SE514192C2 - Structure of high frequency oscillator allowing direct testing of oscillator units on main circuit board - Google Patents

Abstract

Several oscillator units are on a main circuit board, each having its own test seating for individual testing of the units. The positive voltage and earthing circuit patterns (VCC,GND) and signal regulating circuit patterns (VT) of each single oscillator unit is electrically connected with all oscillator units. With through holes (139) located on main board at location where inner surfaces of each through hole is coated with conductive material. Each oscillator is fed power from the main circuit board. The main circuit board (10) has an insulation layer with a copper sheet layer (11,12) on the upper side or under side. A second insulating layer (15) of the same thickness as the first layer and a copper sheet layer (13) are laid on each other and attached to the circuit board. Providing a main circuit board with three copper sheet layers. The upper copper sheet layer (13) is used to form several component circuit patterns for the oscillator units. The middle copper sheet layer 11 is used to form several current and earthing circuit patterns, and signal circuit pattern, the lower copper sheet layer (12) is used to provide a common earthing circuit pattern for the oscillator units. After the electronic components are soldered to the main circuit board, the main circuit board is etched to define the area of each oscillator unit. The etching knife used has a V-shaped blade and is used so that the middle copper sheet layer is not cut. It provides a number of V shaped etches ridges (14) on the upper surfaces of the main circuit boar. Only the upper and lower copper sheet layers are cut, so each single oscillator unit is insulated from the others and is separated from the main circuit board

Description

20 25 30 35 f. _. , «<3 * g,. The etched grooves 14 are marked in both surfaces of the main circuit board so that two adjacent ones are formed. oscillator units 61 are loosely connected to each other. Afterwards, the main circuit board can be easily broken off along the etched grooves 14 to provide a plurality of oscillator units for testing.

The testing of the oscillator units 55,61 arranged on a small part of the circuit board and removed from the main circuit board 50,60, as described above, is complicated, since all the oscillator units 51.61 must be tested one by one, and each test is difficult to perform . Each oscillator unit 55,61 must be tested in a test bench 70 specifically configured to hold an oscillator unit 90, as shown in FIG. 6. The test bench 70 has a position recess 71 defined therein to hold the oscillator unit 90 to be tested. Each side of the test bench 70 defines a passage socket 72 in connection with the position socket 71 for positioning cables and a signal connection 74. In addition, a thin circuit board 80 having a shape adapted to the position socket 71 and the passage sockets 72 must be arranged to be inserted into the test bench. 70. The thin circuit board 80 has several copper foil contacts 82 and a copper foil ground 81 formed on the surface. The external connection of each copper foil 81,82 is used for electrical contact with power lines, signal cables or signal connections 74. The internal connection of each copper foil 81,82 is used for electrical contact with the oscillator unit 90 during test, whereby the oscillator unit 90 is supplied with power and transmission signals to provide output signals from the signal terminal 74 to perform the tests. In addition, when a test is to be performed, a rubber block 73 must be inserted into the position groove 71 after the oscillator unit 90 is placed therein, thereby forcing the oscillator unit to maintain safe contact with the thinner circuit board 80 to ensure efficient electrical contact. Accordingly, it is obvious that the test is cumbersome, since a dedicated 10 15 20 25 30 35 _ r (y (. .F - \ f, L '_- L: \ <. -, ii _. If' ' ~ * “,.., <1 1 ff _. (._,.« _ (_ .. x <f,. K, u, .- -, _ \ f 4 IQ _ 4 i '* h. H «. <Crf (,. Test bench must be made and each oscillator unit 90 to be tested must be positioned in and removed from the test bench 70 manually. Therefore, there is a need to provide a new and improved oscillator design to eliminate the inconvenience and complexity of testing.

INVENTION The object of the present invention is to provide a modular high frequency oscillator design which uses a main circuit board to create multiple oscillator units.

All oscillator units are tested directly on the main circuit board, eliminating the use of a dedicated test bench to test the oscillator units one by one.

To achieve the object, the main circuit board of the modular high frequency oscillator structure comprises an upper copper foil layer, an intermediate copper foil layer separated from the upper copper foil layer by a first insulating layer and a lower copper foil layer separated from the intermediate copper foil layer by a second insulating layer. The upper copper foil layer has a plurality of component circuit patterns and a plurality of positive voltage, ground and signal control circuit patterns. Each component circuit pattern provides circuit connections for an oscillator unit. The plurality of positive voltage and ground circuit patterns are provided to supply external power to each oscillator unit. The amount of signal control circuit pattern is provided to supply control signals to each oscillator unit. The intermediate copper foil layer has a plurality of power transmission and ground wire circuit patterns for electrically connecting the plurality of positive voltage and ground circuit patterns to the plurality of oscillator units. The lower copper foil layer has a large common ground circuit pattern electrically connected to the amount of ground circuit pattern of the upper copper foil layer and the amount of ground line circuit patterns of the intermediate copper foil layer. The main circuit board is etched such that the upper and 20 <(L .i -_ ^,. M. I _ f;. __. .¿ ïçu _. .F._ ¿. (In, ¿. (<P,, (. \ “F KW i” <. the lower copper foil layer is cut through and the intermediate copper foil layer remains uncut, each oscillator being insulated and can be tested directly on the main circuit board.

