SE451590B - SELF-CUTTING EPOXIPLAST, EPOXY HEART COMPOSITION AND USE THEREOF FOR COUPLING AND INSULATION OF ELECTRICAL CONDENSERS - Google Patents
SELF-CUTTING EPOXIPLAST, EPOXY HEART COMPOSITION AND USE THEREOF FOR COUPLING AND INSULATION OF ELECTRICAL CONDENSERSInfo
- Publication number
- SE451590B SE451590B SE8306597A SE8306597A SE451590B SE 451590 B SE451590 B SE 451590B SE 8306597 A SE8306597 A SE 8306597A SE 8306597 A SE8306597 A SE 8306597A SE 451590 B SE451590 B SE 451590B
- Authority
- SE
- Sweden
- Prior art keywords
- weight
- epoxy resin
- diglycidyl ether
- epoxy
- resin
- Prior art date
Links
- 239000000203 mixture Substances 0.000 title claims description 23
- 239000004593 Epoxy Substances 0.000 title claims description 12
- 238000009413 insulation Methods 0.000 title claims description 6
- 230000008878 coupling Effects 0.000 title 1
- 238000010168 coupling process Methods 0.000 title 1
- 238000005859 coupling reaction Methods 0.000 title 1
- 239000003822 epoxy resin Substances 0.000 claims description 30
- 229920000647 polyepoxide Polymers 0.000 claims description 30
- 229920005989 resin Polymers 0.000 claims description 25
- 239000011347 resin Substances 0.000 claims description 25
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 claims description 19
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims description 14
- JAYXSROKFZAHRQ-UHFFFAOYSA-N n,n-bis(oxiran-2-ylmethyl)aniline Chemical compound C1OC1CN(C=1C=CC=CC=1)CC1CO1 JAYXSROKFZAHRQ-UHFFFAOYSA-N 0.000 claims description 12
- 229930185605 Bisphenol Natural products 0.000 claims description 11
- 239000003990 capacitor Substances 0.000 claims description 11
- VEORPZCZECFIRK-UHFFFAOYSA-N 3,3',5,5'-tetrabromobisphenol A Chemical compound C=1C(Br)=C(O)C(Br)=CC=1C(C)(C)C1=CC(Br)=C(O)C(Br)=C1 VEORPZCZECFIRK-UHFFFAOYSA-N 0.000 claims description 10
- 239000004033 plastic Substances 0.000 claims description 10
- 229920003023 plastic Polymers 0.000 claims description 10
- 150000008064 anhydrides Chemical class 0.000 claims description 7
- 239000007795 chemical reaction product Substances 0.000 claims description 7
- 238000005538 encapsulation Methods 0.000 claims description 6
- 239000004848 polyfunctional curative Substances 0.000 claims description 2
- 238000009434 installation Methods 0.000 claims 1
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 5
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 description 5
- 229910052794 bromium Inorganic materials 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- PAYRUJLWNCNPSJ-UHFFFAOYSA-N Aniline Chemical compound NC1=CC=CC=C1 PAYRUJLWNCNPSJ-UHFFFAOYSA-N 0.000 description 4
- MUTGBJKUEZFXGO-OLQVQODUSA-N (3as,7ar)-3a,4,5,6,7,7a-hexahydro-2-benzofuran-1,3-dione Chemical compound C1CCC[C@@H]2C(=O)OC(=O)[C@@H]21 MUTGBJKUEZFXGO-OLQVQODUSA-N 0.000 description 3
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 description 3
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical class C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 3
- 239000011342 resin composition Substances 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 2
- 238000005470 impregnation Methods 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- UZDBWHMHPZZCNE-UHFFFAOYSA-N 2-benzyl-n,n-dimethylaniline Chemical compound CN(C)C1=CC=CC=C1CC1=CC=CC=C1 UZDBWHMHPZZCNE-UHFFFAOYSA-N 0.000 description 1
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical class C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 1
- 229920000297 Rayon Polymers 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- LWIHDJKSTIGBAC-UHFFFAOYSA-K potassium phosphate Substances [K+].[K+].[K+].[O-]P([O-])([O-])=O LWIHDJKSTIGBAC-UHFFFAOYSA-K 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
- H01G2/12—Protection against corrosion
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/226—Mixtures of di-epoxy compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/28—Di-epoxy compounds containing acyclic nitrogen atoms
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/30—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/40—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/20—Dielectrics using combinations of dielectrics from more than one of groups H01G4/02 - H01G4/06
- H01G4/22—Dielectrics using combinations of dielectrics from more than one of groups H01G4/02 - H01G4/06 impregnated
- H01G4/221—Dielectrics using combinations of dielectrics from more than one of groups H01G4/02 - H01G4/06 impregnated characterised by the composition of the impregnant
Landscapes
- Chemical & Material Sciences (AREA)
- Power Engineering (AREA)
- Engineering & Computer Science (AREA)
- Medicinal Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Manufacturing & Machinery (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Organic Insulating Materials (AREA)
Description
15 20 25 30 35 451 590 krävs att hartset består av molekyler med n nära 0. Med användning av begreppet epoxiekvivalent bör värdet ligga under ca 200. It is required that the resin consist of molecules with n close to 0. Using the term epoxy equivalent, the value should be below about 200.
