SE218770C1 - - Google Patents

Info

Publication number
SE218770C1
SE218770C1 SE1186362A SE1186362A SE218770C1 SE 218770 C1 SE218770 C1 SE 218770C1 SE 1186362 A SE1186362 A SE 1186362A SE 1186362 A SE1186362 A SE 1186362A SE 218770 C1 SE218770 C1 SE 218770C1
Authority
SE
Sweden
Application number
SE1186362A
Other languages
Swedish (sv)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of SE218770C1 publication Critical patent/SE218770C1/sv

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25FPROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
    • C25F3/00Electrolytic etching or polishing
    • C25F3/02Etching
    • C25F3/12Etching of semiconducting materials
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Weting (AREA)
SE1186362A 1961-11-08 1962-11-05 SE218770C1 (en, 2012)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL271175 1961-11-08

Publications (1)

Publication Number Publication Date
SE218770C1 true SE218770C1 (en, 2012) 1968-02-13

Family

ID=19753400

Family Applications (1)

Application Number Title Priority Date Filing Date
SE1186362A SE218770C1 (en, 2012) 1961-11-08 1962-11-05

Country Status (7)

Country Link
BE (1) BE624483A (en, 2012)
CH (1) CH406442A (en, 2012)
DE (1) DE1464296B2 (en, 2012)
ES (1) ES282203A1 (en, 2012)
GB (1) GB953829A (en, 2012)
NL (1) NL271175A (en, 2012)
SE (1) SE218770C1 (en, 2012)

Also Published As

Publication number Publication date
DE1464296A1 (de) 1968-12-05
NL271175A (en, 2012)
GB953829A (en) 1964-04-02
DE1464296B2 (de) 1971-02-25
ES282203A1 (es) 1963-01-16
CH406442A (de) 1966-01-31
BE624483A (en, 2012)

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