SE318757B - - Google Patents

Info

Publication number
SE318757B
SE318757B SE15998/67A SE1599867A SE318757B SE 318757 B SE318757 B SE 318757B SE 15998/67 A SE15998/67 A SE 15998/67A SE 1599867 A SE1599867 A SE 1599867A SE 318757 B SE318757 B SE 318757B
Authority
SE
Sweden
Application number
SE15998/67A
Inventor
W Clauss
Original Assignee
Schering Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE1967SC040161 external-priority patent/DE1255437B/de
Application filed by Schering Ag filed Critical Schering Ag
Publication of SE318757B publication Critical patent/SE318757B/xx

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C23C18/40—Coating with copper using reducing agents

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
SE15998/67A 1967-02-01 1967-11-21 SE318757B (xx)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE1967SC040161 DE1255437B (de) 1967-02-01 1967-02-01 Stabilisiertes reduktives Kupferbad
DESC040160 1967-02-01

Publications (1)

Publication Number Publication Date
SE318757B true SE318757B (xx) 1969-12-15

Family

ID=25993451

Family Applications (1)

Application Number Title Priority Date Filing Date
SE15998/67A SE318757B (xx) 1967-02-01 1967-11-21

Country Status (4)

Country Link
US (1) US3492135A (xx)
CH (1) CH503799A (xx)
GB (1) GB1219201A (xx)
SE (1) SE318757B (xx)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH533172A (de) * 1969-05-22 1973-01-31 Schering Ag Stabilisiertes reduktives Nickelbad
DE2053860C3 (de) * 1970-10-29 1980-11-06 Schering Ag Saures wäßriges Bad zur galvanischen Abscheidung glänzender Kupferüberzüge
US3915718A (en) * 1972-10-04 1975-10-28 Schering Ag Chemical silver bath
US4304849A (en) * 1980-05-16 1981-12-08 Western Electric Co., Inc. Methods of depositing metallic copper on substrates
US4908242A (en) * 1986-10-31 1990-03-13 Kollmorgen Corporation Method of consistently producing a copper deposit on a substrate by electroless deposition which deposit is essentially free of fissures
US11073451B2 (en) 2011-12-19 2021-07-27 Kode Biotech Limited Biocompatible method of functionalising substrates with inert surfaces

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2732336A (en) * 1956-01-24 Electroplating composition for copper
US2881121A (en) * 1957-03-14 1959-04-07 Hanson Van Winkle Munning Co Electroplating

Also Published As

Publication number Publication date
CH503799A (de) 1971-02-28
US3492135A (en) 1970-01-27
GB1219201A (en) 1971-01-13

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