SE314571B - - Google Patents
Info
- Publication number
- SE314571B SE314571B SE2821/66A SE282166A SE314571B SE 314571 B SE314571 B SE 314571B SE 2821/66 A SE2821/66 A SE 2821/66A SE 282166 A SE282166 A SE 282166A SE 314571 B SE314571 B SE 314571B
- Authority
- SE
- Sweden
Links
Classifications
- 
        - C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C8/00—Solid state diffusion of only non-metal elements into metallic material surfaces; Chemical surface treatment of metallic material by reaction of the surface with a reactive gas, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
- C23C8/06—Solid state diffusion of only non-metal elements into metallic material surfaces; Chemical surface treatment of metallic material by reaction of the surface with a reactive gas, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using gases
- C23C8/08—Solid state diffusion of only non-metal elements into metallic material surfaces; Chemical surface treatment of metallic material by reaction of the surface with a reactive gas, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using gases only one element being applied
- C23C8/10—Oxidising
 
- 
        - C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
 
- 
        - C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/01—Alloys based on copper with aluminium as the next major constituent
 
- 
        - C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/02—Alloys based on copper with tin as the next major constituent
 
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Laminated Bodies (AREA)
- Manufacture Of Alloys Or Alloy Compounds (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title | 
|---|---|---|---|
| US436746A US3341369A (en) | 1965-03-03 | 1965-03-03 | Copper base alloys and process for preparing same | 
Publications (1)
| Publication Number | Publication Date | 
|---|---|
| SE314571B true SE314571B (en:Method) | 1969-09-08 | 
Family
ID=23733663
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date | 
|---|---|---|---|
| SE2821/66A SE314571B (en:Method) | 1965-03-03 | 1966-03-03 | 
Country Status (8)
| Country | Link | 
|---|---|
| US (1) | US3341369A (en:Method) | 
| BE (1) | BE698501A (en:Method) | 
| BR (1) | BR6677512D0 (en:Method) | 
| CH (1) | CH479707A (en:Method) | 
| DE (1) | DE1533342B1 (en:Method) | 
| GB (1) | GB1135313A (en:Method) | 
| NL (1) | NL6602702A (en:Method) | 
| SE (1) | SE314571B (en:Method) | 
Families Citing this family (31)
| Publication number | Priority date | Publication date | Assignee | Title | 
|---|---|---|---|---|
| US3475227A (en) * | 1966-10-04 | 1969-10-28 | Olin Mathieson | Copper base alloys and process for preparing same | 
| US4113475A (en) * | 1976-04-09 | 1978-09-12 | Kennecott Copper Corporation | Tarnish resistant copper alloy | 
| US4330599A (en) * | 1980-06-09 | 1982-05-18 | Olin Corporation | Composite material | 
| US4362262A (en) * | 1980-06-09 | 1982-12-07 | Olin Corporation | Method of forming a composite material | 
| US4410927A (en) * | 1982-01-21 | 1983-10-18 | Olin Corporation | Casing for an electrical component having improved strength and heat transfer characteristics | 
| US4461924A (en) * | 1982-01-21 | 1984-07-24 | Olin Corporation | Semiconductor casing | 
| US4491622A (en) * | 1982-04-19 | 1985-01-01 | Olin Corporation | Composites of glass-ceramic to metal seals and method of making the same | 
| US4570337A (en) * | 1982-04-19 | 1986-02-18 | Olin Corporation | Method of assembling a chip carrier | 
| US5014159A (en) * | 1982-04-19 | 1991-05-07 | Olin Corporation | Semiconductor package | 
| US4851615A (en) * | 1982-04-19 | 1989-07-25 | Olin Corporation | Printed circuit board | 
| US4866571A (en) * | 1982-06-21 | 1989-09-12 | Olin Corporation | Semiconductor package | 
| US4429022A (en) | 1982-06-28 | 1984-01-31 | Olin Corporation | Composite material having improved bond strength | 
| US4500028A (en) * | 1982-06-28 | 1985-02-19 | Olin Corporation | Method of forming a composite material having improved bond strength | 