Man har förut även använt bromerade epoxihartser för att ge epoxiplasten självslocknande egenskaper. På marknaden finns sådana hartser med en bromhalt av ca 44-49 vikti. En så hög halt av brom är dock inte nödvändig för att man skall erhål- la en härdad självslocknande plast med t.ex. hexahydroftal- syraanhydrid som hårdare. En avgörande nackdel med dessa högbromerade epoxihartser är deras höga viskositet. För att inom rimlig tid kunna utföra kapslings- och impregnerings- processerna bör viskositeten ligga under 400 mPas och helst kring 150 mPas eller därunder.Brominated epoxy resins have previously also been used to give the epoxy plastic self-extinguishing properties. There are such resins on the market with a bromine content of about 44-49 weight. However, such a high content of bromine is not necessary in order to obtain a hardened self-extinguishing plastic with e.g. hexahydrophthalic anhydride as harder. A crucial disadvantage of these highly brominated epoxy resins is their high viscosity. In order to be able to carry out the encapsulation and impregnation processes within a reasonable time, the viscosity should be below 400 mPas and preferably around 150 mPas or less.
Försök att använda högbromerat harts av ovannämnt slag i blandning med lågvisköst obromerat harts (< 200 epoxiekvi- valenter) av typen diglycidyleter av bisfenol A, till en bromhalt av ca 20% har gett en härdad plast med hexahydro- ftalsyraanhydrid som hårdare, vilken plast visserligen ger något sämre men godtagbara isolationsegenskaper och godtag- bar självslockningsgrad. Viskositeten på blandningen är aaek auaeies för hög (ca zooo mPas vid 2s°c) för att nämnda processer skall ta rimlig tid i anspråk. Man skulle kunna tänka sig att man värmde på en sådan hartsblandning för att sänka viskositeten. I så fall måste hartsblandningen upp- värmas till ca 60°C för att viskositeten skall ligga kring 150 mPas. Denna höga temperatur för dock med sig stora pro- blem. Avsevärda mängder hårdare kommer att avdunsta, vilket förrycker sammansättningen på hartsblandningen och ger be- läggningar på kallare ytor. Vidare ökar viskositeten snabbt vid rumstemperatur, vilket gör avrinningsprocesser efter fyllning av gjutformar långsamma och besvärliga. Hög tempera- tur gör dessutom att viskositeten ökar snabbare med tiden till följd av begynnande härdning.Attempts to use high brominated resin of the above kind in admixture with low viscosity unbrominated resin (<200 epoxy equivalents) of the type diglycidyl ether of bisphenol A, to a bromine content of about 20% have given a hardened plastic with hexahydrophthalic anhydride as harder, which plastic admittedly gives slightly worse but acceptable insulation properties and acceptable degree of self-extinguishing. The viscosity of the mixture is aaek auaeies too high (about zooo mPas at 2s ° c) for the said processes to take a reasonable time. One could imagine heating such a resin mixture to lower the viscosity. In this case, the resin mixture must be heated to about 60 ° C for the viscosity to be around 150 mPas. However, this high temperature brings with it major problems. Significant amounts of harder will evaporate, which disturbs the composition of the resin mixture and gives coatings on colder surfaces. Furthermore, the viscosity increases rapidly at room temperature, which makes drainage processes after filling molds slow and cumbersome. High temperatures also mean that the viscosity increases more rapidly over time as a result of incipient curing.
