SE376113B - - Google Patents
Info
- Publication number
- SE376113B SE376113B SE988371A SE988371A SE376113B SE 376113 B SE376113 B SE 376113B SE 988371 A SE988371 A SE 988371A SE 988371 A SE988371 A SE 988371A SE 376113 B SE376113 B SE 376113B
- Authority
- SE
- Sweden
Links
Classifications
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02K—DYNAMO-ELECTRIC MACHINES
- H02K44/00—Machines in which the dynamo-electric interaction between a plasma or flow of conductive liquid or of fluid-borne conductive or magnetic particles and a coil system or magnetic field converts energy of mass flow into electrical energy or vice versa
- H02K44/02—Electrodynamic pumps
- H02K44/04—Conduction pumps
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/71—Means for bonding not being attached to, or not being formed on, the surface to be connected
- H01L24/72—Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4018—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
- H01L2023/4025—Base discrete devices, e.g. presspack, disc-type transistors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01011—Sodium [Na]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01015—Phosphorus [P]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01018—Argon [Ar]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01019—Potassium [K]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01027—Cobalt [Co]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01029—Copper [Cu]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01039—Yttrium [Y]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01047—Silver [Ag]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01055—Cesium [Cs]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01074—Tungsten [W]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01075—Rhenium [Re]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/0132—Binary Alloys
- H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1203—Rectifying Diode
- H01L2924/12036—PN diode
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1301—Thyristor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US6032970A | 1970-08-03 | 1970-08-03 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SE376113B true SE376113B (OSRAM) | 1975-05-05 |
Family
ID=22028819
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SE988371A SE376113B (OSRAM) | 1970-08-03 | 1971-08-02 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US3654528A (OSRAM) |
| DE (1) | DE2137164A1 (OSRAM) |
| FR (1) | FR2101205B1 (OSRAM) |
| GB (1) | GB1338055A (OSRAM) |
| SE (1) | SE376113B (OSRAM) |
Families Citing this family (59)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3800190A (en) * | 1970-11-02 | 1974-03-26 | Bbc Brown Boveri & Cie | Cooling system for power semiconductor devices |
| GB1381778A (en) * | 1972-06-08 | 1975-01-29 | Cableform Ltd | Semiconductor clamping means |
| US3838303A (en) * | 1973-03-21 | 1974-09-24 | Electric Machinery Mfg Co | Mounting apparatus for disc-type semiconductors |
| US3972063A (en) * | 1973-10-19 | 1976-07-27 | Mitsubishi Denki Kabushiki Kaisha | Vapor cooled semiconductor device enclosed in an envelope having a compression mechanism for holding said device within said envelope |
| JPS5241146B2 (OSRAM) * | 1974-01-30 | 1977-10-17 | ||
| US4010489A (en) * | 1975-05-19 | 1977-03-01 | General Motors Corporation | High power semiconductor device cooling apparatus and method |
| US4258383A (en) * | 1978-12-22 | 1981-03-24 | Rca Corporation | Minimum pressure drop liquid cooled structure for a semiconductor device |
| DE2855493A1 (de) * | 1978-12-22 | 1980-07-03 | Bbc Brown Boveri & Cie | Leistungs-halbleiterbauelement |
| EP0075036B1 (de) * | 1981-09-19 | 1986-10-15 | BROWN, BOVERI & CIE Aktiengesellschaft Mannheim | Leistungshalbleiterbauelement für Flüssigkeitskühlung |
| US4646131A (en) * | 1983-01-28 | 1987-02-24 | Mitsubishi Denki Kabushiki Kaisha | Rectifier device |
