SE339372BSE572466ASE572466ASE339372BSE 339372 BSE339372 BSE 339372BSE 572466 ASE572466 ASE 572466ASE 572466 ASE572466 ASE 572466ASE 339372 BSE339372 BSE 339372B
Authority
SE
Sweden
Application number
SE572466A
Inventor
R Zeblisky
F Schneble
J Mccormack
Original Assignee
Photocircuits Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Photocircuits CorpfiledCriticalPhotocircuits Corp
Publication of SE339372BpublicationCriticalpatent/SE339372B/xx
C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
C23C18/31—Coating with metals
C23C18/38—Coating with copper
C23C18/40—Coating with copper using reducing agents
Verfahren und anlage zur wiedergewinnung von im abwasser von anlagen zur chemischen oberflaechenbehandlung befindlichen metallen und anderen wertstoffen