Redogörelse för uppfinningen Målet för uppfinningen var därför att utveckla en epoxi- _ ,.....,.,.._...v. . ï-zifsi 10 15 20 25 30 35 451 590 hartskomposition, som uppvisar nöjaktiga viskositetsegen- skaper vid rumstemperatur eller däromkring och som sam- tidigt ger en härdad produkt, som väl uppfyller alla krav som kan ställas på elektriska kondensatorer inklusive goda självslocknande egenskaper, och detta utan att behöva ut- veckla på annat sätt uppbyggda syntetiska hartser för an- vändning som utgångskomponenter än sådana, som redan finns på marknaden. ' Det har nu överraskande visat sig och häri består uppfin- ningen, att nämnda mål kan uppnås om man i en blandning av bromerade och obromerade epoxihartser av nämnt slag helt el- ler företrädesvis delvis ersätter det obromerade epoxihartset med ett annat epoxiharts nämligen N,N'-diglycidylanilin.Disclosure of the Invention The object of the invention was therefore to develop an epoxy- _, .....,., .._... v. . ï-zifsi 10 15 20 25 30 35 451 590 resin composition, which exhibits satisfactory viscosity properties at room temperature or thereabouts and at the same time gives a cured product which well meets all the requirements that can be placed on electrical capacitors including good self-extinguishing properties, and this without having to develop differently constructed synthetic resins for use as starting components than those already on the market. It has now surprisingly been found, and herein lies the invention, that said object can be achieved if in a mixture of brominated and unbrominated epoxy resins of said kind completely or preferably partially replace the unbrominated epoxy resin with another epoxy resin namely N, N '-diglycidylaniline.
Härigenom kan viskositeten avsevärt reduceras utan att den härdade produktens elektriska och självslocknande egenskaper försämras.As a result, the viscosity can be considerably reduced without deteriorating the electrical and self-extinguishing properties of the cured product.
Uppfinningen avser sålunda en självslocknande, härdad epoxi- plast, som kännetecknas av att den utgöres av reaktionspro- dukten mellan a) ca 40-52 vikt% bromerat epoxiharts på basis av diglycidyl- eter av tetrabrombisfenol A, b) ca 50-0 vikt% obromerat epoxiharts på basis av diglycidyl- eter av en bisfenol, c) ca 10-48 vikt% diglycidylanilinharts och d) en anhydrid som hårdare.The invention thus relates to a self-extinguishing, cured epoxy plastic, which is characterized in that it consists of the reaction product between a) about 40-52% by weight of brominated epoxy resin based on diglycidyl ether of tetrabromobisphenol A, b) about 50-0% by weight obromerated epoxy resin based on diglycidyl ether of a bisphenol, c) about 10-48% by weight of diglycidylaniline resin and d) an anhydride as harder.
Enligt en föredragen utföringsform är epoxiplasten reak- tionsprodukten mellan a) ca 43,5-46,5 vikt% bromerat epoxiharts på basis av di- glycidyleter av tetrabrombisfenol A, b) ca 41.5-15 vikt% obromerat epoxiharts på basis av di- glycidyleter av en bisfenol, ' c) ca 15-38,5 vikt% diglycidylanilinharts och d) en anhydrid som härdareß' Uppfinningen avser vidare en epoxihartskomposition härdbar med en anhydrid, som kännetecknas av att den väsentligen 10 15 20 25 30 35 451 590 består av a) ca 40-52 vikt% bromerat epoxiharts på basis av diglycidyl- eter av tetrabrombisfenol A, b) ca 50-0 vikt% obromerat epoxiharts på basis av diglycidyl- eter av en bisfenol och c) ca 10-48 vikt% diglycidylanilinharts, räknat på komposi- tionen.According to a preferred embodiment, the epoxy resin is the reaction product between a) about 43.5-46.5% by weight of brominated epoxy resin based on diglycidyl ether of tetrabromobisphenol A, b) about 41.5-15% by weight of unbrominated epoxy resin based on diglycidyl ether The invention further relates to an epoxy resin composition curable with an anhydride, which is characterized in that it consists essentially of a bisphenol, c) about 15-38.5% by weight of diglycidylaniline resin and d) an anhydride which cures. a) about 40-52% by weight of brominated epoxy resin based on diglycidyl ether of tetrabromobisphenol A, b) about 50-0% by weight of brominated epoxy resin based on diglycidyl ether of a bisphenol and c) about 10-48% by weight of diglycidylaniline resin, calculated on the composition.
