SE466778B - ASSEMBLY PROFILE WITH LEADER - Google Patents

Description

466 778 2 terminal types are described in, for example, the parallel Swedish patent application No. 9002763-2 with the title: "Process adaptation system". Many benefits can be gained from the simple connection and distribution terminals and associated system circuit boards in the prior art are replaced by the corresponding ones terminals including electronic devices integrated with each other and there these terminals with built-in electronics are given the opportunity to communicate for example with each other or directly with a computer through conductors on the profile. Among other things, the need for cross-connections can be eliminated. Likewise given ability to outsource process monitoring devices in process computer systems a smaller cabinet comprising said new electronically equipped terminals closer to the body or bodies in a process monitored, of which only one bus or optical fiber mediates contact with a process computer remotely.

It is known to connect electronic devices such as adapters. units for serial and / or parallel buses. These are then not placed in or on a standard mounting profile.

There are also electronic devices on the market located on the said units, in which said units communicate with external equipment via special cabling. This prevents, among other things, free mixing of these electronic devices with standard terminal blocks. In another variant of such electronic devices intended to be attached to mounting profiles are connected these devices point by point, that is, any bus structure for communication is not applied.

DESCRIPTION OF THE INVENTION To distribute voltages to terminals and / or enable communication between different terminals on a mounting profile or for direct communication with external electronics units, electrically conductive paths are arranged on the the ring profile. The conductive paths consist of electrically conductive barrels strings or raised ridges of electrically conductive material applied to the mounting profile with insulating material between the conductive paths and the mounting profile. One or more leading paths may occur parallel to each other.

The conductive tracks are placed on the profile flanges on their upper or underside, either on one of these or on both flanges. Alternatively conductive paths are arranged on the bottom of the profile, ie on the surface that is limited of the profile fl ans. Of course, it is possible to provide both fl care and the bottom of the profile with conductive paths.

Terminals of different types are placed and snapped onto the profile. These terminals are equipped with contact pins with a location under the terminal for determined contact with a certain leading path on the corresponding profile the position of the contact pins on the terminal block. The contact pins connect directly to or via a connector one of the leading paths and provides a good electrical connection between leading paths on the profile and contact pins with a corresponding location on the terminal. 41 466 778 DESCRIPTION OF FIGURES ING Figure 1 and figure 2 show 2 examples of different types of mounting profiles with flanges, where the profiles are provided with electrically conductive tracks on insulating foil or other insulating layer.

EMBODIMENTS Mounting profiles 1, 2 of standard type, for example according to DIN standard, proposed of type EN 50022, EN 50035 or other type, provided with electricity conductive paths 3 on the surface or surfaces of the profile. The leading paths 3 consist of electrically conductive strings, ridges or ridges, for example thin copper foil, in one or more strands, applied to an insulating layer 4, 5 i in the form of, for example, a thin sheet or foil. The insulating layer 4, 5 or the layers 4, 5 with the conductive paths 3 are applied to the surface of the profile.

Layer 4.5 may be self-adhesive or applied to the profile surface through other form of gluing or adhesion. Mounting profiles 1,2 can also prefabricated already provided with the conductive tracks 3 on insulating layers 5, which layers 5 can then be made in any way. Then it is also possible to on different integrate insulating layer 5 with the mounting profile 1,2 itself as one component of this.

As shown in Figures 1 and 2, the conductive paths 3 are placed on top the profile fl changes 6.7 and also below these fl changes if desired.

Alternatively or as a combination, leading courses are also placed on the bottom of the profile 8. A conductive path 3 does not have to run in the whole of the profile 1,2 extent.

Insulating layer 4, 5 with conductive webs 3 is so wide that it covers only one flange 6 or both flanges 6,7 or the bottom 8 of the profile or the whole of the profile width or any combination of these variants.

In another variant of mounting profiles with conductive paths, they are made leading circuits of the type printed circuit board for electronic components. Also in in this variant, the conductive paths constitute 3 conductive strands or surfaces on one insulating layer 4 which is applied to the mounting profile.

Utilized mounting profiles in connection with the present invention can of course show completely different appearances than those shown in Figures 1 and 2.

The inventive idea is applicable to any profile cross-section also with for example fl er than 2 fl ans.

Claims (1)

466 778 4 PATENT REQUIREMENTS 1. Mounting profile (1, 2) - for fixing and supporting terminals and / or electronic devices at frameworks or corresponding support members - for fixing at least one terminal and / or electronic device at the mounting profile itself (1, 2), where resp. terminal block or electronic unit is directly attached to the mounting profile (1, 2) by means of fastening means which are locked at one end (6, 7) on the mounting profile (1, 2), characterized in that the mounting profile (1, 2) has on its surface a or several electrically conductive paths (3) applied to an electrically insulating layer (4, 5). Mounting profile according to claim 1, characterized in that the insulation between conductive tracks (3) and profile (1, 2) consists of one or more insulating layers (4, 5) coated with electrically conductive strands, which strands form one or more of electrically insulated conductor tracks (3) from the profile and that the insulating layers (4, 5) in the form of discs or foils are applied to the surface of the mounting profile (1, 2). Mounting profile according to Claim 2, characterized in that the conductive tracks (3) are located on either one of the profile ends (6) or the profile ends (6, 7) or the bottom (8) of the profile or on any combination of these parts. Mounting profile according to Claim 3, characterized in that the insulating layer in the form of a foil (4) with conductive webs (3) is self-adhesive. Mounting profile according to Claim 2, characterized in that the insulating layer (4, 5) with conductive webs (3) covers either all or parts of the width of the mounting profile (1, 2). Mounting profile according to claim 1, characterized in that the profile is prefabricated and where the profile blank, insulating layer (5) and conductive tracks (3) constitute an integrated unit with conductive tracks along all or parts of the length of the profile. Mounting profile according to Claim 1, characterized in that the profile's conductive paths (3) constitute a communication or current supply or voltage supply or electrical connection medium for terminals mounted on the profile (1, 2) and said terminals with or without electronics built into the terminals. 5,466,778 Mounting profile according to Claim 1, characterized in that the profile's conductive paths (3) and insulating layers (4, 5) are realized by one or two printed circuit boards applied to the surface of the mounting profile (1, 2).