SE371538B - - Google Patents
Info
- Publication number
- SE371538B SE371538B SE300271A SE300271A SE371538B SE 371538 B SE371538 B SE 371538B SE 300271 A SE300271 A SE 300271A SE 300271 A SE300271 A SE 300271A SE 371538 B SE371538 B SE 371538B
- Authority
- SE
- Sweden
Links
Classifications
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- H10W72/30—
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D99/00—Subject matter not provided for in other groups of this subclass
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- H10W40/778—
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- H10W70/20—
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- H10W74/121—
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- H10W74/131—
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- H10W72/073—
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- H10W72/07336—
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- H10W72/07353—
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- H10W72/07354—
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- H10W72/334—
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- H10W72/347—
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- H10W72/352—
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- H10W72/354—
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- H10W72/931—
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- H10W74/00—
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- H10W90/736—
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US1771370A | 1970-03-09 | 1970-03-09 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SE371538B true SE371538B (enExample) | 1974-11-18 |
Family
ID=21784137
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SE300271A SE371538B (enExample) | 1970-03-09 | 1971-03-09 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US3706915A (enExample) |
| CA (1) | CA926031A (enExample) |
| DE (1) | DE2109191A1 (enExample) |
| FR (1) | FR2081794A1 (enExample) |
| GB (1) | GB1352946A (enExample) |
| IE (1) | IE34944B1 (enExample) |
| SE (1) | SE371538B (enExample) |
Families Citing this family (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3797103A (en) * | 1970-05-04 | 1974-03-19 | Gen Electric | Machine and process for semiconductor device assembly |
| US3860949A (en) * | 1973-09-12 | 1975-01-14 | Rca Corp | Semiconductor mounting devices made by soldering flat surfaces to each other |
| US3934336A (en) * | 1975-01-13 | 1976-01-27 | Burroughs Corporation | Electronic package assembly with capillary bridging connection |
| US4100589A (en) * | 1975-07-17 | 1978-07-11 | Harris Corporation | Microcircuit device including hybrid circuit carrier |
| DE2556469C3 (de) * | 1975-12-15 | 1978-09-07 | Siemens Ag, 1000 Berlin Und 8000 Muenchen | Halbleiterbauelement mit Druckkontakt |
| US4270138A (en) * | 1979-03-02 | 1981-05-26 | General Electric Company | Enhanced thermal transfer package for a semiconductor device |
| US4339768A (en) * | 1980-01-18 | 1982-07-13 | Amp Incorporated | Transistors and manufacture thereof |
| DE3040867C2 (de) * | 1980-10-30 | 1985-01-17 | Telefunken electronic GmbH, 7100 Heilbronn | Verfahren zur Herstellung einer Halbleiteranordnung |
| JPS586143A (ja) * | 1981-07-02 | 1983-01-13 | Matsushita Electronics Corp | 半導体装置 |
| GB2102833B (en) * | 1981-07-31 | 1984-08-01 | Philips Electronic Associated | Lead-indium-silver alloy for use in semiconductor devices |
| US4862246A (en) * | 1984-09-26 | 1989-08-29 | Hitachi, Ltd. | Semiconductor device lead frame with etched through holes |
| US5753542A (en) * | 1985-08-02 | 1998-05-19 | Semiconductor Energy Laboratory Co., Ltd. | Method for crystallizing semiconductor material without exposing it to air |
| US5318651A (en) * | 1991-11-27 | 1994-06-07 | Nec Corporation | Method of bonding circuit boards |
| WO2002058876A1 (de) * | 2001-01-26 | 2002-08-01 | Robert Bosch Gmbh | Verfahren zur herstellung einer verbindung, vorrichtung und leistungshalbleiterbauelement |
| US20050253159A1 (en) * | 2004-04-28 | 2005-11-17 | Creswick Steven B | Semiconductor (LED) chip attachment |
| US7109587B1 (en) * | 2004-05-25 | 2006-09-19 | National Semiconductor Corporation | Apparatus and method for enhanced thermal conductivity packages for high powered semiconductor devices |
| US20060213957A1 (en) * | 2005-03-26 | 2006-09-28 | Addington Cary G | Conductive trace formation via wicking action |
| US10163762B2 (en) * | 2015-06-10 | 2018-12-25 | Vishay General Semiconductor Llc | Lead frame with conductive clip for mounting a semiconductor die with reduced clip shifting |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3062981A (en) * | 1959-02-24 | 1962-11-06 | Rca Corp | Electron tube stem conductors having improved surface wettability |
| US3291578A (en) * | 1963-11-04 | 1966-12-13 | Gen Electric | Metallized semiconductor support and mounting structure |
| DE1295040B (de) * | 1964-09-18 | 1969-05-14 | Siemens Ag | Thermoelektrische Anordnung und Verfahren zu ihrer Herstellung |
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1970
- 1970-03-09 US US3706915D patent/US3706915A/en not_active Expired - Lifetime
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1971
- 1971-02-11 IE IE159/71A patent/IE34944B1/xx unknown
- 1971-02-24 CA CA106129A patent/CA926031A/en not_active Expired
- 1971-02-26 DE DE19712109191 patent/DE2109191A1/de active Pending
- 1971-03-08 FR FR7107959A patent/FR2081794A1/fr not_active Withdrawn
- 1971-03-09 SE SE300271A patent/SE371538B/xx unknown
- 1971-04-19 GB GB2358171A patent/GB1352946A/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| IE34944L (en) | 1971-09-09 |
| DE2109191A1 (de) | 1971-09-23 |
| GB1352946A (en) | 1974-05-15 |
| IE34944B1 (en) | 1975-10-01 |
| US3706915A (en) | 1972-12-19 |
| CA926031A (en) | 1973-05-08 |
| FR2081794A1 (enExample) | 1971-12-10 |