Enligt en föredragen utföringsform består epoxihartskomposi- tionen väsentligen av a) ca 43,5-46,5 vikt% bromerat epoxiharts på basis av di- glycidyleter av tetrabrombisfenol A, b) ca 41,5-15 vikt% obromerat epoxiharts på basis av di-_ glycidyleter av en bisfenol och c) ca 15-38,5 vikt% diglycidylanilinharts.According to a preferred embodiment, the epoxy resin composition consists essentially of a) about 43.5-46.5% by weight of brominated epoxy resin based on di-glycidyl ether of tetrabromobisphenol A, b) about 41.5-15% by weight of unbrominated epoxy resin based on di glycidyl ether of a bisphenol and c) about 15-38.5% by weight of diglycidylaniline resin.
Uppfinningen avser slutligen användningen av dessa harts- kompositioner och plaster för elektriska ändamål, särskilt elektriska kondensatorer.Finally, the invention relates to the use of these resin compositions and plastics for electrical purposes, in particular electrical capacitors.
Med bromerat epoxiharts på basis av diglycidyleter av tetrabrombisfenol A skall enligt uppfinningen förstås reak- tionsprodukten i alkalisk miljö mellan en epihalohydrin, företrädesvis epiklorhydrin, och tetrabrombisfenol A, med en bromhalt av ca 44-49 vikt%.According to the invention, brominated epoxy resin based on diglycidyl ether of tetrabromobisphenol A is to be understood as meaning the reaction product in an alkaline environment between an epihalohydrin, preferably epichlorohydrin, and tetrabromobisphenol A, having a bromine content of about 44-49% by weight.
Med obromerat epoxiharts på basis av diglycidyleter av en bisfenol skall enligt uppfinningen förstås reaktionsproduk- ten i alkalisk miljö mellan en epihalohydrin, företrädesvis epiklorhydrin, och en bisfenol, som kan vara bisfenol A el- ler en godtycklig blandning, företrädesvis S0 - 50, av bis- fenol A och F, med epoxiekvivalenter av högst ca 200.According to the invention, an unbromated epoxy resin based on diglycidyl ether of a bisphenol is to be understood as meaning the reaction product in an alkaline environment between an epihalohydrin, preferably epichlorohydrin, and a bisphenol, which may be bisphenol A or any mixture, preferably SO-50, of bis phenols A and F, with epoxy equivalents of not more than about 200.
Med diglycidylanilinharts skall förstås reaktionsprodukten i alkalisk miljö mellan en epihalohydrin, företrädesvis epi- klorhydrin, och ani1in.Detta harts kan även benämnas N,N'- -bisglycidylanilin.By diglycidylaniline resin is meant the reaction product in an alkaline environment between an epihalohydrin, preferably epichlorohydrin, and aniline. This resin may also be referred to as N, N'-bisglycidylaniline.
Härdaren är en anhydrid, t ex en hexahydroftalsyraanhydrid. s 10 15 20 25 30 35 451 590 5 Vid användningen i kompositionen av mindre än ca 10 vikt% diglycidylanilinharts uppnás ej den önskade viskositets- effekten medan vid användning av mer än ca 50 vikt% därav de självslocknande egenskaperna hos den härdade plasten blir otillräckliga.The hardener is an anhydride, for example a hexahydrophthalic anhydride. When used in the composition of less than about 10% by weight of diglycidylaniline resin, the desired viscosity effect is not achieved, while when more than about 50% by weight thereof, the self-extinguishing properties of the cured plastic become insufficient.
Uppfinningen belyses nedan med ett antal icke begränsande exempel på väl fungerande utföringsformer av uppfinningen tillsammans med jämförelseexempel enligt känd teknik.The invention is illustrated below with a number of non-limiting examples of well-functioning embodiments of the invention together with comparative examples according to prior art.
Exempel Ett antal hartskompcsitioner A till I bereddes med en sammansättning enligt nedanstående tabell.Example A number of resin compositions A to I were prepared with a composition according to the table below.
