A DE4242097C2 (en) 1992-12-14 1992-12-14 Arrangement for the electromagnetic compatibility (EMC) protection of hybrid components

Publications (3)

Publication Number Publication Date
SE9304148D0 SE9304148D0 (en) 1993-12-14
SE9304148L SE9304148L (en) 1994-06-15
SE515180C2 true SE515180C2 (en) 2001-06-25

Family

ID=6475201

Family Applications (1)

Application Number Title Priority Date Filing Date
SE9304148A SE515180C2 (en) 1992-12-14 1993-12-14 Device for electromagnetic compatibility (EMC) protection of hybrid components

Country Status (3)

Country Link
DE (1) DE4242097C2 (en)
IT (1) IT1265377B1 (en)
SE (1) SE515180C2 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0835041A1 (en) * 1996-10-02 1998-04-08 Siemens Audiologische Technik GmbH Electric hearing aid with protection device against electromagnetic radiation
DE19728692C2 (en) 1997-07-04 2002-04-11 Infineon Technologies Ag IC component with passive components
DE10003112C1 (en) * 2000-01-13 2001-07-26 Infineon Technologies Ag Chip with all-round protection of sensitive circuit parts against access by unauthorized persons by means of shielding arrangements (shields) using an auxiliary chip
FR2835389B1 (en) * 2002-01-30 2005-10-21 DEVICE COMPRISING AN ISOLATED METAL SUPPORT AND AN ELECTRICAL CIRCUIT

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5043533A (en) * 1989-05-08 1991-08-27 Honeywell Inc. Chip package capacitor cover

Also Published As

Publication number Publication date
IT1265377B1 (en) 1996-11-22
SE9304148L (en) 1994-06-15
DE4242097A1 (en) 1994-06-16
SE9304148D0 (en) 1993-12-14
ITMI932562A0 (en) 1993-12-03
DE4242097C2 (en) 2001-03-01
ITMI932562A1 (en) 1995-06-03

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