| DE3709006C1 (en) * | 1987-03-19 | 1988-07-28 | Licentia Gmbh | Electrically insulating heat tube |
| US5040051A (en) * | 1988-12-05 | 1991-08-13 | Sundstrand Corporation | Hydrostatic clamp and method for compression type power semiconductors |
| DE4226727C2 (de) * | 1992-08-10 | 1994-07-14 | Aeg Westinghouse Transport | Anordnung für die Fixierung von druckkontaktierbaren Scheibenzellenhalbleitern durch Vormontage |
| US6158501A (en) * | 1993-10-20 | 2000-12-12 | Valmet Corporation | Thermally insulated roll and insulation assembly for a thermoroll |
| US5533567A (en) * | 1994-12-14 | 1996-07-09 | The Regents Of The University Of California | Method and apparatus for uniform heating and cooling |
| US5923086A (en) * | 1997-05-14 | 1999-07-13 | Intel Corporation | Apparatus for cooling a semiconductor die |
| US6019165A (en) * | 1998-05-18 | 2000-02-01 | Batchelder; John Samuel | Heat exchange apparatus |
| US6021844A (en) * | 1998-06-03 | 2000-02-08 | Batchelder; John Samuel | Heat exchange apparatus |
| WO2005061972A1 (en) * | 2002-12-06 | 2005-07-07 | Nanocoolers, Inc. | Cooling of electronics by electrically conducting fluids |
| US6658861B1 (en) * | 2002-12-06 | 2003-12-09 | Nanocoolers, Inc. | Cooling of high power density devices by electrically conducting fluids |
| US20040234392A1 (en) * | 2003-05-22 | 2004-11-25 | Nanocoolers Inc. | Magnetohydrodynamic pumps for non-conductive fluids |
| US20050099775A1 (en) * | 2003-11-12 | 2005-05-12 | Himanshu Pokharna | Pumped liquid cooling for computer systems using liquid metal coolant |
| US20050160752A1 (en) * | 2004-01-23 | 2005-07-28 | Nanocoolers, Inc. | Apparatus and methodology for cooling of high power density devices by electrically conducting fluids |
| US20050189089A1 (en) * | 2004-02-27 | 2005-09-01 | Nanocoolers Inc. | Fluidic apparatus and method for cooling a non-uniformly heated power device |
| US7348665B2 (en) * | 2004-08-13 | 2008-03-25 | Intel Corporation | Liquid metal thermal interface for an integrated circuit device |
| US20060073023A1 (en) * | 2004-09-17 | 2006-04-06 | Nanocoolers, Inc. | Integrated electromagnetic pump and power supply module |
| US20060073024A1 (en) * | 2004-09-17 | 2006-04-06 | Nanocoolers, Inc. | Series gated secondary loop power supply configuration for electromagnetic pump and integral combination thereof |
| CN2783219Y (zh) * | 2004-11-24 | 2006-05-24 | 温耀生 | 热电制冷模块 |
| US7475551B2 (en) | 2004-12-23 | 2009-01-13 | Nanocoolers, Inc. | System employing temporal integration of thermoelectric action |
| US7293416B2 (en) * | 2004-12-23 | 2007-11-13 | Nanocoolers, Inc. | Counterflow thermoelectric configuration employing thermal transfer fluid in closed cycle |
| US7296417B2 (en) * | 2004-12-23 | 2007-11-20 | Nanocoolers, Inc. | Thermoelectric configuration employing thermal transfer fluid flow(s) with recuperator |
| US20060144566A1 (en) * | 2004-12-30 | 2006-07-06 | Jensen Kip B | System and method for cooling an integrated circuit device by electromagnetically pumping a fluid |
| US7516778B2 (en) * | 2005-09-06 | 2009-04-14 | Sun Microsystems, Inc. | Magneto-hydrodynamic heat sink |
| US8617913B2 (en) * | 2006-08-23 | 2013-12-31 | Rockwell Collins, Inc. | Alkali silicate glass based coating and method for applying |
| US8174830B2 (en) | 2008-05-06 | 2012-05-08 | Rockwell Collins, Inc. | System and method for a substrate with internal pumped liquid metal for thermal spreading and cooling |
| US8581108B1 (en) | 2006-08-23 | 2013-11-12 | Rockwell Collins, Inc. | Method for providing near-hermetically coated integrated circuit assemblies |
| US8084855B2 (en) * | 2006-08-23 | 2011-12-27 | Rockwell Collins, Inc. | Integrated circuit tampering protection and reverse engineering prevention coatings and methods |
| US7915527B1 (en) | 2006-08-23 | 2011-03-29 | Rockwell Collins, Inc. | Hermetic seal and hermetic connector reinforcement and repair with low temperature glass coatings |