Bromerat ( ) Obromerat (2) Diglycid 1- Hexahydroftal- epoxiharts epoxiharts anilin(3 syraanhydrid (viktdelar) (viktdelar) (viktdelar) (viktdelar) A(känd 43,5 56,5 0 65 teknik) B 43,5 28 28,5 78 C 45 20 35 80 D 45 10 45 84 E 50 0 50 84 F 43,5 41,5 15 72 G 46,5 15 38,5 80 H 40 50 10 70 I 48 12 40 80 (1) "DER 542” från Dow Chemical; epoxiekv. 350-355; mjuk- ningspunkt enligt Durran 55,5-62,S°C; bromhalt 44-49 vikt% "Lekutherm " X-18 från Bayer AG; epoxiekv. 175-185; viskositefn 2s°c -aooo-sooo mpas, so°c 130-140 mms.Bromerate () Obromerate (2) Diglycid 1- Hexahydrophthal epoxy resin epoxy resin aniline (3 acid anhydride (parts by weight) (parts by weight) (parts by weight) A (known 43.5 56.5 0 65 technique) B 43.5 28 28, 5 78 C 45 20 35 80 D 45 10 45 84 E 50 0 50 84 F 43.5 41.5 15 72 G 46.5 15 38.5 80 H 40 50 10 70 I 48 12 40 80 (1) "DER 542 "from Dow Chemical; epoxy ref. 350-355; softening point according to Durran 55.5-62, 5 ° C; bromine content 44-49% by weight" Lekutherm "X-18 from Bayer AG; epoxy ref. 175-185; viscose material 2s ° c -aooo-sooo mpas, so ° c 130-140 mms.
"Lekutherm " X-50 från Bayer AG; epoxiekv. 110-130; viskasitet 2s°c= 110-1so mpas. (2) (3) Viskøsiteten för kompositionerna A till E vid rumstempera- tur bestämdes liksom den temperatur vid vilken viskositeten understeg 150 mPas. Resultaten framgår av nedanstående tabell 1. 10 15 20 25 30 35 451 590 Tabell 1 Q Viskositet i mPas vid 25°C samt den temperatur vid vilken viskositeten för färdiga hartsblandníngar understeg 150 mPas. 3 0 Hartsblandning Viskositet (mPas) _§ A 2000 55 B 540 d 45 C 480 44 D 320 38 E 340 37 Som framgår av tabellen ger utbyte av obromerat epoxiharts mot diglycidylanilinharts en successivt sänkt viskositet med möjlighet att utföra impregnerings- och kapslingspro- cesser för elektriska kondensatorer vid allt lägre tempera- tur. Utbyte av obromerat epoxiharts helt mot diglycidylanilin ger lägsta viskositeten."Lekutherm" X-50 from Bayer AG; epoxy equ. 110-130; viscosity 2s ° c = 110-1so mpas. (2) (3) The viscosity of compositions A to E at room temperature was determined as well as the temperature at which the viscosity was less than 150 mPas. The results are shown in Table 1 below. 10 15 20 25 30 35 451 590 Table 1 Q Viscosity in mPas at 25 ° C and the temperature at which the viscosity of finished resin mixtures fell below 150 mPas. Resin mixture Viscosity (mPas) _§ A 2000 55 B 540 d 45 C 480 44 D 320 38 E 340 37 As shown in the table, the replacement of unbrominated epoxy resin with diglycidylaniline resin results in a gradually reduced viscosity with the possibility of performing impregnation and encapsulation processes. for electrical capacitors at ever lower temperatures. Replacement of unbrominated epoxy resin completely with diglycidylaniline gives the lowest viscosity.
Av de olika hartsblandningarna A till I framställdes prov- kroppar och testades enligt föreskrifterna i IEC 695.2.2. avseende självslocknande egenskaper. Hartsblandningarna för- sattes med 0,3 viktdel bensyldimetylanilin som accelerator och härdningen ägde rum under 20 timmar vid 90°C. Samtliga prover var självslocknande.Samples were prepared from the various resin mixtures A to I and tested in accordance with the regulations in IEC 695.2.2. regarding self-extinguishing properties. The resin mixtures were charged with 0.3 part by weight of benzyldimethylaniline as accelerator and the curing took place for 20 hours at 90 ° C. All samples were self-extinguishing.