| US4480262A (en) * | 1982-07-15 | 1984-10-30 | Olin Corporation | Semiconductor casing | 
| US4594770A (en) * | 1982-07-15 | 1986-06-17 | Olin Corporation | Method of making semiconductor casing | 
| US4656499A (en) * | 1982-08-05 | 1987-04-07 | Olin Corporation | Hermetically sealed semiconductor casing | 
| US4682414A (en) * | 1982-08-30 | 1987-07-28 | Olin Corporation | Multi-layer circuitry | 
| US4524238A (en) * | 1982-12-29 | 1985-06-18 | Olin Corporation | Semiconductor packages | 
| US4500605A (en) * | 1983-02-17 | 1985-02-19 | Olin Corporation | Electrical component forming process | 
| GB2152082A (en) * | 1983-12-27 | 1985-07-31 | United Technologies Corp | Enhancement of superalloy resistance to environmental degradation | 
| US4577056A (en) * | 1984-04-09 | 1986-03-18 | Olin Corporation | Hermetically sealed metal package | 
| US4862323A (en) * | 1984-04-12 | 1989-08-29 | Olin Corporation | Chip carrier | 
| US4542259A (en) * | 1984-09-19 | 1985-09-17 | Olin Corporation | High density packages | 
| US4853491A (en) * | 1984-10-03 | 1989-08-01 | Olin Corporation | Chip carrier | 
| US4769345A (en) * | 1987-03-12 | 1988-09-06 | Olin Corporation | Process for producing a hermetically sealed package for an electrical component containing a low amount of oxygen and water vapor | 
| US4897508A (en) * | 1988-02-10 | 1990-01-30 | Olin Corporation | Metal electronic package | 
| US5043222A (en) * | 1988-03-17 | 1991-08-27 | Olin Corporation | Metal sealing glass composite with matched coefficients of thermal expansion | 
| US4952531A (en) * | 1988-03-17 | 1990-08-28 | Olin Corporation | Sealing glass for matched sealing of copper and copper alloys | 
| US4967260A (en) * | 1988-05-04 | 1990-10-30 | International Electronic Research Corp. | Hermetic microminiature packages | 
| US5047371A (en) * | 1988-09-02 | 1991-09-10 | Olin Corporation | Glass/ceramic sealing system | 
| JP3774472B2 (ja) * | 1994-02-17 | 2006-05-17 | ユナイテッド テクノロジーズ コーポレイション | チタン合金のための耐酸化性コーティング | 
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title | 
|---|---|---|---|---|
| US2192495A (en) * | 1933-06-17 | 1940-03-05 | Heraeus Vacuumschmelze Ag | Beryllium-copper alloys | 
| DE672170C (de) * | 1933-06-18 | 1941-05-06 | Heraeus Vacuumschmelze Akt Ges | Verguetbare Beryllium-Kupfer-Legierungen | 
| US2075002A (en) * | 1933-08-03 | 1937-03-23 | American Brass Co | Copper-silicon-aluminum alloys | 
| US2057003A (en) * | 1934-10-17 | 1936-10-13 | Bugher Clarence | Concealed roofing nail | 
| US2075003A (en) * | 1936-07-30 | 1937-03-23 | Daniel R Hull | Copper-silicon-aluminum alloy | 
| US2237774A (en) * | 1940-07-23 | 1941-04-08 | Chase Brass & Copper Co | Treating silicon copper-base alloys | 
| DE823351C (de) * | 1943-09-08 | 1951-12-03 | Ici Ltd | Elektrischer Widerstandskoerper | 
| DE833858C (de) * | 1949-09-02 | 1952-03-13 | Isabellen Huette Heusler Komm | Kupfer-Silizium-Legierung | 
| US3259491A (en) * | 1963-05-21 | 1966-07-05 | Olin Mathieson | Copper base alloys and process for preparing same | 
- 
        1965
        - 1965-03-03 US US436746A patent/US3341369A/en not_active Expired - Lifetime
 
- 
        1966
        - 1966-02-24 GB GB8191/66A patent/GB1135313A/en not_active Expired
- 1966-03-02 NL NL6602702A patent/NL6602702A/xx unknown
- 1966-03-03 BR BR177512/66A patent/BR6677512D0/pt unknown
- 1966-03-03 SE SE2821/66A patent/SE314571B/xx unknown
- 1966-03-03 DE DE19661533342 patent/DE1533342B1/de not_active Withdrawn
- 1966-03-03 CH CH302666A patent/CH479707A/de not_active IP Right Cessation
 
- 
        1967
        - 1967-05-16 BE BE698501D patent/BE698501A/xx unknown
 
Also Published As
| Publication number | Publication date | 
|---|---|
| DE1533342B1 (de) | 1970-12-23 | 
| GB1135313A (en) | 1968-12-04 | 
| BR6677512D0 (pt) | 1973-05-31 | 
| BE698501A (en:Method) | 1967-11-03 | 
| CH479707A (de) | 1969-10-15 | 
| NL6602702A (en:Method) | 1966-09-05 | 
| US3341369A (en) | 1967-09-12 |