| US8076185B1 (en) | 2006-08-23 | 2011-12-13 | Rockwell Collins, Inc. | Integrated circuit protection and ruggedization coatings and methods |
| US8166645B2 (en) | 2006-08-23 | 2012-05-01 | Rockwell Collins, Inc. | Method for providing near-hermetically coated, thermally protected integrated circuit assemblies |
| US8637980B1 (en) | 2007-12-18 | 2014-01-28 | Rockwell Collins, Inc. | Adhesive applications using alkali silicate glass for electronics |
| US7408778B2 (en) * | 2006-09-11 | 2008-08-05 | International Business Machines Corporation | Heat sinks for dissipating a thermal load |
| BRPI0806533B1 (pt) * | 2007-01-26 | 2018-10-09 | Inductotherm Corp. | dispositivo de fixação de semicondutor para fixar um conjunto semicondutor e método de fixar um conjunto semicondutor |
| US8363189B2 (en) * | 2007-12-18 | 2013-01-29 | Rockwell Collins, Inc. | Alkali silicate glass for displays |
| US8205337B2 (en) * | 2008-09-12 | 2012-06-26 | Rockwell Collins, Inc. | Fabrication process for a flexible, thin thermal spreader |
| US8017872B2 (en) * | 2008-05-06 | 2011-09-13 | Rockwell Collins, Inc. | System and method for proportional cooling with liquid metal |
| US8650886B2 (en) * | 2008-09-12 | 2014-02-18 | Rockwell Collins, Inc. | Thermal spreader assembly with flexible liquid cooling loop having rigid tubing sections and flexible tubing sections |
| US8616266B2 (en) * | 2008-09-12 | 2013-12-31 | Rockwell Collins, Inc. | Mechanically compliant thermal spreader with an embedded cooling loop for containing and circulating electrically-conductive liquid |
| US8221089B2 (en) * | 2008-09-12 | 2012-07-17 | Rockwell Collins, Inc. | Thin, solid-state mechanism for pumping electrically conductive liquids in a flexible thermal spreader |
| US20100071883A1 (en) * | 2008-09-08 | 2010-03-25 | Jan Vetrovec | Heat transfer device |
| DK2161745T3 (da) * | 2008-09-08 | 2012-10-29 | Converteam Technology Ltd | Stakkede arrangementer indeholdende halvlederindretninger |
| US8119040B2 (en) * | 2008-09-29 | 2012-02-21 | Rockwell Collins, Inc. | Glass thick film embedded passive material |
| US8479820B2 (en) * | 2010-05-05 | 2013-07-09 | Schlumberger Technology Corporation | Dissipating heat from a downhole heat generating device |
| US9435915B1 (en) | 2012-09-28 | 2016-09-06 | Rockwell Collins, Inc. | Antiglare treatment for glass |
| US20150345519A1 (en) * | 2014-05-25 | 2015-12-03 | Jan Vetrovec | Magnetohydrodynamic actuator |
| JP6784197B2 (ja) * | 2017-03-09 | 2020-11-11 | 株式会社デンソー | 電力変換装置 |
| US10879151B2 (en) * | 2018-12-28 | 2020-12-29 | Texas Instruments Incorporated | Semiconductor package with liquid metal conductors |
| FR3119681B1 (fr) | 2021-02-09 | 2022-12-23 | Psa Automobiles Sa | Procede d’autorisation ou de refus de mesure d’un defaut d’isolation d’une batterie |
| CN114390772B (zh) * | 2021-12-29 | 2024-03-08 | 江苏密特科智能装备制造有限公司 | 一种半导体设备精密组件 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB806596A (en) * | 1955-04-01 | 1958-12-31 | Gen Electric Co Ltd | Improvements in or relating to semi-conductor devices |
| NL262292A (OSRAM) * | 1960-04-08 | |||
| US3365620A (en) * | 1966-06-13 | 1968-01-23 | Ibm | Circuit package with improved modular assembly and cooling apparatus |
| US3361195A (en) * | 1966-09-23 | 1968-01-02 | Westinghouse Electric Corp | Heat sink member for a semiconductor device |
| US3400543A (en) * | 1966-10-31 | 1968-09-10 | Peter G. Ross | Semi-conductor cooling means |
-
1970
- 1970-08-03 US US3654528D patent/US3654528A/en not_active Expired - Lifetime
-
1971
- 1971-07-24 DE DE19712137164 patent/DE2137164A1/de active Pending
- 1971-08-02 SE SE988371A patent/SE376113B/xx unknown
- 1971-08-03 GB GB3645171A patent/GB1338055A/en not_active Expired
- 1971-08-03 FR FR7128463A patent/FR2101205B1/fr not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| DE2137164A1 (de) | 1972-02-10 |
| FR2101205A1 (OSRAM) | 1972-03-31 |
| FR2101205B1 (OSRAM) | 1977-03-18 |
| GB1338055A (en) | 1973-11-21 |
| US3654528A (en) | 1972-04-04 |