Vidare tillverkades av varje hartsblandning 10 st metall- papperskondensatorer på 4700 pF, 250 V växelström. Kapaci- tansen, förlustfaktorn tan 6 och isolationsresistansen upp- mättes. Därefter utsattes kondensatorerna för fukt enligt IEC Publ. 68-2-3 (1969), Test Ca: 'Dampheat, steady state" och kondensatorerna mättes på samma sätt som före fuktpro- vet. Samtliga kondensatorer uppvisade godtagbara värden så- väl före som efter fuktprov och någon signifikant skillnad * mellan de olika hartsblandningarna kunde ej iakttas. lf!Furthermore, each resin mixture produced 10 metal paper capacitors of 4700 pF, 250 V AC. The capacitance, the loss factor tan 6 and the insulation resistance were measured. Thereafter, the capacitors were exposed to moisture according to IEC Publ. 68-2-3 (1969), Test Ca: 'Dampheat, steady state' and the capacitors were measured in the same way as before the moisture test. All capacitors showed acceptable values both before and after moisture tests and no significant difference * between the different resin mixtures could be observed.
Claims (4)
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| SE8306597A SE451590B (en) | 1983-11-30 | 1983-11-30 | SELF-CUTTING EPOXIPLAST, EPOXY HEART COMPOSITION AND USE THEREOF FOR COUPLING AND INSULATION OF ELECTRICAL CONDENSERS |
| DE19843442375 DE3442375A1 (en) | 1983-11-30 | 1984-11-20 | Self-extinguishing epoxy plastics, epoxy resin composition, and the use thereof for electrical purposes |
| IT8423743A IT1213250B (en) | 1983-11-30 | 1984-11-26 | EPOXY AND THEIR USE FOR EPOXY PLASTIC MATERIAL ELECTRICAL PURPOSES. SELF-EXTINGUISHING, COMPOUND IN RESIN |
| NL8403604A NL8403604A (en) | 1983-11-30 | 1984-11-27 | Self-extinguishing EPOXY PLASTICS, EPOXY RESIN COMPOSITION AND USE THEREOF FOR ELECTRICAL PURPOSES. |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| SE8306597A SE451590B (en) | 1983-11-30 | 1983-11-30 | SELF-CUTTING EPOXIPLAST, EPOXY HEART COMPOSITION AND USE THEREOF FOR COUPLING AND INSULATION OF ELECTRICAL CONDENSERS |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| SE8306597D0 SE8306597D0 (en) | 1983-11-30 |
| SE8306597L SE8306597L (en) | 1985-05-31 |
| SE451590B true SE451590B (en) | 1987-10-19 |
Family
ID=20353518
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SE8306597A SE451590B (en) | 1983-11-30 | 1983-11-30 | SELF-CUTTING EPOXIPLAST, EPOXY HEART COMPOSITION AND USE THEREOF FOR COUPLING AND INSULATION OF ELECTRICAL CONDENSERS |
Country Status (4)
| Country | Link |
|---|---|
| DE (1) | DE3442375A1 (en) |
| IT (1) | IT1213250B (en) |
| NL (1) | NL8403604A (en) |
| SE (1) | SE451590B (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CA2017613A1 (en) * | 1989-05-29 | 1990-11-29 | Kiyomi Yasuda | Heat-resistant, flame-retardant epoxy resin compositions |
| JPH0762063A (en) * | 1993-08-30 | 1995-03-07 | Yuka Shell Epoxy Kk | Epoxy resin composition |
| JP4260407B2 (en) * | 2001-03-30 | 2009-04-30 | 東芝ライテック株式会社 | Electrical equipment |
-
1983
- 1983-11-30 SE SE8306597A patent/SE451590B/en not_active IP Right Cessation
-
1984
- 1984-11-20 DE DE19843442375 patent/DE3442375A1/en not_active Withdrawn
- 1984-11-26 IT IT8423743A patent/IT1213250B/en active
- 1984-11-27 NL NL8403604A patent/NL8403604A/en not_active Application Discontinuation
Also Published As
| Publication number | Publication date |
|---|---|
| SE8306597L (en) | 1985-05-31 |
| SE8306597D0 (en) | 1983-11-30 |
| NL8403604A (en) | 1985-06-17 |
| IT1213250B (en) | 1989-12-14 |
| DE3442375A1 (en) | 1985-06-05 |
| IT8423743A0 (en) | 1984-11-26 |
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