CH503799A - Stabilisiertes, reduktives Kupferbad und dessen Verwendung - Google Patents

Stabilisiertes, reduktives Kupferbad und dessen Verwendung

Info

Publication number
CH503799A
CH503799A CH1636667A CH1636667A CH503799A CH 503799 A CH503799 A CH 503799A CH 1636667 A CH1636667 A CH 1636667A CH 1636667 A CH1636667 A CH 1636667A CH 503799 A CH503799 A CH 503799A
Authority
CH
Switzerland
Prior art keywords
stabilized
copper bath
reductive copper
reductive
bath
Prior art date
Application number
CH1636667A
Other languages
English (en)
Inventor
Wolfgang Dr Clauss
Original Assignee
Schering Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE1967SC040161 external-priority patent/DE1255437B/de
Application filed by Schering Ag filed Critical Schering Ag
Publication of CH503799A publication Critical patent/CH503799A/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C23C18/40—Coating with copper using reducing agents

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
CH1636667A 1967-02-01 1967-11-22 Stabilisiertes, reduktives Kupferbad und dessen Verwendung CH503799A (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE1967SC040161 DE1255437B (de) 1967-02-01 1967-02-01 Stabilisiertes reduktives Kupferbad
DESC040160 1967-02-01

Publications (1)

Publication Number Publication Date
CH503799A true CH503799A (de) 1971-02-28

Family

ID=25993451

Family Applications (1)

Application Number Title Priority Date Filing Date
CH1636667A CH503799A (de) 1967-02-01 1967-11-22 Stabilisiertes, reduktives Kupferbad und dessen Verwendung

Country Status (4)

Country Link
US (1) US3492135A (de)
CH (1) CH503799A (de)
GB (1) GB1219201A (de)
SE (1) SE318757B (de)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH533172A (de) * 1969-05-22 1973-01-31 Schering Ag Stabilisiertes reduktives Nickelbad
DE2053860C3 (de) * 1970-10-29 1980-11-06 Schering Ag Saures wäßriges Bad zur galvanischen Abscheidung glänzender Kupferüberzüge
US3915718A (en) * 1972-10-04 1975-10-28 Schering Ag Chemical silver bath
US4304849A (en) * 1980-05-16 1981-12-08 Western Electric Co., Inc. Methods of depositing metallic copper on substrates
US4908242A (en) * 1986-10-31 1990-03-13 Kollmorgen Corporation Method of consistently producing a copper deposit on a substrate by electroless deposition which deposit is essentially free of fissures
US11073451B2 (en) 2011-12-19 2021-07-27 Kode Biotech Limited Biocompatible method of functionalising substrates with inert surfaces

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2732336A (en) * 1956-01-24 Electroplating composition for copper
US2881121A (en) * 1957-03-14 1959-04-07 Hanson Van Winkle Munning Co Electroplating

Also Published As

Publication number Publication date
SE318757B (de) 1969-12-15
GB1219201A (en) 1971-01-13
US3492135A (en) 1970-01-27

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Legal Events

Date Code Title Description
PL Patent ceased