Other objects, advantages and novel features of the invention will become apparent from the following detailed description when taken in conjunction with the accompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS FIGS. 1A-1C schematically illustrate the process of creating a main circuit board with three copper foil layers of the high frequency oscillator assembly in accordance with the present invention; Fig. 2A is the plan view of the upper copper foil layer of the main circuit board; Fig. 2B is the plan view of the intermediate copper foil layer of the main circuit board; Fig. 2C is the plan view of the lower copper foil layer of the main circuit board; Fig. 3 schematically illustrates the upper copper foil layer overlying the intermediate copper foil layer; Fig. 4 is a plan view of a first conventional main circuit board for creating a plurality of oscillator units; Fig. 5A is a plan view of a second conventional main circuit board for creating a plurality of oscillator units; Fig. SB is a cross-sectional view of the second conventional main circuit board for creating a plurality of oscillator units; Fig. 6 is an exploded view of a conventional test bench for testing an oscillator unit.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT The modular high frequency oscillator assembly in accordance with the present invention provides a main circuit board for creating multiple oscillator units. 10 15 20 25 30 35 _ u <_ _ \\ _. 1., i I «f i K, _ I. 1 \ - i <1, 4_,, - _ _: (Q. f: cr r _ .l. .Wc _ K _ '.LJ h' (f, ._ 1 fl '"5 The process of creating the main circuit board is displayed in FIG. 1. As illustrated in FIG. 1A, a circuit board 10 is provided with a first insulating layer having an upper surface and a lower surface, respectively, with a copper foil layer 11,12 created thereon. that of the first insulating layer, and a copper foil layer 13 are sequentially stacked and attached to the circuit board 10. Accordingly, a main circuit board with three copper foil layers 11,12,13 is obtained as shown in Fig. 1B. The upper copper foil layer 13 is mainly used to create multiple component circuit patterns corresponding to the oscillator units.

The intermediate copper foil layer 11 is used to create multiple power and ground line circuit patterns and signal transmission circuit patterns corresponding to the oscillator units. The lower copper foil layer 12 is used to create a common ground circuit pattern for the oscillator units. An etching process is then performed on the main circuit board after electronic components have been soldered to the main circuit board, thereby delimiting the surface of each oscillator unit, the etching knife used being provided with a V-shaped knife wall and controlled in a suitable manner so that intermediate copper foil the layer 11 is not cut through. As shown in FIG. 1C, a plurality of V-shaped etched grooves 14 are marked in the surface of the main circuit board by the etching process, and only the upper and lower copper foil layers 13, 12 are cut through. As a result, each oscillator unit is isolated from each other and can be easily separated from the main circuit board afterwards by breaking the main circuit board along the plurality of grooves 14.

The most important feature is that the positive voltage and ground circuit patterns (VCC, GND) and the signal control circuit pattern (VT) of each oscillator unit are electrically connected to all oscillator units. To accomplish this, there are a plurality of through-holes 139 made in predetermined positions of the main circuit board, the inner surface of each through-hole 139 being coated by means of 514 192: f;: c, material. Since the plurality of through heels 139 are formed by the three copper foil layers 13.1, 12, the three copper foil layers 13.1, 12 are electrically connected. In addition, since the intermediate copper foil layer is not cut through, power and control signals can be applied to each oscillator unit on the main circuit board. Accordingly, all oscillator units on the main circuit board are supplied with power and power by supplying power and supplying control signals to the main circuit board. Therefore, each oscillator unit can be tested directly on the main circuit board, thereby increasing the test performance by eliminating the need for the dedicated test bench 70 and the steps of positioning each oscillator unit into and removing from the test bench 70.

The circuit patterns created on the three copper foil layers 11, 13, 13 of the main circuit board are designed with respect to each other. FIGS. 2A, 2B and 2C show the circuit patterns of the three copper foil layers. Referring to FIG. 2A for the circuit pattern of the upper copper foil layer 13 (component circuit pattern), the plurality of intersecting vertical and horizontal etched grooves 14 are made to define a plurality of substantially square areas, each having a complex component circuit pattern for to provide electrical connections between different electronic components of an oscillator unit. An oscillator unit is placed in each square area. The second area of the main circuit board is used for manufacturing and testing purposes. There, ground, positive voltage and signal control circuit patterns 131, 133, 132 are shown and also denoted by GND, VCC and VT, respectively, for connection to ground, positive voltage and signal control connections during a test. Via these terminals, external power and control signals can be supplied to each oscillator unit (in this preferred embodiment, only the oscillator units arranged in a vertical line are shown as connected). Therefore, only one power source is required to supply all the oscillator units. A plurality of strip-shaped signal jump circuit patterns 134,135 are further shown in FIG. 2A for signal jumps, which will be described in detail later.

