SE0501667L - Contact element and contact device - Google Patents

Contact element and contact device

Info

Publication number
SE0501667L
SE0501667L SE0501667A SE0501667A SE0501667L SE 0501667 L SE0501667 L SE 0501667L SE 0501667 A SE0501667 A SE 0501667A SE 0501667 A SE0501667 A SE 0501667A SE 0501667 L SE0501667 L SE 0501667L
Authority
SE
Sweden
Prior art keywords
contact
contact layer
contact member
crystallites
nano
Prior art date
Application number
SE0501667A
Other languages
Swedish (sv)
Other versions
SE528908C2 (en
Inventor
Erik Lewin
Ola Wilhelmsson
Ulf Jansson
Original Assignee
Abb Research Ltd
Impact Coatings Ab
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Abb Research Ltd, Impact Coatings Ab filed Critical Abb Research Ltd
Priority to SE0501667A priority Critical patent/SE528908C2/en
Priority to EP06769579.1A priority patent/EP1934995B1/en
Priority to KR1020087003661A priority patent/KR101047829B1/en
Priority to JP2008521352A priority patent/JP4938774B2/en
Priority to US11/988,793 priority patent/US7709759B2/en
Priority to CN2006800257495A priority patent/CN101223616B/en
Priority to ES06769579.1T priority patent/ES2476841T3/en
Priority to PCT/SE2006/000769 priority patent/WO2007011276A1/en
Publication of SE0501667L publication Critical patent/SE0501667L/en
Publication of SE528908C2 publication Critical patent/SE528908C2/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H1/00—Contacts
    • H01H1/02—Contacts characterised by the material thereof
    • H01H1/021—Composite material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H1/00—Contacts
    • H01H1/02—Contacts characterised by the material thereof
    • H01H1/021—Composite material
    • H01H1/027—Composite material containing carbon particles or fibres
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/71—Means for bonding not being attached to, or not being formed on, the surface to be connected
    • H01L24/72—Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H1/00—Contacts
    • H01H1/12—Contacts characterised by the manner in which co-operating contacts engage
    • H01H1/36—Contacts characterised by the manner in which co-operating contacts engage by sliding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H2300/00—Orthogonal indexing scheme relating to electric switches, relays, selectors or emergency protective devices covered by H01H
    • H01H2300/036—Application nanoparticles, e.g. nanotubes, integrated in switch components, e.g. contacts, the switch itself being clearly of a different scale, e.g. greater than nanoscale
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H9/00—Details of switching devices, not covered by groups H01H1/00 - H01H7/00
    • H01H9/0005—Tap change devices
    • H01H9/0016—Contact arrangements for tap changers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01019—Potassium [K]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01041—Niobium [Nb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01047—Silver [Ag]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01055—Cesium [Cs]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Composite Materials (AREA)
  • Materials Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Contacts (AREA)
  • Carbon And Carbon Compounds (AREA)
  • Manufacture Of Switches (AREA)

Abstract

The element has a body (3) with one contact surface coated with a contact layer (4) which is applied against a contact member (2). The contact layer comprises a nanocomposite film having a matrix of amorphous carbon and crystallites of nano-size ranging in specific dimensions. Metal carbide is embedded into the contact layer for making an electric contact to the contact member which enables electric current to flow between the element and the contact member. An independent claim is also included for a sliding contact arrangement.
SE0501667A 2005-07-15 2005-07-15 Electric contact element for semiconductor device, has body with contact surface coated with contact layer having nanocomposite film with matrix of amorphous carbon, where metal carbide is embedded into contact layer SE528908C2 (en)

Priority Applications (8)

Application Number Priority Date Filing Date Title
SE0501667A SE528908C2 (en) 2005-07-15 2005-07-15 Electric contact element for semiconductor device, has body with contact surface coated with contact layer having nanocomposite film with matrix of amorphous carbon, where metal carbide is embedded into contact layer
EP06769579.1A EP1934995B1 (en) 2005-07-15 2006-06-22 A contact element and a contact arrangement
KR1020087003661A KR101047829B1 (en) 2005-07-15 2006-06-22 Contact elements and contact devices
JP2008521352A JP4938774B2 (en) 2005-07-15 2006-06-22 Contact element and contact device
US11/988,793 US7709759B2 (en) 2005-07-15 2006-06-22 Contact element and a contact arrangement
CN2006800257495A CN101223616B (en) 2005-07-15 2006-06-22 A contact element and a contact arrangement
ES06769579.1T ES2476841T3 (en) 2005-07-15 2006-06-22 A contact element and a contact set
PCT/SE2006/000769 WO2007011276A1 (en) 2005-07-15 2006-06-22 A contact element and a contact arrangement

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE0501667A SE528908C2 (en) 2005-07-15 2005-07-15 Electric contact element for semiconductor device, has body with contact surface coated with contact layer having nanocomposite film with matrix of amorphous carbon, where metal carbide is embedded into contact layer

Publications (2)

Publication Number Publication Date
SE0501667L true SE0501667L (en) 2007-01-16
SE528908C2 SE528908C2 (en) 2007-03-13

Family

ID=37728135

Family Applications (1)

Application Number Title Priority Date Filing Date
SE0501667A SE528908C2 (en) 2005-07-15 2005-07-15 Electric contact element for semiconductor device, has body with contact surface coated with contact layer having nanocomposite film with matrix of amorphous carbon, where metal carbide is embedded into contact layer

Country Status (4)

Country Link
JP (1) JP4938774B2 (en)
CN (1) CN101223616B (en)
ES (1) ES2476841T3 (en)
SE (1) SE528908C2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5306242B2 (en) * 2010-01-12 2013-10-02 株式会社東芝 Gas insulated switchgear

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1047867C (en) * 1996-01-29 1999-12-29 董元源 Electric copper-based silverless contact composite material with high flow welding resistance
JP3826453B2 (en) * 1996-09-10 2006-09-27 住友電気工業株式会社 Hard carbon film
JP3598195B2 (en) * 1997-03-07 2004-12-08 芝府エンジニアリング株式会社 Contact material
DE19903619C1 (en) * 1999-01-29 2000-06-08 Louis Renner Gmbh Powder metallurgical composite material, especially for high voltage vacuum switch contacts, comprises refractory solid solution or intermetallic phase grains embedded in a metal matrix
SE9904350D0 (en) * 1999-11-30 1999-11-30 Abb Ab A contact element and a contact arrangement
DE10104611A1 (en) * 2001-02-02 2002-08-14 Bosch Gmbh Robert Device for the ceramic-like coating of a substrate
JP2003231203A (en) * 2001-08-21 2003-08-19 Toshiba Corp Carbon film coated member
DE10261303B3 (en) * 2002-12-27 2004-06-24 Wieland-Werke Ag Electrically conducting composite material used in automotive applications as electrical contact components, such as connectors or connections, comprises a metal strip and a contact layer containing carbon powder and a further additive

Also Published As

Publication number Publication date
CN101223616A (en) 2008-07-16
ES2476841T3 (en) 2014-07-15
JP2009501420A (en) 2009-01-15
SE528908C2 (en) 2007-03-13
JP4938774B2 (en) 2012-05-23
CN101223616B (en) 2010-10-13

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