SE364808B - - Google Patents
Info
- Publication number
- SE364808B SE364808B SE12975/70A SE1297570A SE364808B SE 364808 B SE364808 B SE 364808B SE 12975/70 A SE12975/70 A SE 12975/70A SE 1297570 A SE1297570 A SE 1297570A SE 364808 B SE364808 B SE 364808B
- Authority
- SE
- Sweden
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Classifications
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- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
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- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/482—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body
- H01L23/4824—Pads with extended contours, e.g. grid structure, branch structure, finger structure
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- H01L24/02—Bonding areas ; Manufacturing methods related thereto
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- H01L2224/056—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
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Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Electrodes Of Semiconductors (AREA)
- Wire Bonding (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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US86103669A | 1969-09-25 | 1969-09-25 |
Publications (1)
Publication Number | Publication Date |
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SE364808B true SE364808B (en) | 1974-03-04 |
Family
ID=25334689
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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SE12975/70A SE364808B (en) | 1969-09-25 | 1970-09-24 |
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Country | Link |
---|---|
JP (1) | JPS4827496B1 (en) |
BE (1) | BE756528A (en) |
DE (1) | DE2046505A1 (en) |
ES (1) | ES383728A1 (en) |
FR (1) | FR2062533A5 (en) |
GB (1) | GB1280096A (en) |
NL (1) | NL7014101A (en) |
SE (1) | SE364808B (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4665424A (en) * | 1984-03-30 | 1987-05-12 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
-
0
- BE BE756528D patent/BE756528A/en unknown
-
1970
- 1970-09-17 GB GB44444/70A patent/GB1280096A/en not_active Expired
- 1970-09-19 ES ES383728A patent/ES383728A1/en not_active Expired
- 1970-09-21 DE DE19702046505 patent/DE2046505A1/en active Pending
- 1970-09-23 FR FR7034419A patent/FR2062533A5/fr not_active Expired
- 1970-09-24 NL NL7014101A patent/NL7014101A/xx unknown
- 1970-09-24 SE SE12975/70A patent/SE364808B/xx unknown
- 1970-09-24 JP JP45083710A patent/JPS4827496B1/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
FR2062533A5 (en) | 1971-06-25 |
GB1280096A (en) | 1972-07-05 |
ES383728A1 (en) | 1973-06-01 |
BE756528A (en) | 1971-03-01 |
JPS4827496B1 (en) | 1973-08-23 |
DE2046505A1 (en) | 1971-04-01 |
NL7014101A (en) | 1971-03-29 |