Fig. 2B shows the circuit pattern of the intermediate copper foil layer 11 (power circuit pattern), which provides a plurality of ground, signal and power transmission circuit patterns 111,112,113 for connecting the ground circuit pattern 131 designated GND), nad VT) and the positive voltage circuit pattern of the another oscillator unit. Referring to FIG. 2C, the lower copper foil layer 12 also forms a large (also signal control circuit pattern 132) (also shown in FIG. 2A) of each oscillator unit common ground pattern 121. FIG. 3 is created by overlapping FIG. 2A and FIG. 2B, the phantom lines represent the circuit patterns of the intermediate copper foil layer 11. It will be seen that the ground circuit pattern 131 of the upper copper foil layer 13, the ground conduction circuit pattern 111 of the intermediate copper foil layer 11 and the common ground pattern of the lower copper foil layer 12 are electrically connected.

The positive voltage circuit pattern 133 (also referred to as VCC) of the upper copper foil layer is connected to the oscillator unit and the strip-shaped jump circuit pattern 135 below via the power transmission circuit pattern 113 of the intermediate copper foil layer 11, whereby the positive voltage (also) denoted by other . (also denoted VT) of the upper copper foil layer 13 is extensively connected to the circuit pattern 133, in addition, the control signal circuit pattern 132 of the oscillator units is connected via the signal transmission circuit patterns 112 of the intermediate copper foil layer 11 and the strip-shaped signal bounce pattern upper layer 134 of the upper copper foil pattern.

When the upper and lower copper foil layers 13,12 are cut through to define the amount of intersecting vertical and horizontal etched grooves 14 in the main circuit board, the ground, positive voltage and signal control circuit pattern 131,132,133 of the upper copper foil layer 19 8 remains. connected to the respective oscillator units via the intermediate copper foil layer 11, whereby the operation of the oscillator units is enabled. By connecting conductive leads to the positive voltage, signal rules ~ and ground circuit patterns 133, 322, 131 (also designated VCC, VT, GND), shown in the upper part of FIG. 3, to supply suitable power and suitable signals, each oscillator unit can be tested directly on the main circuit board. Although the present invention has been explained in relation to its preferred embodiment, it is to be understood that several other possible modifications and variations may be made without departing from the spirit of the invention in accordance with the appended claims.

Claims (7)

N U 20 25 30 35 - ~ 1- ~ -. 1 «4. (f 1.. .I.. .I <<L.., I....«. R Jr. ... .. - <. .F. <R. L. ... f Å. _. Å »- ~«. lf <4- f, «<<n |. - 9 PATENT REQUIREMENTS A modular high frequency oscillator design having a main circuit board for creating a plurality of oscillator units, the main circuit board comprising: an upper copper foil layer having a plurality of component circuit patterns and a plurality of positive voltage, ground and signal control circuit patterns, each component circuit providing a circuit tower unit, the plurality of positive voltage and ground circuit patterns being arranged to supply external power to each oscillator unit, the plurality of signal control circuit patterns being arranged to supply control signals to each oscillator unit; an intermediate copper foil layer having a plurality of power transmission and ground wire circuit patterns for electrically connecting the plurality of positive voltage and ground circuit patterns to the plurality of oscillator units; a first insulating layer disposed between the upper and intermediate copper foil layers; a lower copper foil layer having a large common ground circuit pattern electrically connected to the amount of ground circuit pattern of the upper copper foil layer and the amount of ground conduction circuit pattern of the intermediate copper foil layer; and a second insulating layer disposed between the intermediate and lower copper foil layers, the main circuit board being etched in such a manner that the upper and lower copper foil layers are cut through to insulate each oscillator unit and said intermediate copper foil layer is not cut through, whereby each oscillator can be cut. tested directly on the main circuit board. The modular high frequency oscillator structure of claim 1, wherein the first insulating layer has a thickness equal to that of the second insulating layer. W Ü 20 25 15,14 192 10 ff .H The modular high frequency oscillator structure according to claim 1, wherein the upper, intermediate and lower copper foil layers are arranged at equal distances from each other. The modular high frequency oscillator assembly of claim 1, wherein the main circuit board is etched with an etching knife having a V-shaped knife wall. The modular high frequency oscillator assembly of claim 1, wherein the intermediate copper foil layer further has a plurality of signal transmission circuit patterns for electrically connecting the plurality of signal control circuit patterns to the plurality of oscillator units. The modular high frequency oscillator assembly of claim 5, wherein the upper copper foil layer further has a plurality of signal jump circuit patterns for electrically connecting the plurality of power transmission and signal transmission circuit patterns. The modular high frequency oscillator assembly of claim 1, wherein the main circuit board has a plurality of through heels made therein, each having an inner surface covered with conductive material, whereby the upper, intermediate and lower copper foil layers are electrically connected.