SE326774B - - Google Patents

Info

Publication number
SE326774B
SE326774B SE17634/67A SE1763467A SE326774B SE 326774 B SE326774 B SE 326774B SE 17634/67 A SE17634/67 A SE 17634/67A SE 1763467 A SE1763467 A SE 1763467A SE 326774 B SE326774 B SE 326774B
Authority
SE
Sweden
Application number
SE17634/67A
Inventor
K Siebertz
E Hofmeister
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag filed Critical Siemens Ag
Publication of SE326774B publication Critical patent/SE326774B/xx

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D1/00—Resistors, capacitors or inductors
    • H10D1/60—Capacitors
    • H10D1/62—Capacitors having potential barriers
    • H10D1/64—Variable-capacitance diodes, e.g. varactors 
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D99/00—Subject matter not provided for in other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5453—Dispositions of bond wires connecting between multiple bond pads on a chip, e.g. daisy chain
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00—Metal treatment
    • Y10S148/049—Equivalence and options
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00—Metal treatment
    • Y10S148/145—Shaped junctions
SE17634/67A 1966-12-22 1967-12-21 SE326774B (OSRAM)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DES0107543 1966-12-22

Publications (1)

Publication Number Publication Date
SE326774B true SE326774B (OSRAM) 1970-08-03

Family

ID=7528179

Family Applications (1)

Application Number Title Priority Date Filing Date
SE17634/67A SE326774B (OSRAM) 1966-12-22 1967-12-21

Country Status (6)

Country Link
US (1) US3487272A (OSRAM)
CH (1) CH472118A (OSRAM)
FR (1) FR1547296A (OSRAM)
GB (1) GB1197969A (OSRAM)
NL (1) NL6711612A (OSRAM)
SE (1) SE326774B (OSRAM)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3740617A (en) * 1968-11-20 1973-06-19 Matsushita Electronics Corp Semiconductor structure and method of manufacturing same
US3864818A (en) * 1969-05-06 1975-02-11 Philips Corp Method of making a target for a camera tube with a mosaic of regions forming rectifying junctions
CA957782A (en) * 1970-01-26 1974-11-12 Theodore Kamprath Capacitor structure for integrated circuits
US4009456A (en) * 1970-10-07 1977-02-22 General Microwave Corporation Variable microwave attenuator
US3761783A (en) * 1972-02-02 1973-09-25 Sperry Rand Corp Duel-mesa ring-shaped high frequency diode
FR2214172B3 (OSRAM) * 1973-01-11 1976-11-05 Inst For Mikrovagsteknik
GB2105106A (en) * 1981-07-17 1983-03-16 Clarion Co Ltd Variable capaciter
JPH11501166A (ja) * 1995-12-21 1999-01-26 フィリップス エレクトロニクス ネムローゼ フェンノートシャップ エピタキシャルpn接合を備えた半導体装置の製造方法
US6001723A (en) * 1997-12-24 1999-12-14 National Semiconductor Corporation Application of wire bond loop as integrated circuit package component interconnect

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2985805A (en) * 1958-03-05 1961-05-23 Rca Corp Semiconductor devices
US3150999A (en) * 1961-02-17 1964-09-29 Transitron Electronic Corp Radiant energy transducer
FR1317256A (fr) * 1961-12-16 1963-02-08 Teszner Stanislas Perfectionnements aux dispositifs semi-conducteurs dits tecnetrons multibâtonnets
US3309553A (en) * 1963-08-16 1967-03-14 Varian Associates Solid state radiation emitters

Also Published As

Publication number Publication date
GB1197969A (en) 1970-07-08
DE1564789A1 (de) 1970-01-08
NL6711612A (OSRAM) 1968-06-24
FR1547296A (fr) 1968-11-22
US3487272A (en) 1969-12-30
CH472118A (de) 1969-04-30
DE1564789B2 (de) 1975-08-07

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