SE316840B - - Google Patents

Info

Publication number
SE316840B
SE316840B SE1519466A SE1519466A SE316840B SE 316840 B SE316840 B SE 316840B SE 1519466 A SE1519466 A SE 1519466A SE 1519466 A SE1519466 A SE 1519466A SE 316840 B SE316840 B SE 316840B
Authority
SE
Sweden
Application number
SE1519466A
Inventor
I Kristensen
Original Assignee
Danfoss As
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Danfoss As filed Critical Danfoss As
Publication of SE316840B publication Critical patent/SE316840B/xx

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/86Types of semiconductor device ; Multistep manufacturing processes therefor controllable only by variation of the electric current supplied, or only the electric potential applied, to one or more of the electrodes carrying the current to be rectified, amplified, oscillated or switched
    • H01L29/861Diodes
    • H01L29/866Zener diodes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10Details of semiconductor or other solid state devices to be connected
    • H01L2924/11Device type
    • H01L2924/12Passive devices, e.g. 2 terminal devices
    • H01L2924/1203Rectifying Diode
    • H01L2924/12035Zener diode
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10Details of semiconductor or other solid state devices to be connected
    • H01L2924/11Device type
    • H01L2924/12Passive devices, e.g. 2 terminal devices
    • H01L2924/1204Optical Diode
    • H01L2924/12043Photo diode
SE1519466A 1965-11-09 1966-11-07 SE316840B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DED0048608 1965-11-09

Publications (1)

Publication Number Publication Date
SE316840B true SE316840B (en) 1969-11-03

Family

ID=7051302

Family Applications (1)

Application Number Title Priority Date Filing Date
SE1519466A SE316840B (en) 1965-11-09 1966-11-07

Country Status (9)

Country Link
AT (1) AT265370B (en)
BE (1) BE688709A (en)
CH (1) CH455053A (en)
DE (1) DE1489809B2 (en)
DK (1) DK117440B (en)
FR (1) FR1498908A (en)
GB (1) GB1158120A (en)
NL (1) NL6615110A (en)
SE (1) SE316840B (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1276791A (en) * 1969-01-22 1972-06-07 Tokyo Shibaura Electric Co Semiconductor device
FR2405576A1 (en) * 1977-10-07 1979-05-04 Lignes Telegraph Telephon Protective circuit for Schottky power diode - uses parallel-low power Schottky diode whose avalanche voltage is lower than limit voltage of main diode
FR2505070B1 (en) * 1981-01-16 1986-04-04 Suwa Seikosha Kk NON-LINEAR DEVICE FOR A LIQUID CRYSTAL DISPLAY PANEL AND METHOD FOR MANUFACTURING SUCH A DISPLAY PANEL
DE3136730A1 (en) * 1981-09-16 1983-03-31 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Semiconductor diode
KR101116766B1 (en) 2004-06-10 2012-02-22 엘지전자 주식회사 Production Method of Zenor Diode
KR100927256B1 (en) * 2004-07-09 2009-11-16 엘지전자 주식회사 Method of fabricating a zener diode integrated sub-mount

Also Published As

Publication number Publication date
DE1489809A1 (en) 1970-10-01
CH455053A (en) 1968-04-30
GB1158120A (en) 1969-07-16
BE688709A (en) 1967-03-31
DK117440B (en) 1970-04-27
DE1489809B2 (en) 1974-07-04
NL6615110A (en) 1967-05-10
AT265370B (en) 1968-10-10
FR1498908A (en) 1967-10-20

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